Application of thermally conductive materials in the power supply industry and successful cases
Update Time: Sep 14, 2023 Readership: 464
Contents
With the continuous deepening of international industrial transfer, China's informatization construction, and the continuous development of aviation, aerospace and military industries, the rapid development of downstream industries has a strong pull on the power supply industry. China's power supply industry market has ushered in unprecedented business opportunities.
In recent years, affected by the development of new energy vehicles and distributed power stations, the profitability of this industry has also been continuously improved. Nowadays, power supply has become a very important basic industry. As an indispensable equipment in electric equipment, its application market involves electronic electrical equipment, electronic testing equipment, control equipment, computer, household appliances and other electronic industries.
From daily life to cutting-edge technology, it is basically inseparable from the participation and support of power supply technology. With the continuous advancement of industrial 4.0 and 5G development, new requirements have been put forward for power supply technology, such as: shorter development cycle, smaller solution size, system and power supply heat dissipation problems, suppressing EMI noise and so on.
Although these are eternal topics in the power supply industry, they have more requirements in the new market. As a "giant" in the field of communication power supply and industrial customized power supply, Nucleus Zhongyuan Communication is also facing the challenge of power supply design in the 5G era. When providing small size, high efficiency and easy-to-use power modules, it urgently needs to solve the power supply heat dissipation problem:
Nowadays, the layout area is becoming more and more compact, and limited space poses new requirements for power supply heat dissipation, especially in harsh environments such as industry and base stations. Power supply is the heart of all electronic products, and 60% of the failure rate of electronic products comes from power supply.
Power Equipment Thermal Simulation
The main components of power supply (such as power transformer, rectifier diode, switch V-MOS tube, etc.) will generate too much heat during electrification process, which will cause components to not work normally or even destroy power supply. Therefore, temperature is one of the important factors affecting equipment reliability. Measures should be taken to limit component temperature rise to ensure normal operation of power supply and extend its service life.
Lintech Materials is committed to providing thermal insulation solutions for emerging power products from traditional power adapters, industrial power supplies, communication power supplies, LED power supplies, UPS power supplies to charging piles, DC-DC, DC-AC inverters.
Lintech Materials thermal conductivity materials in various types of power applications
In order to improve power supply heat dissipation efficiency, Lintech Materials provides a series of power heat dissipation design schemes for Nucleus Zhongyuan Communication, and develops a series of thermal interface materials favored by power industry: CP thermal pad, TSP17EB thermal insulation series products with low thermal resistance and high insulation performance as main characteristics and TSP-TG silicone thermal conductive potting gel series.
High-voltage MOS package has high voltage and large heat generation. It needs to add extra metal radiator or assemble to metal outer shell frame and other radiator devices for heat dissipation, otherwise there will be risk of burning or exploding. High insulation performance thermal interface material needs to be filled between MOS package and radiator to meet low thermal resistance and high insulation performance requirements.
Lintech Materials TSP17EB, TSP30EB, TC2000, TCK thermal insulation materials are high-performance thermal insulation materials based on fiberglass cloth and polyimide film as base materials. They have excellent tear resistance and tensile ability and excellent thermal conductivity and insulation performance (breakdown voltage greater than 4~6KV), widely used in MOS package and radiator.
TSP17EB is a heat-curing thermal insulation tape, which consists of high-performance thermally conductive low-modulus silicone resin compound coated on fiberglass carrier material and double-layer inner lining protective film. After 30sec@150psi normal temperature pressure and 6-8min@160℃ heating curing, shear strength can reach 1.4Mpa. This scheme eliminates screw assembly process of MOS tube and radiator, greatly reduces manufacturing cost, can realize automated production, and has high temperature resistance up to 200℃.
TSP-TG silicone thermal conductive potting gel series are widely used in power products for waterproof, dustproof, shockproof and magnetic core protection and thermal conductivity solutions. They have low density, low viscosity, good self-leveling, high thermal conductivity, easy repair and other excellent characteristics, widely used in power industry.
IGBT and Its Importance
In the field of new energy vehicles, IGBT is the core device of electric control system and DC charging pile, directly affecting the power release speed, acceleration ability and maximum speed of electric vehicles, and its importance is self-evident.
We can understand that the life and stability of IGBT directly affect the safety of electric vehicles, and its performance directly determines the cruising range of electric vehicles.
IGBT Module Heat Dissipation Scheme
IGBT module is a modular semiconductor product that is packaged by IGBT and FWD (freewheeling diode chip) through a specific circuit bridge. It belongs to high-power semiconductor components.
In general, IGBT module needs to withstand hundreds of amps of current, and switch up to thousands of times per second, with large loss. And it is located in the front car compartment with the motor, engine and other space-closed vehicles, heat is relatively concentrated.
IGBT is not afraid of short circuit, but especially "afraid of heat". If the temperature exceeds its junction temperature of 125℃, it will cause the module to burn out and affect the operation of the whole vehicle.
Temperature characteristic is an important indicator in IGBT module product design and reliability evaluation. In order to greatly improve its power density, heat dissipation performance and long-term reliability, efficient heat dissipation scheme is especially important.
So, how do thermal interface materials improve IGBT heat dissipation efficiency?
At present, the common heat dissipation methods for motor controllers are conduction heat dissipation.
When choosing thermal interface materials, it is recommended to fully consider various factors such as heat dissipation, insulation, shock absorption, anti-puncture, fastening and working environment of various components of power supply. And combine production cost budget to choose suitable thermal conductive material, so that the products produced can achieve the best cost performance. No matter what field you are in or what kind of heat dissipation problem you face, Lintech Materials can provide you with more convenient, reliable and economical thermal conductivity solutions.
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