Orders Over
$5000Intel 10M08DCF256I7G
256-pin BGA package
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Brands: Intel Corp
Mfr.Part #: 10M08DCF256I7G
Datasheet: 10M08DCF256I7G Datasheet (PDF)
Package/Case: 256-LBGA
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 3,894 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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10M08DCF256I7G General Description
Featuring four PLLs for clock synthesis and jitter reduction, the 10M08DCF256I7G offers flexibility in managing clock signals to meet the requirements of various applications. Its 420 user I/Os support different I/O standards, including LVDS and SSTL, enabling seamless connectivity to external devices. The device's security features, such as bitstream encryption and configuration protection, add an extra layer of protection for sensitive data and configurations
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Specifications
Parameter | Value | Parameter | Value |
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Case/Package | FBGA | Mount | Surface Mount |
Number of Pins | 256 | Max Operating Temperature | 100 °C |
Min Operating Temperature | -40 °C | Number of I/Os | 178 |
Number of Logic Blocks (LABs) | 500 | Number of Logic Elements/Cells | 8000 |
RAM Size | 47.3 kB |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The 10M08DCF256I7G chip is a field-programmable gate array (FPGA) developed by Intel. It has a capacity of 256 kilobytes and belongs to the MAX 10 series. The chip features 8,000 logic elements, a 10-bit analog-to-digital converter, and built-in flash memory for storing configuration files. It offers a flexible and customizable platform for various applications in the electronics industry.
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Features
The 10M08DCF256I7G is an Intel® MAX® 10 FPGA device with 10,268 logic elements, 31,936 registers, and 368 Kbits of embedded memory. It supports up to 32 multipliers and operates at a maximum speed of 308 MHz. The device also includes various I/O interfaces, ARM Cortex-M1 processor, and onboard flash memory. -
Pinout
The 10M08DCF256I7G is a Field Programmable Gate Array (FPGA) manufactured by Intel. It has a pin count of 256. The specific pin functions and their assignments can be found in the device datasheet provided by the manufacturer. -
Manufacturer
The manufacturer of the 10M08DCF256I7G is Intel Corporation. It is an American multinational technology company that specializes in the design and production of semiconductor chips and related products for various industries, including computer processors, networking hardware, and memory storage devices. -
Application Field
The 10M08DCF256I7G is a low-cost, low-power field-programmable gate array (FPGA) device. It can be used in various application areas, including industrial automation, motor control, communication systems, and smart energy management. Its versatility, low power consumption, and ability to be reprogrammed make it suitable for a wide range of embedded applications. -
Package
The package type of the 10M08DCF256I7G chip is BGA (Ball Grid Array), the form is FPGA (Field-Programmable Gate Array), and the size is 256 pins.
Datasheet PDF
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