Altera 5CSEBA2U19C8SN

Part points

• The 5CSEBA2U19C8SN is a high-performance FPGA (Field-Programmable Gate Array) chip from Intel Altera's Cyclone V series. It features 30,620 logic elements, 1,518 Kbits of embedded memory, and 144 DSP blocks, making it suitable for a wide range of applications requiring customizable hardware acceleration and processing capabilities.

• Equivalent

  The equivalent products of the 5CSEBA2U19C8SN chip are 5CSEBA2U19C8N, 5CSEBA2U19C6N, and 5CSEBA2U19A8N. These chips are also part of the Intel Cyclone V series and offer similar features and applications to the 5CSEBA2U19C8SN.

• Features

  1. Intel Cyclone V SE FPGA 2. 19,500 Logic Elements 3. 952 KB Embedded Memory 4. 56 18x18 Multipliers 5. 172,800 Total RAM bits 6. 1,152 Maximum user I/Os 7. 8 Fractional Phase-Locked Loops (PLLs) 8. 266 MHz Maximum core speed 9. Integrated hard IP blocks for PCI Express, DDR3, and more.

• Pinout

  The 5CSEBA2U19C8SN is a 324-pin FPGA (Field-Programmable Gate Array) device. It has various functions including logic processing, signal processing, and digital communication. This FPGA also features high-speed transceivers and low power consumption for efficient performance in a range of applications.

• Manufacturer

  The manufacturer of 5CSEBA2U19C8SN is Intel Corporation, an American multinational corporation and technology company headquartered in California. Intel is a leading manufacturer of semiconductor chips and other computer hardware components. They are known for producing a wide range of products including microprocessors, chipsets, and other integrated circuits for various devices.

• Application Field

  Some application areas of 5CSEBA2U19C8SN include industrial automation, communication systems, automotive electronics, medical devices, and consumer electronics. This FPGA can be used in various industries for implementing complex algorithms, signal processing, and control systems due to its high performance and flexibility.

• Package

  The 5CSEBA2U19C8SN chip is a Ball Grid Array (BGA) package type with a size of 19mm x 19mm and a form factor of 484-ball.