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Microchip A3P600-FG256I

FPGA - Field Programmable Gate Array ProASIC3 FPGA, 7KLEs

ISO14001 ISO9001 DUNS

Brands: Microchip Technology, Inc

Mfr.Part #: A3P600-FG256I

Datasheet: A3P600-FG256I Datasheet (PDF)

Package/Case: 256-LBGA

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 3,450 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for A3P600-FG256I or email to us: Email: [email protected], we will contact you within 12 hours.

A3P600-FG256I General Description

The A3P600-FG256I FPGA, part of the A3P600 series developed by Microsemi, provides a versatile solution for custom logic implementation. With 600,000 system gates, this FPGA offers abundant resources for diverse applications in industries such as telecommunications, automotive, and industrial automation. Its FineLine BGA package with 256 pins ensures efficient integration into electronic designs, making it a popular choice among developers

Features

  • A3P600-FG256I is widely used in industrial control systems.
  • It features a highly flexible and configurable architecture.
  • It supports advanced security features, including encryption and access control.
Microchip Technology, Inc Inventory

Specifications

Parameter Value Parameter Value
Manufacturer: Intel Product Category: FPGA - Field Programmable Gate Array
RoHS: N Product: Cyclone IV E
Number of Logic Elements: 10320 Number of Logic Array Blocks - LABs: 645
Number of I/Os: 91 I/O Operating Supply Voltage: 1 V to 1.2 V
Minimum Operating Temperature: - 40 C Maximum Operating Temperature: + 85 C
Mounting Style: SMD/SMT Package / Case: QFP-144
Packaging: Tray Series: EP4CE10 Cyclone IV E
Brand: Intel / Altera Maximum Operating Frequency: 200 MHz
Moisture Sensitive: Yes Product Type: FPGA - Field Programmable Gate Array
Factory Pack Quantity: 60 Subcategory: Programmable Logic ICs
Total Memory: 414 kbit Tradename: Cyclone IV
Tags A3P600-FG, A3P600-F, A3P600, A3P6, A3P Product Status Active
Programmabe Not Verified Number of LABs/CLBs -
Number of Logic Elements/Cells - Total RAM Bits 110592
Number of I/O 177 Number of Gates 600000
Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The A3P600-FG256I is a high-performance field-programmable gate array (FPGA) chip developed by Microchip Technology. It features 600K system gates, 16 embedded multipliers, and 84 I/O pins in a compact 256-pin Fine-Pitch Ball Grid Array (FG256) package. This chip is ideal for applications requiring programmable logic, signal processing, and system integration.
  • Equivalent

    The equivalent products of A3P600-FG256I chip are Xilinx Spartan-6 FPGA family, Altera MAX II CPLD, and Lattice MachXO2 CPLD. These options offer similar performance and features for FPGA and CPLD applications.
  • Features

    A3P600-FG256I is a field-programmable gate array (FPGA) with 600k logic elements, 24 multipliers, and 532 GPIOs. It operates at a maximum frequency of 250MHz and has embedded flash memory for configuration. Additional features include 6 PLLs, 8 BRAM blocks, and various I/O standards for connectivity.
  • Pinout

    A3P600-FG256I is a flash-based FPGA with a pin count of 256. It offers 600 logic elements, 49 I/O pins, and 10Kbits of embedded flash memory. This device is designed for general-purpose applications and provides flexibility for design customization.
  • Manufacturer

    The manufacturer of A3P600-FG256I is Microchip Technology Inc. It is an American electronics company that specializes in the design and manufacture of microcontrollers, memory and analog components, and other semiconductor products for a wide range of applications including automotive, industrial, and consumer electronics.
  • Application Field

    The A3P600-FG256I is often used in applications that require reliable and secure programmable logic devices, such as in industrial control systems, automotive electronics, telecommunications equipment, and medical devices. With its high level of integration, low power consumption, and advanced security features, it offers a versatile solution for a wide range of embedded systems.
  • Package

    The A3P600-FG256I chip is a field programmable gate array (FPGA) packaged in a 256-pin Fine-Pitch Ball Grid Array (FBGA) form factor. It measures 17x17mm in size.

Datasheet PDF

Preliminary Specification A3P600-FG256I PDF Download

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