Orders Over
$5000AS4C256M16D3B-12BCN
High-density DDR memory module with 256MX16 configuration and CMOS fabrication
Brands: ALLIANCE MEMORY INC
Mfr.Part #: AS4C256M16D3B-12BCN
Datasheet: AS4C256M16D3B-12BCN Datasheet (PDF)
Package/Case: FBGA-96
Product Type: Memory
RoHS Status:
Stock Condition: 6,554 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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AS4C256M16D3B-12BCN General Description
The AS4C256M16D3B-12BCN is a cutting-edge 4Gb DDR3 SDRAM that delivers exceptional performance for high-speed memory applications. Operating at a speedy 1333MHz, with a CAS latency of 9 cycles, this memory module is optimized for demanding computing needs. Its 96-ball FBGA package ensures reliable and efficient operation, making it suitable for a wide range of desktop and notebook computers, networking, and industrial systems
Specifications
Parameter | Value | Parameter | Value |
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Pbfree Code | Yes | Rohs Code | Yes |
Part Life Cycle Code | End Of Life | Ihs Manufacturer | ALLIANCE MEMORY INC |
Package Description | TFBGA, | Reach Compliance Code | compliant |
ECCN Code | EAR99 | HTS Code | 8542.32.00.36 |
Samacsys Manufacturer | Alliance Memory | Access Mode | MULTI BANK PAGE BURST |
Additional Feature | AUTO/SELF REFRESH | JESD-30 Code | R-PBGA-B96 |
JESD-609 Code | e1 | Length | 13.5 mm |
Memory Density | 4294967296 bit | Memory IC Type | DDR3 DRAM |
Memory Width | 16 | Moisture Sensitivity Level | 3 |
Number of Functions | 1 | Number of Ports | 1 |
Number of Terminals | 96 | Number of Words | 268435456 words |
Number of Words Code | 256000000 | Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
Organization | 256MX16 | Package Body Material | PLASTIC/EPOXY |
Package Code | TFBGA | Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | 260 |
Seated Height-Max | 1.2 mm | Self Refresh | YES |
Supply Voltage-Max (Vsup) | 1.575 V | Supply Voltage-Min (Vsup) | 1.425 V |
Supply Voltage-Nom (Vsup) | 1.5 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN SILVER COPPER | Terminal Form | BALL |
Terminal Pitch | 0.8 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The AS4C256M16D3B-12BCN is a DDR3 SDRAM chip with a capacity of 4Gb, organized as 256Mx16. It operates at a speed of 1200MHz (PC3-9600) and has a standard voltage of 1.35V. This memory chip is commonly used in computers, laptops, and other electronic devices for fast and efficient data processing.
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Equivalent
Some equivalent products of the AS4C256M16D3B-12BCN chip include the MT41K256M16TW-107:P, K4B2G1646D-BCK0, and MTA18ASF2G72PZ-2G9J1. These chips are all 256Mb x 16 DDR3 SDRAM modules with similar specifications and performance capabilities. -
Features
AS4C256M16D3B-12BCN is a Double Data Rate 3 (DDR3) SDRAM module with a capacity of 256M x 16-bits organized as a 512M x 8-bits array. It operates at a speed of 1200 MHz (12-12-12) with a supply voltage of 1.5V. This module is designed for applications requiring high performance and low power consumption. -
Pinout
The AS4C256M16D3B-12BCN is a DDR3 SDRAM with a 78-pin BGA package. It has 256 Meg x 16 bits, operates at 1.35V, and has a frequency of 1200MHz. Its functions include high-speed data transfer, low power consumption, and support for various applications such as computers and networking devices. -
Manufacturer
The manufacturer of the AS4C256M16D3B-12BCN is Alliance Memory Inc. It is a semiconductor company that specializes in producing high-quality memory components such as SRAM, DRAM, and Flash memory. Alliance Memory serves a variety of industries including automotive, industrial, communications, and consumer electronics. -
Application Field
The AS4C256M16D3B-12BCN is commonly used in applications such as networking equipment, telecommunications systems, industrial automation, and embedded computing. It is also utilized in servers, routers, switches, and other high-performance computing devices that require reliable and high-speed DDR3 SDRAM memory modules.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products