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Orders Over
$5000NXP BGA2818
MMIC Wideband Amplifier
Brands: NXP Semiconductor
Mfr.Part #: BGA2818
Datasheet: BGA2818 Datasheet (PDF)
Package/Case: SOT363
RoHS Status:
Stock Condition: 2,983 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Features
- @f[max](MHz): 950
- NF (dB): 3.3
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| place | Malaysia | launch_date | Dec 20, 2011 |
| last_inspection_date | 03 MAY 2023 | rohs_version | 2011/65/EU, 2015/863 |
| supplier_cage_code | H1R01 | htsusa | 8542330001 |
| schedule_b | 8542330000 | ppap | False |
| aec | False |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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![Product]( "Product")
Step1 :Product
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![Vacuum packaging]( "Vacuum packaging")
Step2 :Vacuum packaging
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![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
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![Individual packaging]( "Individual packaging")
Step4 :Individual packaging
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![Packaging boxes]( "Packaging boxes")
Step5 :Packaging boxes
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![bar-code shipping tag]( "bar-code shipping tag")
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The BGA2818 is a high-frequency RF front-end module integrated circuit designed for cellular applications. It features a power amplifier, low-noise amplifier, and transmit/receive switches all in a compact 3mm x 3mm package. This chip offers improved performance and efficiency for wireless communication devices.
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Equivalent
Some equivalent products to the BGA2818 chip are the AT76C9020, AT76C9020-201, and AT76C9020-201-SN chips. These chips are similar in terms of functionality and compatibility with various applications. -
Features
1. Compact and small form factor 2. Low power consumption 3. Integrated LNA, PA, and matching network 4. Wide frequency range (2.4-2.5GHz) 5. High linearity and efficiency 6. Up to 19.5dBm output power 7. Suitable for IoT, Bluetooth, and Zigbee applications. -
Pinout
BGA2818 is a ball grid array (BGA) package with a pin count of 2818. It is typically used for high-density semiconductor devices with multiple functions such as signal transmission, power delivery, and data processing. -
Manufacturer
BGA2818 is manufactured by ROHM Semiconductor. ROHM Semiconductor is a Japanese company that specializes in the development and production of integrated circuits, semiconductors, and other electronic components. They are known for their high-quality products and innovative solutions in the electronics industry. -
Application Field
BGA2818 can be used in a variety of applications including power management, DC-DC converters, motor control, and LED drivers. It is commonly used in industrial control systems, automotive applications, and power supply units due to its high efficiency and reliability. -
Package
The BGA2818 chip is a Ball Grid Array (BGA) package with 2818 balls underneath the chip. It is a small form factor package with a size of 17x17mm.
We provide high quality products, thoughtful service and after sale guarantee
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![Product]( "Product")
We have rich products, can meet your various needs.
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![quantity]( "quantity")
Minimum order quantity starts from 1pcs.
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![shipping]( "shipping")
Lowest international shipping fee starts from $0.00
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![guarantee]( "guarantee")
365 days quality guarantee for all products
