Orders Over
$5000
BSM300GA120DN2
Transistor Module for IGBT Transistor with N-Channel, 62MM-2 Tray
![ISO14001](/img/about/iso14001.png)
![ISO9001](/img/about/iso9001.png)
![DUNS](/img/about/duns.png)
Brands: Infineon
Mfr.Part #: BSM300GA120DN2
Datasheet: BSM300GA120DN2 Datasheet (PDF)
Package/Case: 62 mm
RoHS Status:
Stock Condition: 6,378 pcs, New Original
Product Type: IGBT Modules
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $425.008 | $425.008 |
200 | $164.472 | $32894.400 |
500 | $158.692 | $79346.000 |
1000 | $155.836 | $155836.000 |
In Stock: 6,378 PCS
BSM300GA120DN2 General Description
Infineon's BSM300GA120DN2 power semiconductor module is characterized by its compact and lightweight design, making it easy to integrate into existing systems. Its low switching losses and high efficiency contribute to overall system performance and energy efficiency, while its long lifespan and high reliability reduce maintenance requirements and downtime. With a dual IGBT module, 300A current rating, and 1200V voltage rating, this module is well-suited for electric vehicle drives, industrial drives, and renewable energy systems, offering exceptional power handling capabilities. The advanced thermal management system ensures efficient heat dissipation, enabling reliable operation even in demanding operating conditions, while built-in overcurrent and overtemperature protection circuits provide additional security for the module and the system
![BSM300GA120DN2 BSM300GA120DN2](/files/uploads/product/b/ef0b30851bfd4ee0b889cbb15c898357.webp)
Features
- High power density for high efficiency applications
- Wide operating temperature range from -40°C to 125°C
- High surge current capability for safe operation
- Suitable for renewable energy systems, industrial drives, and power supplies
Application
- Efficient energy solutions
- Reliable power systems
- Advanced technology uses
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Product Category | IGBT Modules | RoHS | Details |
Product | IGBT Silicon Modules | Configuration | Single |
Collector- Emitter Voltage VCEO Max | 1.2 kV | Collector-Emitter Saturation Voltage | 2.5 V |
Continuous Collector Current at 25 C | 430 A | Gate-Emitter Leakage Current | 320 nA |
Pd - Power Dissipation | 2.5 kW | Package / Case | 62 mm |
Minimum Operating Temperature | - 40 C | Maximum Operating Temperature | + 150 C |
Brand | Infineon Technologies | Height | 36.5 mm |
Length | 106.4 mm | Maximum Gate Emitter Voltage | 20 V |
Mounting Style | Chassis Mount | Product Type | IGBT Modules |
Factory Pack Quantity | 10 | Subcategory | IGBTs |
Technology | Si | Width | 61.4 mm |
Part # Aliases | SP000100730 BSM300GA120DN2HOSA1 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
![]() |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
![]() |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
![]() |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
![]() |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
![]() |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
![]() |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
![]() |
Wire Transfer | charge US$30.00 banking fee. |
![]() |
Paypal | charge 4.0% service fee. |
![]() |
Credit Card | charge 3.5% service fee. |
![]() |
Western Union | charge US.00 banking fee. |
![]() |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
-
Step1 :Product
-
Step2 :Vacuum packaging
-
Step3 :Anti-static bag
-
Step4 :Individual packaging
-
Step5 :Packaging boxes
-
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
-
The BSM300GA120DN2 is a power module chip used for high-power applications. It is designed for efficient energy conversion in various industries, including industrial, renewable energy, and transportation. The chip offers high power density, reliable performance, and advanced protection features. It is suitable for applications such as motor drives, inverters, and electric vehicle systems.
-
Equivalent
Some equivalent products of the BSM300GA120DN2 chip are the SEMIKRON SEMITRANS 3 series modules and the Infineon IGBT modules of the 1EDI series, such as the FF200R12KE3 and FF300R12KE3. -
Features
The BSM300GA120DN2 is a silicon carbide power module designed for high-power applications. Key features include a voltage rating of 1200V, a current rating of 300A, low on-state resistance, high switching frequency, robust and reliable design, and integrated temperature and current sensors for precise control and protection. -
Pinout
The BSM300GA120DN2 is an IGBT power module, specifically used in three-phase inverters. It has 7 pins, including gate-emitter and collector-emitter pins for each of its 3 IGBTs. The module is designed to convert direct current (DC) into alternating current (AC) in a variety of applications, such as motor drives and industrial equipment. -
Manufacturer
Infineon Technologies AG is the manufacturer of the BSM300GA120DN2. It is a German semiconductor manufacturer that specializes in manufacturing power semiconductors, microcontrollers, and integrated circuits for various industries, including automotive, industrial, and consumer electronics. -
Application Field
The BSM300GA120DN2 is a semiconductor device that can be used in various application areas, including renewable energy systems such as wind turbines and solar power, electric vehicle charging stations, industrial automation and robotics, and power supplies for data centers. -
Package
The BSM300GA120DN2 chip has a package type of Power Module, a form of Non-insulated, and a size of 42mm x 150mm.
We provide high quality products, thoughtful service and after sale guarantee
-
We have rich products, can meet your various needs.
-
Minimum order quantity starts from 1pcs.
-
Lowest international shipping fee starts from $0.00
-
365 days quality guarantee for all products