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BSM300GA120DN2 48HRS

Transistor Module for IGBT Transistor with N-Channel, 62MM-2 Tray

ISO14001 ISO9001 DUNS

Brands: Infineon

Mfr.Part #: BSM300GA120DN2

Datasheet: BSM300GA120DN2 Datasheet (PDF)

Package/Case: 62 mm

RoHS Status:

Stock Condition: 6,378 pcs, New Original

Product Type: IGBT Modules

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $425.008 $425.008
200 $164.472 $32894.400
500 $158.692 $79346.000
1000 $155.836 $155836.000

In Stock: 6,378 PCS

- +

Quick Quote

Please submit RFQ for BSM300GA120DN2 or email to us: Email: [email protected], we will contact you within 12 hours.

BSM300GA120DN2 General Description

Infineon's BSM300GA120DN2 power semiconductor module is characterized by its compact and lightweight design, making it easy to integrate into existing systems. Its low switching losses and high efficiency contribute to overall system performance and energy efficiency, while its long lifespan and high reliability reduce maintenance requirements and downtime. With a dual IGBT module, 300A current rating, and 1200V voltage rating, this module is well-suited for electric vehicle drives, industrial drives, and renewable energy systems, offering exceptional power handling capabilities. The advanced thermal management system ensures efficient heat dissipation, enabling reliable operation even in demanding operating conditions, while built-in overcurrent and overtemperature protection circuits provide additional security for the module and the system

BSM300GA120DN2

Features

  • High power density for high efficiency applications
  • Wide operating temperature range from -40°C to 125°C
  • High surge current capability for safe operation
  • Suitable for renewable energy systems, industrial drives, and power supplies

Application

  • Efficient energy solutions
  • Reliable power systems
  • Advanced technology uses

Specifications

Parameter Value Parameter Value
Product Category IGBT Modules RoHS Details
Product IGBT Silicon Modules Configuration Single
Collector- Emitter Voltage VCEO Max 1.2 kV Collector-Emitter Saturation Voltage 2.5 V
Continuous Collector Current at 25 C 430 A Gate-Emitter Leakage Current 320 nA
Pd - Power Dissipation 2.5 kW Package / Case 62 mm
Minimum Operating Temperature - 40 C Maximum Operating Temperature + 150 C
Brand Infineon Technologies Height 36.5 mm
Length 106.4 mm Maximum Gate Emitter Voltage 20 V
Mounting Style Chassis Mount Product Type IGBT Modules
Factory Pack Quantity 10 Subcategory IGBTs
Technology Si Width 61.4 mm
Part # Aliases SP000100730 BSM300GA120DN2HOSA1

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The BSM300GA120DN2 is a power module chip used for high-power applications. It is designed for efficient energy conversion in various industries, including industrial, renewable energy, and transportation. The chip offers high power density, reliable performance, and advanced protection features. It is suitable for applications such as motor drives, inverters, and electric vehicle systems.
  • Equivalent

    Some equivalent products of the BSM300GA120DN2 chip are the SEMIKRON SEMITRANS 3 series modules and the Infineon IGBT modules of the 1EDI series, such as the FF200R12KE3 and FF300R12KE3.
  • Features

    The BSM300GA120DN2 is a silicon carbide power module designed for high-power applications. Key features include a voltage rating of 1200V, a current rating of 300A, low on-state resistance, high switching frequency, robust and reliable design, and integrated temperature and current sensors for precise control and protection.
  • Pinout

    The BSM300GA120DN2 is an IGBT power module, specifically used in three-phase inverters. It has 7 pins, including gate-emitter and collector-emitter pins for each of its 3 IGBTs. The module is designed to convert direct current (DC) into alternating current (AC) in a variety of applications, such as motor drives and industrial equipment.
  • Manufacturer

    Infineon Technologies AG is the manufacturer of the BSM300GA120DN2. It is a German semiconductor manufacturer that specializes in manufacturing power semiconductors, microcontrollers, and integrated circuits for various industries, including automotive, industrial, and consumer electronics.
  • Application Field

    The BSM300GA120DN2 is a semiconductor device that can be used in various application areas, including renewable energy systems such as wind turbines and solar power, electric vehicle charging stations, industrial automation and robotics, and power supplies for data centers.
  • Package

    The BSM300GA120DN2 chip has a package type of Power Module, a form of Non-insulated, and a size of 42mm x 150mm.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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