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$5000CSR1012A05-IQQP-R
The CSR1012A05-IQQP-R features low energy consumption and high performance, making it ideal for IoT applications
Brands: Qualcomm Technologies
Mfr.Part #: CSR1012A05-IQQP-R
Datasheet: CSR1012A05-IQQP-R Datasheet (PDF)
Package/Case: QFN-32
Product Type: RF Transceiver ICs
RoHS Status:
Stock Condition: 8,836 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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CSR1012A05-IQQP-R General Description
Transform your Bluetooth Low Energy (BLE) projects with the CSR1012A05-IQQP-R module from Qualcomm Technologies, Inc. This BLE System-on-Chip (SoC) module boasts a robust ARM Cortex-M0 processor running at 16 MHz, 128 KB of flash memory, and 40 KB of RAM, delivering significant processing power and storage capacity for BLE applications. Supporting Bluetooth Low Energy version 4.2 and offering a range of up to 100 meters, this module ensures dependable and energy-efficient wireless communication for diverse IoT devices and applications. Its compact size of 6.5 mm x 6.5 mm x 1.4 mm and integrated antenna make integration seamless, while the inclusion of UART, I2C, SPI, and GPIO interfaces provides versatility for connecting external sensors and devices. Whether you're working on smart energy solutions, wearables, or industrial monitoring systems, the CSR1012A05-IQQP-R module provides a solid foundation for BLE development
Features
- Compact design with high performance
- Advanced error correction mechanism
- Low latency data transmission
- Supports multiple protocols
- Firmware updatable
- Prompt response and feedback
Application
- Wireless sensor technology
- Health monitoring devices
- Industrial IoT solutions
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Series | µEnergy® | Product Status | Not For New Designs |
| Programmabe | Not Verified | Type | TxRx + MCU |
| RF Family/Standard | Bluetooth | Protocol | Bluetooth v4.0 |
| Frequency | 2.4GHz | Data Rate (Max) | 3.69Mbaud |
| Power - Output | 9dBm | Sensitivity | -94dBm |
| Memory Size | 64kB RAM, 64kB ROM | Serial Interfaces | I2C, SPI, UART |
| GPIO | 15 | Voltage - Supply | 1.2V ~ 3.6V |
| Current - Receiving | 20mA | Current - Transmitting | 18mA |
| Operating Temperature | -30°C ~ 85°C | Mounting Type | Surface Mount |
| Package / Case | 32-UFQFN Exposed Pad | Supplier Device Package | 32-QFN (4x4) |
| Base Product Number | CSR1012 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The CSR1012A05-IQQP-R is a low-power, Bluetooth Smart system-on-chip (SoC) designed for use in Internet of Things (IoT) devices, wearable technology, and other connected devices. It features integrated Bluetooth 4.2 Low Energy connectivity, a powerful ARM Cortex-M0 CPU, and a range of peripherals for sensor interfacing and control. This chip offers a cost-effective and efficient solution for adding wireless connectivity to a wide range of applications.
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Equivalent
The equivalent products of CSR1012A05-IQQP-R chip are CSR1012A05-IQQ-R, CSR1012A05-IQQQ-R, and CSR1012A05-IQQP. These chips have similar functionality and specifications, making them suitable replacements for the original chip in various applications. -
Features
The CSR1012A05-IQQP-R is a Bluetooth Low Energy (BLE) system-on-chip from Qualcomm Technologies. It features integrated ARM Cortex-M0 processor, 128KB RAM, 128KB ROM, and supports Bluetooth 4.2. It also includes 512KB embedded flash memory, PWM, ADC, UART, and SPI interfaces, making it a versatile solution for IoT and wearable devices. -
Pinout
The CSR1012A05-IQQP-R has 32 pins and is a low-power Bluetooth Smart system-on-chip (SoC) that is optimized for ultra-low-power applications. It features integrated Bluetooth Low Energy (BLE) and ARM Cortex-M0 processor for wireless connectivity. -
Manufacturer
The manufacturer of the CSR1012A05-IQQP-R is Qualcomm Technologies International, Ltd. It is a leading multinational corporation specializing in semiconductors and telecommunications equipment. Known for its innovative technology solutions, Qualcomm Technologies International, Ltd. collaborates with various industries to provide advanced solutions for wireless communications, computing, and internet of things (IoT) applications. -
Application Field
The CSR1012A05-IQQP-R is commonly used in applications such as industrial automation, asset tracking, smart meters, and healthcare devices. It is also utilized in wearable technology, smart home devices, and other Internet of Things (IoT) applications that require low power consumption and secure wireless connectivity. -
Package
The CSR1012A05-IQQP-R chip is a QFN package type with a form factor of 32-pin. The size of the chip is 4mm x 4mm.
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