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$5000Infineon CY7C1370D-167AXI
Available for immediate shipping
Brands: Infineon Technologies
Mfr.Part #: CY7C1370D-167AXI
Datasheet: CY7C1370D-167AXI Datasheet (PDF)
Package/Case: QFP-100
Product Type: Memory
RoHS Status:
Stock Condition: 9,458 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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CY7C1370D-167AXI General Description
The CY7C1370D-167AXI from Cypress Semiconductor is a top-of-the-line synchronous SRAM that brings speed and efficiency to high-performance applications. With a blazing fast operating frequency of 167 MHz and a generous capacity of 128K x 36 bits, this SRAM is designed to meet the demands of modern computing systems. Its synchronous interface ensures seamless integration into synchronous systems, while its impressive access time of just 6 ns guarantees quick data retrieval for time-sensitive operations
Features
- No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles
- Supports up to 133-MHz bus operations with zero wait states
- ❐ Data is transferred on every clock
- Pin-compatible and functionally equivalent to ZBT™ devices
- Internally self-timed output buffer control to eliminate the need to use OE
- Registered inputs for flow through operation
- Byte write capability
- 3.3 V/2.5 V I/O power supply (VDDQ)
- Fast clock-to-output times
- ❐ 6.5 ns (for 133-MHz device)
- Clock enable (CEN) pin to enable clock and suspend operation
- Synchronous self-timed writes
- Asynchronous output enable
- Available in JEDEC-standard Pb-free 100-pin TQFP, Pb-free and non Pb-free 119-ball BGA, and 165-ball FBGA packages
- Three chip enables for simple depth expansion
- Automatic power-down feature available using ZZ mode or CE deselect
- IEEE 1149.1 JTAG-compatible boundary scan
- Burst capability – linear or interleaved burst order
- Low standby power
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer: | Infineon | Product Category: | SRAM |
| RoHS: | Details | Memory Size: | 18 Mbit |
| Organization: | 512 k x 36 | Access Time: | 3.4 ns |
| Maximum Clock Frequency: | 167 MHz | Interface Type: | Parallel |
| Supply Voltage - Max: | 3.6 V | Supply Voltage - Min: | 3.135 V |
| Supply Current - Max: | 275 mA | Minimum Operating Temperature: | - 40 C |
| Maximum Operating Temperature: | + 85 C | Mounting Style: | SMD/SMT |
| Package / Case: | TQFP-100 | Packaging: | Tray |
| Brand: | Infineon Technologies | Data Rate: | SDR |
| Memory Type: | SDR | Moisture Sensitive: | Yes |
| Number of Ports: | 4 | Product Type: | SRAM |
| Series: | CY7C1370D | Factory Pack Quantity: | 72 |
| Subcategory: | Memory & Data Storage | Type: | Synchronous |
| Unit Weight: | 0.023175 oz |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The CY7C1370D-167AXI is a high-speed synchronous SRAM chip from Cypress Semiconductor. It features a capacity of 4Mbit with a data transfer rate of up to 167MHz. This device is ideal for applications requiring fast and reliable memory access, such as networking equipment, telecommunications, and industrial automation.
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Equivalent
Some equivalent products of CY7C1370D-167AXI chip are: 1. Micron MT41K512M16HA-107:P 2. Samsung K4J52324QE-BC14 3. NXP ISP1601BBD-C1 4. Infineon HY5PS561621BFP-C 5. TI CDCM9102RGETR. -
Features
The CY7C1370D-167AXI is a high-performance synchronous SRAM with a density of 4Mbit. It operates at a speed of 167MHz and has a low stand-by current. It features a burst operation mode, a single-cycle deselect, and a burst sequence control using address lines for easy interfacing. -
Pinout
CY7C1370D-167AXI is a 167-MHz, 3.3V, 256K x 16 synchronous FIFO memory with LF32T interfaces. It has a pin count of 100, and functions as a high-speed data buffer for applications requiring large amounts of data to be moved between devices at different speeds. -
Manufacturer
Cypress Semiconductor Corporation is the manufacturer of CY7C1370D-167AXI. They are an American semiconductor design and manufacturing company specializing in creating solutions for automotive, industrial, home automation, and consumer electronics markets. Cypress Semiconductor Corporation is now owned by Infineon Technologies AG. -
Application Field
The CY7C1370D-167AXI is typically used in industrial automation, automotive applications, and telecommunications systems for high-speed data transfer, networking, and memory expansion. It can also be used in consumer electronics, medical equipment, and aerospace applications that require high-performance, low-power consumption, and reliable operation. -
Package
The CY7C1370D-167AXI chip is in a 304-ball PBGA package, with a form factor of BGA. The size of the chip is 17mm x 17mm.
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