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$5000Infineon CYW20736S
Enhance wireless connectivity with advanced Bluetooth Low Energy technology
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Brands: Infineon
Mfr.Part #: CYW20736S
Datasheet: CYW20736S Datasheet (PDF)
Package/Case: LGA-48
Product Type: RF Transceiver ICs
RoHS Status:
Stock Condition: 9,458 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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CYW20736S General Description
Featuring a RF transceiver, baseband processor, and protocol stack all bundled into a single chip, the CYW20736S streamlines design complexity and helps cut down on bill of material costs for IoT devices. Additionally, integrated power management functionality enhances efficiency, leading to prolonged battery life in devices that rely on battery power
Specifications
Parameter | Value | Parameter | Value |
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Manufacturer: | Infineon | Product Category: | RF Microcontrollers - MCU |
RoHS: | Details | Core: | ARM Cortex M3 |
Operating Frequency: | 2.4 GHz | Data Bus Width: | 32 bit |
Program Memory Size: | 512 kB | Data RAM Size: | 60 kB |
Maximum Clock Frequency: | 24 MHz | ADC Resolution: | 16 bit |
Supply Voltage - Min: | 3.63 V | Supply Voltage - Max: | 3.63 V |
Maximum Operating Temperature: | + 85 C | Package / Case: | LGA-48 |
Mounting Style: | SMD/SMT | Packaging: | Tray |
Brand: | Infineon Technologies | Data RAM Type: | RAM |
Interface Type: | I2C, SPI, UART | Minimum Operating Temperature: | - 40 C |
Moisture Sensitive: | Yes | Number of ADC Channels: | 9 Channel |
Number of I/Os: | 14 I/O | Number of Timers: | 4 |
Operating Supply Voltage: | 3.63 V | Output Power: | 2 dBm |
Product Type: | RF Microcontrollers - MCU | Program Memory Type: | EEPROM |
Series: | CYW20736 | Factory Pack Quantity: | 520 |
Subcategory: | Wireless & RF Integrated Circuits | Technology: | Si |
Unit Weight: | 0.086941 oz |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The CYW20736S is a highly integrated Bluetooth Low Energy (BLE) and dual-mode Bluetooth chip, designed for a wide range of IoT and wearable devices. It includes a powerful ARM Cortex-M3 processor, various interfaces for sensor integration, and low-power modes for extended battery life.
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Equivalent
The equivalent products of CYW20736S chip include CYW20719B1, CYW20721B1, CYW20735B1, CYW20737B1, and CYW20738B1 from Cypress Semiconductor. These chips offer similar Bluetooth functionality and features for various applications such as IoT devices, wearables, and audio products. -
Features
1. Dual-mode Bluetooth 5.1 SoC 2. Secure Boot, Flash encryption, and Secure data storage 3. Support for Mesh, LE Audio, and Bluetooth low energy 4. Ultra-low power consumption 5. Integrated RF, Baseband, and Bluetooth Stack 6. Integrated ARM Cortex-M4 processor for application development 7. Rich set of interfaces including SPI, I2C, UART, I2S, PCM, PWM -
Pinout
The CYW20736S is a 32-pin System-on-Chip (SoC) with integrated Bluetooth Low Energy (BLE) connectivity. It includes GPIO, UART, SPI, I2C, PCM/I2S, ADC, and PWM interfaces for connecting to external devices. It also supports various peripherals for system control and communication. -
Manufacturer
Cypress Semiconductor Corporation is the manufacturer of the CYW20736S. Cypress is an American semiconductor design and manufacturing company specializing in embedded systems and IoT solutions. They provide a wide range of products for various applications including automotive, industrial, consumer electronics, and more. -
Application Field
The CYW20736S is a Bluetooth and Bluetooth Low Energy (BLE) dual-mode module, commonly used in wearables, smart home devices, automotive applications, health and fitness trackers, and industrial automation. Its low power consumption, small form factor, and high-performance capabilities make it suitable for a wide range of wireless connectivity applications. -
Package
The CYW20736S chip is available in a compact 32-pin QFN package, measuring 5mm x 5mm.
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Minimum order quantity starts from 1pcs.
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365 days quality guarantee for all products