Images are for reference only See Product Specifications
Orders Over
$5000K4T51163QJ-BCE6000
Ncnr As Of Oct 2013 Replacement: K4T51163QQ-BCE6000
Brands: SAMSUNG
Mfr.Part #: K4T51163QJ-BCE6000
Datasheet: K4T51163QJ-BCE6000 Datasheet (PDF)
Package/Case: FBGA-84
Product Type: DRAM Chip
RoHS Status:
Stock Condition: 6,554 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
Ovaga has a large stock of K4T51163QJ-BCE6000 DRAM Chip from SAMSUNG and we guarantee that they are original,brand new parts sourced directly from SAMSUNG We can provide quality testing reports for K4T51163QJ-BCE6000 upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| EU RoHS | Yes | RoHS Version | 2011/65/EU, 2015/863 |
| ECCN | EAR99 | Automotive | No |
| Supplier Cage Code | 1542F | HTSUSA | 8542320028 |
| Schedule B | 8542320015 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
-
![Product]( "Product")
Step1 :Product
-
![Vacuum packaging]( "Vacuum packaging")
Step2 :Vacuum packaging
-
![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
-
![Individual packaging]( "Individual packaging")
Step4 :Individual packaging
-
![Packaging boxes]( "Packaging boxes")
Step5 :Packaging boxes
-
![bar-code shipping tag]( "bar-code shipping tag")
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
-
The K4T51163QJ-BCE6000 is a DDR3 SDRAM chip designed for use in various electronic devices, such as computers and mobile devices. It offers a storage capacity of 4 GB and a clock speed of 1600 MHz, making it suitable for high-performance applications. Additionally, it features low power consumption and reliability, making it an ideal choice for demanding computing tasks.
-
Equivalent
The equivalent products of K4T51163QJ-BCE6000 chip are Hynix H5PS5162GFR-S6C, Micron MT47H64M16HR-3, Samsung K4T51083QG and SK Hynix H5TQ4G63AFR chip. -
Features
1. 512Mb DDR2 SDRAM 2. 32Mx16 3. Speed: 600MHz 4. Supply Voltage: 1.8V 5. Organization: 4 Banks 6. CAS Latency: CL=5 7. Interface: 60-Ball FBGA Package 8. Industrial temperature range: -40°C to 85°C 9. RoHS Compliant -
Pinout
The K4T51163QJ-BCE6000 is a 512Mb DDR2 SDRAM memory chip with a 84-ball FBGA package. It has a pin count of 84 pins and functions as a memory storage solution for various electronic devices such as computers, printers, and networking equipment. -
Manufacturer
The manufacturer of the K4T51163QJ-BCE6000 is Samsung. Samsung is a South Korean multinational conglomerate company that specializes in various sectors, including technology, electronics, and telecommunications. It is one of the largest manufacturers of consumer electronics and semiconductors in the world. -
Application Field
The K4T51163QJ-BCE6000 is commonly used in various electronic devices such as smartphones, tablets, laptops, and digital cameras. It can also be found in gaming consoles, networking equipment, and automotive applications. Its high performance and reliability make it suitable for a wide range of memory storage needs in consumer electronics and industrial applications. -
Package
The K4T51163QJ-BCE6000 chip comes in a 60-ball FBGA package in a 8Gb (1Gx8) form with dimensions of 8.5mm x 11.5mm.
We provide high quality products, thoughtful service and after sale guarantee
-
![Product]( "Product")
We have rich products, can meet your various needs.
-
![quantity]( "quantity")
Minimum order quantity starts from 1pcs.
-
![shipping]( "shipping")
Lowest international shipping fee starts from $0.00
-
![guarantee]( "guarantee")
365 days quality guarantee for all products
