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LCMXO1200C-3FTN256C
Versatile FPGA solution with 1200 Logic Units and 211 Input/Output ports
Brands: Lattice Semiconductor Corporation
Mfr.Part #: LCMXO1200C-3FTN256C
Datasheet: LCMXO1200C-3FTN256C Datasheet (PDF)
Package/Case: 256-LBGA
RoHS Status:
Stock Condition: 7,384 pcs, New Original
Product Type: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $24.004 | $24.004 |
| 200 | $9.289 | $1857.800 |
| 500 | $8.963 | $4481.500 |
| 1000 | $8.801 | $8801.000 |
In Stock: 7,384 PCS
LCMXO1200C-3FTN256C General Description
The LCMXO1200C-3FTN256C FPGA from Lattice Semiconductor is a powerful yet cost-effective solution for a wide range of applications. With its 1200 LUTs, 64 Kbit Embedded Block RAM, and 18 I/O pins, this FPGA offers the flexibility and performance needed for industrial control systems, consumer electronics, automotive infotainment, and communication equipment. Its low power consumption and compact 256-pin TQFP package make it a great choice for space-constrained designs, while its maximum frequency of 75 MHz ensures efficient operation
Features
- Non-volatile, Infinitely Reconfigurable
- Instant-on – powers up in microseconds
- Single chip, no external configuration memory
- required
- Excellent design security, no bit stream to
- intercept
- Reconfigure SRAM based logic in milliseconds
- SRAM and non-volatile memory programmable
- through JTAG port
- Supports background programming of
- non-volatile memory
- Sleep Mode
- Allows up to 100x static current reduction
- TransFR™ Reconfiguration (TFR)
- In-field logic update while system operates
- High I/O to Logic Density
- 256 to 2280 LUT4s
- 73 to 271 I/Os with extensive package options
- Density migration supported
- Lead free/RoHS compliant packaging
- Embedded and Distributed Memory
- Up to 27.6 Kbits sysMEM™ Embedded Block
- RAM
- Up to 7.5 Kbits distributed RAM
- Dedicated FIFO control logic
- Flexible I/O Buffer
- Programmable sysIO™ buffer supports wide
- range of interfaces:
- − LVCMOS 3.3/2.5/1.8/1.5/1.2
- − LVTTL
- − PCI
- − LVDS, Bus-LVDS, LVPECL, RSDS
- sysCLOCK™ PLLs
- Up to two analog PLLs per device
- Clock multiply, divide, and phase shifting
- System Level Support
- IEEE Standard 1149.1 Boundary Scan
- Onboard oscillator
- Devices operate with 3.3V, 2.5V, 1.8V or 1.2V
- power supply
- IEEE 1532 compliant in-system programming
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Series | MachXO | Package | Tray |
| Product Status | Active | Programmabe | Not Verified |
| Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 |
| Total RAM Bits | 9421 | Number of I/O | 211 |
| Voltage - Supply | 1.71V ~ 3.465V | Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | Package / Case | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17x17) |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
-
LCMXO1200C-3FTN256C is a low-power, small form-factor FPGA chip from Lattice Semiconductor. It features 1200 LUTs, 64Kb embedded block RAM, and dedicated FPGA fabric for low-power applications. The chip is designed for applications requiring high performance and low power consumption in a compact package.
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Equivalent
Some equivalent products of LCMXO1200C-3FTN256C chip are LCMXO1200C-3FTN256C-ND, LCMXO1200C-3FTN256C-TR, and LCMXO1200C-3FTN256C-WS. These chips are all in the Lattice XO2-1200 family, offering similar features and functionality. -
Features
LCMXO1200C-3FTN256C is a low-power, cost-effective FPGA with 1200 Look-Up Tables (LUTs), 64Kb Embedded Block RAM, 65 I/Os, and 4 multipliers. It operates at 3.3V and offers non-volatile configuration memory, instant-on capability, and high security with AES bitstream encryption. -
Pinout
The LCMXO1200C-3FTN256C is a field programmable gate array (FPGA) with 256 pins in a 256-pin fine-pitch BGA package. It features a high density of logic elements and embedded block RAM, making it suitable for a wide range of applications in the consumer, communications, and industrial markets. -
Manufacturer
Lattice Semiconductor is the manufacturer of the LCMXO1200C-3FTN256C. Lattice Semiconductor is an American company that specializes in programmable logic devices and related software, offering a wide range of solutions for the communications, computing, industrial, automotive, and consumer markets. -
Application Field
The LCMXO1200C-3FTN256C is commonly used in applications such as portable medical devices, handheld instruments, industrial control systems, and test & measurement equipment. Its low power consumption, small form factor, and high integration make it well-suited for applications requiring programmable logic with low power requirements and limited space. -
Package
The LCMXO1200C-3FTN256C chip is in a surface mount package, in the form of a BGA (Ball Grid Array) and is 13mm x 13mm in size.
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