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LATTICE LFE3-17EA-6FTN256C 48HRS

Latticeecp3 ; 17K Luts; 1.2V Rohs Compliant: Yes |Lattice Semiconductor LFE3-17EA-6FTN256C

ISO14001 ISO9001 DUNS

Brands: Lattice

Mfr.Part #: LFE3-17EA-6FTN256C

Datasheet: LFE3-17EA-6FTN256C Datasheet (PDF)

Package/Case: FPBGA-256

RoHS Status:

Stock Condition: 9,458 pcs, New Original

Product Type: FPGAs (Field Programmable Gate Array)

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $8.664 $8.664
10 $7.634 $76.340
30 $7.008 $210.240
100 $6.481 $648.100

In Stock: 9,458 PCS

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Quick Quote

Please submit RFQ for LFE3-17EA-6FTN256C or email to us: Email: [email protected], we will contact you within 12 hours.

LFE3-17EA-6FTN256C General Description

Operating at a maximum clock frequency of 550 MHz and with a 1.2V core voltage, the LFE3-17EA-6FTN256C delivers high performance in a compact 256-pin FineLine BGA package. This makes it ideal for applications where space is limited, without compromising on functionality. Additionally, the FPGA includes advanced security features like bitstream encryption and region lockdown, ensuring that your design IP remains protected

Features

  • Higher Logic Density for Increased System Integration
  • 17K to 149K LUTs
  • 116 to 586 I/Os
  • Embedded SERDES
  • 150 Mbps to 3.2 Gbps for Generic 8b10b, 10-bit SERDES, and 8-bit SERDES modes
  • Data Rates 230 Mbps to 3.2 Gbps per channel for all other protocols
  • Up to 16 channels per device: PCI Express, SONET/SDH, Ethernet (1GbE, SGMII, XAUI), CPRI, SMPTE 3G and Serial RapidIO
  • sysDSP™
  • Fully cascadable slice architecture
  • 12 to 160 slices for high performance multiply and accumulate
  • Powerful 54-bit ALU operations
  • Time Division Multiplexing MAC Sharing
  • Rounding and truncation
  • Each slice supports
  • — Half 36x36, two 18x18 or four 9x9 multipliers
  • — Advanced 18x36 MAC and 18x18 Multiply-Multiply-Accumulate (MMAC) operations
  • Flexible Memory Resources
  • Up to 6.85Mbits sysMEM™ Embedded Block RAM (EBR)
  • 36K to 303K bits distributed RAM
  • sysCLOCK Analog PLLs and DLLs
  • Two DLLs and up to ten PLLs per device
  • Pre-Engineered Source Synchronous I/O
  • DDR registers in I/O cells
  • Dedicated read/write levelling functionality
  • Dedicated gearing logic
  • Source synchronous standards support
  • — ADC/DAC, 7:1 LVDS, XGMII
  • — High Speed ADC/DAC devices
  • Dedicated DDR/DDR2/DDR3 memory with DQS support
  • Optional Inter-Symbol Interference (ISI)  correction on outputs
  • Programmable sysI/O™ Buffer Supports Wide Range of Interfaces
  • On-chip termination
  • Optional equalization filter on inputs
  • LVTTL and LVCMOS 33/25/18/15/12
  • SSTL 33/25/18/15 I, II
  • HSTL15 I and HSTL18 I, II
  • PCI and Differential HSTL, SSTL
  • LVDS, Bus-LVDS, LVPECL, RSDS, MLVDS
  • Flexible Device Configuration
  • Dedicated bank for configuration I/Os
  • SPI boot flash interface
  • Dual-boot images supported
  • Slave SPI
  • TransFR™ I/O for simple field updates
  • Soft Error Detect embedded macro
  • System Level Support
  • IEEE 1149.1 and IEEE 1532 compliant
  • Reveal Logic Analyzer
  • ORCAstra FPGA configuration utility
  • On-chip oscillator for initialization & general use
  • 1.2 V core power supply
Lattice Inventory

Specifications

Parameter Value Parameter Value
Manufacturer: Lattice Product Category: FPGA - Field Programmable Gate Array
RoHS: Details Series: LFE3
Number of Logic Elements: 17000 LE Adaptive Logic Modules - ALMs: 8500 ALM
Embedded Memory: 700 kbit Number of I/Os: 133 I/O
Supply Voltage - Min: 1.14 V Supply Voltage - Max: 1.26 V
Minimum Operating Temperature: 0 C Maximum Operating Temperature: + 85 C
Data Rate: 3.2 Gb/s Mounting Style: SMD/SMT
Package / Case: FPBGA-256 Packaging: Tray
Brand: Lattice Distributed RAM: 36 kbit
Embedded Block RAM - EBR: 700 kbit Maximum Operating Frequency: 375 MHz
Moisture Sensitive: Yes Number of Logic Array Blocks - LABs: 2125 LAB
Operating Supply Current: 18 mA Operating Supply Voltage: 1.2 V
Product Type: FPGA - Field Programmable Gate Array Factory Pack Quantity: 90
Subcategory: Programmable Logic ICs Total Memory: 736 kbit
Unit Weight: 0.834123 oz

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The LFE3-17EA-6FTN256C chip is a field-programmable gate array (FPGA) produced by Lattice Semiconductor. It features a 17K LUT (Look-Up Table) architecture and uses a 40 nm process technology. This high-performance chip offers low power consumption, excellent system integration, and is suitable for a wide range of applications in industries such as communications, automotive, and industrial automation.
  • Equivalent

    The equivalent products of LFE3-17EA-6FTN256C chip include LFE3-17EA-6FN484C, LFE3-17EA-6FTG256C, and LFE3-17EA-6LN256C.
  • Features

    The LFE3-17EA-6FTN256C is a low-power, field-programmable gate array (FPGA) by Lattice Semiconductor. It offers 17,076 Look-Up Tables (LUTs), 58.8Kb Distributed Memory, 3.5Kb RAM, 64-bit DDR3 memory interface, and 256-ball fine pitch BGA package. It supports up to 293 input/outputs (IOs) with various additional features for efficient design implementation.
  • Pinout

    The LFE3-17EA-6FTN256C is an FPGA (Field-Programmable Gate Array) with a pin count of 256. It is part of the Lattice ECP3 family and offers a range of general-purpose I/O (Input/Output) functions.
  • Manufacturer

    The manufacturer of the LFE3-17EA-6FTN256C is Lattice Semiconductor Corporation. It is a semiconductor company that specializes in programmable logic devices, such as field-programmable gate arrays (FPGAs), and related software development tools.
  • Application Field

    The application areas of the LFE3-17EA-6FTN256C include communication systems, video and image processing, industrial automation, automotive systems, and medical equipment. It is a low-power FPGA with high processing capability, making it suitable for a wide range of applications that require high-performance and low-power consumption.
  • Package

    The LFE3-17EA-6FTN256C chip comes in a FBGA (Fine-pitch Ball Grid Array) package type. Its form factor is 17 x 17 mm, and it has a size of 289 square millimeters.

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