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TI LMC660CM/NOPB

Low power consumption and ROHS compliant

ISO14001 ISO9001 DUNS

Brands: Texas Instruments

Mfr.Part #: LMC660CM/NOPB

Datasheet: LMC660CM/NOPB Datasheet (PDF)

Package/Case: SOIC (D)-14

Product Type: Instrumentation, OP Amps, Buffer Amps

RoHS Status:

Stock Condition: 15,230 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for LMC660CM/NOPB or email to us: Email: [email protected], we will contact you within 12 hours.

LMC660CM/NOPB General Description

The LMC660CM/NOPB is a versatile CMOS Quad operational amplifier designed for single supply operation. It can function within a wide voltage range of +5V to +15.5V and provides rail-to-rail output swing, making it suitable for diverse applications. Unlike traditional CMOS amplifiers, this design overcomes performance limitations such as input VOS, drift, and broadband noise. Additionally, it offers a wide input common-mode range that includes ground and delivers voltage gain equivalent to or better than bipolar equivalents. With TI's advanced Double-Poly Silicon-Gate CMOS process, this chip ensures reliable and efficient performance

LMC660CM/NOPB

Features

  • LMC660CM/NOPB is a highly reliable and accurate device
  • Low input offset voltage drift ensures stable measurements over time
  • It also has low input bias current, which reduces errors caused by temperature changes

Application

  • Reliable for voltage reference circuits
  • Excellent for audio and instrumentation

Specifications

Parameter Value Parameter Value
Number of channels 4 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 15.5
Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 4.75 Rail-to-rail In to V-, Out
GBW (typ) (MHz) 1.4 Slew rate (typ) (V/µs) 1.1
Vos (offset voltage at 25°C) (max) (mV) 3 Iq per channel (typ) (mA) 0.38
Vn at 1 kHz (typ) (nV√Hz) 22 Rating Catalog
Operating temperature range (°C) -40 to 85, 0 to 70 Offset drift (typ) (µV/°C) 1.3
Input bias current (max) (pA) 2 CMRR (typ) (dB) 83
Iout (typ) (A) 0.021 Architecture CMOS
Input common mode headroom (to negative supply) (typ) (V) -0.4 Input common mode headroom (to positive supply) (typ) (V) -1.9
Output swing headroom (to negative supply) (typ) (V) 0.1

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The LMC660CM/NOPB is a low-power operational amplifier (op-amp) designed for use in low-voltage, low-power applications. It features a wide supply voltage range and low input bias current, making it suitable for battery-powered devices. The chip is housed in an 8-pin SOIC package and is commonly used in audio amplifiers, sensor circuits, and battery-powered devices.
  • Equivalent

    The equivalent products of LMC660CM/NOPB chip are LMV358IDGKR, LM358DR, TLC271CDR, and TLV2264ID. These chips serve as operational amplifiers with similar specifications and performance characteristics.
  • Features

    LMC660CM/NOPB features a gain-bandwidth product of 1 MHz, a low supply current of 110 μA, and single-supply operation from 3V to 30 V. It also includes input offset voltage of 1 mV, input bias current of 1 pA, and a low input voltage noise of 50 nV/√Hz.
  • Pinout

    The LMC660CM/NOPB is a quad operational amplifier with a 14-pin count. It has four independent amplifiers with high-gain bandwidth product, low input offset voltage, low bias current, and high output drive capability. It is commonly used in audio applications, instrumentation, and communication systems.
  • Manufacturer

    The manufacturer of the LMC660CM/NOPB is Texas Instruments, which is a leading semiconductor and integrated circuits company based in the United States. Texas Instruments produces a wide range of electronic components for various industries, including consumer electronics, automotive, and industrial applications. Their products are known for their high quality and reliability.
  • Application Field

    The LMC660CM/NOPB is commonly used in applications such as automotive electronics, medical devices, industrial automation, and consumer electronics. It is particularly well-suited for use in signal conditioning, voltage comparators, active filters, and audio amplifiers due to its low input offset voltage, low bias current, and wide supply voltage range.
  • Package

    The LMC660CM/NOPB chip is available in an 8-SOIC package type, with a surface mount form factor. The size of the chip is 5.00mm x 4.00mm x 1.50mm.

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