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NXP LPC1765FBD100,551 48HRS

RISC Microcontroller, 32-Bit, FLASH, ARM7 CPU, 100MHz, CMOS, PQFP100

ISO14001 ISO9001 DUNS

Brands: NXP Semiconductor

Mfr.Part #: LPC1765FBD100,551

Datasheet: LPC1765FBD100,551 Datasheet (PDF)

Package/Case: LQFP-100

RoHS Status:

Stock Condition: 2,603 pcs, New Original

Product Type: Microcontrollers

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $15.135 $15.135
10 $14.492 $144.920
30 $13.380 $401.400
90 $12.411 $1116.990

In Stock: 2,603 PCS

- +

Quick Quote

Please submit RFQ for LPC1765FBD100,551 or email to us: Email: [email protected], we will contact you within 12 hours.

LPC1765FBD100,551 General Description

The LPC1765FBD100,551 is a powerful microcontroller unit (MCU) from the LPC Family LPC1700 Series. Featuring a 32-bit ARM Cortex-M3 architecture, this MCU operates at a CPU speed of 100MHz, making it suitable for a wide range of applications. With 256KB of program memory and 64KB of RAM, the LPC1765FBD100,551 offers ample space for storing and executing code

Features

  • The LPC17 is a versatile chip
  • for various embedded systems
  • with its multiple interfaces and protocols

Application

  • High-speed performance for real-time applications
  • Reliable connectivity options for industrial automation
  • Advanced features for automotive control systems

Specifications

Parameter Value Parameter Value
feature-tradename feature-data-bus-width-bit 32
feature-minimum-operating-supply-voltage-v 2.4 feature-maximum-operating-supply-voltage-v 3.6
feature-interface-type CAN/I2C/I2S/SPI/SSP/UART/USB feature-packaging Tray
feature-rad-hard feature-pin-count 100
feature-supplier-package LQFP feature-standard-package-name1 QFP
feature-cecc-qualified No feature-esd-protection Yes
feature-escc-qualified feature-military No
feature-aec-qualified No feature-aec-qualified-number
feature-auto-motive No feature-p-pap No
feature-eccn-code 3A991a.2. feature-svhc Yes
feature-svhc-exceeds-threshold No Series LPC17xx
Package Tray Product Status Discontinued at Digi-Key
Programmabe Not Verified Core Processor ARM® Cortex®-M3
Core Size 32-Bit Single-Core Speed 100MHz
Connectivity CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O 70 Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters A/D 8x12b; D/A 1x10b
Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount Package / Case 100-LQFP
Supplier Device Package 100-LQFP (14x14)

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The LPC1765FBD100,551 is a microcontroller chip from NXP Semiconductors, part of the LPC1700 series. It is based on the ARM Cortex-M3 core, offering high performance and low power consumption. It features a variety of peripherals and interfaces, making it suitable for a wide range of embedded applications.
  • Equivalent

    The equivalent products of LPC1765FBD100,551 chip are LPC1765FBD100,551R, LPC1764FBD100,551 and LPC1763FBD100,551 which have similar features and functionality with minor variations.
  • Features

    The LPC1765FBD100,551 is a 32-bit microcontroller with an ARM Cortex-M3 core operating at up to 100MHz. It has 512KB flash memory, 64KB SRAM, USB host/device/OTG interface, Ethernet MAC, CAN, UART, I2C, SPI, ADC, DAC, timers, PWM, and GPIO. It also has a 10-bit ADC with up to 16 channels and a 10-bit DAC.
  • Pinout

    The LPC1765FBD100,551 is a 100-pin microcontroller from NXP. It features a 32-bit ARM Cortex-M3 core with 512 KB Flash and 64 KB RAM. The pin functions include GPIO, UART, SPI, I2C, ADC, DAC, PWM, and more, making it suitable for a wide range of applications.
  • Manufacturer

    NXP Semiconductors is the manufacturer of the LPC1765FBD100,551. It is a Dutch-American semiconductor manufacturer that designs and sells a variety of products including microcontrollers, power management ICs, and sensors for automotive, industrial, and consumer electronics markets.
  • Application Field

    The LPC1765FBD100,551 microcontroller is commonly used in industrial automation, consumer electronics, automotive control systems, and communication devices. It is also used in embedded systems, smart gadgets, and IoT applications that require high processing power, memory, and various communication interfaces.
  • Package

    The LPC1765FBD100,551 chip comes in a LQFP package, a form of surface mount technology. It has a size of 14mm x 14mm, known as a 100-pin package with a fine pitch of 0.50mm between pins.

Datasheet PDF

Preliminary Specification LPC1765FBD100,551 PDF Download

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  • quantity

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