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NXP LPC55S66JBD100K

STM32L Series 256 KB Flash 144 KB SRAM 100 MHz 32-Bit Microcontroller -HLQFP-100

ISO14001 ISO9001 DUNS

Brands: NXP Semiconductor

Mfr.Part #: LPC55S66JBD100K

Datasheet: LPC55S66JBD100K Datasheet (PDF)

Package/Case: 100-LQFP

Product Type: Microcontrollers

RoHS Status:

Stock Condition: 3,749 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for LPC55S66JBD100K or email to us: Email: [email protected], we will contact you within 12 hours.

LPC55S66JBD100K General Description

With its combination of high performance, versatile peripherals, strong security features, and energy-efficient operation, the LPC55S66JBD100K stands out as a compelling choice for developers seeking a reliable and feature-rich microcontroller solution. Whether used in industrial control systems, automotive electronics, or battery-powered devices, this microcontroller delivers the performance, connectivity, and security necessary for today's demanding embedded applications

Features

  • LPC55S66JBD100K features advanced security capabilities including secure boot and firmware updates
  • The microcontroller has a comprehensive set of interfaces for communication and data exchange
  • It offers 384 kB of flash memory and 96 kB of SRAM for flexible storage options
  • The ARM Cortex-M33 core provides reliable processing performance with low power consumption
  • The microcontroller has a high clock frequency of up to 150 MHz for efficient execution
  • It is suitable for IoT and industrial applications requiring robust security and reliability

Application

  • High-performance automotive
  • Connected smart appliances
  • Secure security systems

Specifications

Parameter Value Parameter Value
feature-tradename feature-data-bus-width-bit 32
feature-interface-type I2C/I2S/SPI/USART/USB feature-minimum-operating-supply-voltage-v 1.8
feature-maximum-operating-supply-voltage-v 3.6 feature-packaging Tray
feature-rad-hard feature-pin-count 100
feature-supplier-package HLQFP EP feature-standard-package-name1
feature-cecc-qualified feature-esd-protection
feature-escc-qualified feature-military No
feature-aec-qualified No feature-aec-qualified-number
feature-auto-motive No feature-p-pap No
feature-eccn-code 5A992c. feature-svhc Yes
feature-svhc-exceeds-threshold No

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The LPC55S66JBD100K is a high-performance microcontroller chip from NXP Semiconductors, featuring a dual-core Arm Cortex-M33 processor, advanced security features, and support for various connectivity options. It is designed for applications requiring secure and efficient processing capabilities, such as industrial automation, IoT devices, and embedded systems.
  • Equivalent

    The LPC55S66JBD100K chip is equivalent to the NXP LPC55S66JBD100 chip. These two chips have the same features and functionalities, but may be packaged differently or have slight variations in specifications.
  • Features

    The LPC55S66JBD100K is a microcontroller from NXP Semiconductors. It features a 150 MHz Arm Cortex-M33 core, 640 KB of flash memory, 256 KB of SRAM, hardware-based security features, advanced power management, and a rich set of peripherals including USB, CAN, and Ethernet interfaces.
  • Pinout

    The LPC55S66JBD100K is a microcontroller with 100 pins. It has a dual-core Arm Cortex-M33 processor, USB interface, multiple communication interfaces (SPI, I2C, UART), analog-to-digital converter (ADC), and timer modules. It is designed for applications requiring high performance and security.
  • Manufacturer

    The manufacturer of LPC55S66JBD100K is NXP Semiconductors. NXP Semiconductors is a multinational semiconductor manufacturer that produces a wide range of products for industries such as automotive, security, and Internet of Things (IoT). They offer solutions for connectivity, processing, and security to enable innovative technologies in various applications.
  • Application Field

    Industrial automation, robotics, Internet of Things (IoT), smart home devices, wearable technology, consumer electronics, security systems, automotive applications, and general embedded systems. The LPC55S66JBD100K microcontroller is ideal for applications that require high performance, low power consumption, and advanced security features.
  • Package

    The LPC55S66JBD100K chip is a BGA (Ball Grid Array) package, J-Link form factor, with a size of 10 mm x 10 mm.

Datasheet PDF

Preliminary Specification LPC55S66JBD100K PDF Download

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  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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