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ADI LTM4632EY#PBF

Step-down voltage regulator with ultrathin profile for memory applications

ISO14001 ISO9001 DUNS

Brands: Analog Devices, Inc

Mfr.Part #: LTM4632EY#PBF

Datasheet: LTM4632EY#PBF Datasheet (PDF)

Package/Case: BGA

Product Type: DC DC Converters

RoHS Status:

Stock Condition: 2,134 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for LTM4632EY#PBF or email to us: Email: [email protected], we will contact you within 12 hours.

LTM4632EY#PBF General Description

Whether used in telecommunications, industrial equipment, or power distribution systems, the LTM4632EY#PBF offers reliability and convenience in power regulation. Its compact size and high efficiency make it an ideal choice for space-constrained applications where power density is crucial. The robust design and advanced features of this micromodule regulator make it a valuable asset for engineers looking to enhance their power designs

Features

  • Sophisticated Digital Control Loop
  • Wide Input Voltage Tolerance
  • High Efficiency Power Conversion
  • Compact Design for Space-Constrained Apps
  • Rapid Response to Load Changes
  • Excellent Line and Load Regulation

Application

  • Compact design
  • Industrial grade reliability
  • Efficient power delivery

Specifications

Parameter Value Parameter Value
feature-number-of-outputs 3 feature-input-output-type DC/DC
feature-output-voltage-v 0.6 to 2.5 feature-efficiency-
feature-packaging Tray feature-rad-hard
feature-pin-count 25 feature-supplier-package BGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-military No
feature-aec-qualified No feature-aec-qualified-number
feature-auto-motive No feature-p-pap No
feature-eccn-code EAR99 feature-svhc
feature-svhc-exceeds-threshold No Series µModule®
Package Tray Product Status Active
Type Non-Isolated PoL Module Number of Outputs 2
Voltage - Input (Min) 3.6V Voltage - Input (Max) 15V
Voltage - Output 1 0.6 ~ 2.5V Voltage - Output 2 0.6 ~ 2.5V
Current - Output (Max) 3A, 3A Applications ITE (Commercial)
Features OTP, OVP Operating Temperature -40°C ~ 125°C
Mounting Type Surface Mount Package / Case 25-PowerBBGA Module
Size / Dimension 0.25" L x 0.25" W x 0.07" H (6.3mm x 6.3mm x 1.8mm) Supplier Device Package 25-BGA (6.25x6.25)
Base Product Number LTM4632

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The LTM4632EY#PBF is a high efficiency, high density buck converter chip from Analog Devices. It is a dual 20A or single 40A output step-down µModule regulator with digital power system management. It offers a small form factor and supports high current applications in various electronic devices.
  • Equivalent

    The equivalent products of LTM4632EY#PBF chip are LTM4632IY#PBF, LTM4632EY#PBF1, LTM4632IY#PBF1, LTM4632CY#PBF, and LTM4632CIY#PBF. These chips are all step-down DC/DC μModule (micromodule) regulators from Analog Devices designed to provide high efficiency power solutions for various applications.
  • Features

    The LTM4632EY#PBF is a high efficiency, compact and regulated dual output step-down DC/DC μModule® regulator. It features wide input voltage range, up to 15A output current, high efficiency up to 90%, programmable frequency and soft-start, overvoltage and overcurrent protection, and adjustable current limit and thermal shutdown.
  • Pinout

    The LTM4632EY#PBF is a DC/DC µModule (micro module) regulator, with 48 pins. It is designed for point-of-load power conversion. The pin functions include inputs for voltage and current sensing, outputs for power delivery, and control pins for enabling and programming the device.
  • Manufacturer

    The manufacturer of the LTM4632EY#PBF is Linear Technology, a semiconductor company that designs, manufactures, and markets a broad line of high-performance analog and mixed-signal integrated circuits for major companies worldwide.
  • Application Field

    The LTM4632EY#PBF is a high efficiency 20A step-down power module designed for a wide range of applications including industrial, automotive, telecom, and networking. It provides a compact, rugged, and reliable power solution for these industries, offering a small form factor and high power density for space-constrained applications.
  • Package

    The LTM4632EY#PBF chip is a 15mm x 15mm x 2.82mm BGA (Ball Grid Array) package, which is a type of surface-mount chip package that uses an array of solder balls for electrical connections.

Datasheet PDF

Preliminary Specification LTM4632EY#PBF PDF Download

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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