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$5000Microchip M2S090T-1FG676I
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Brands: Microchip Technology
Mfr.Part #: M2S090T-1FG676I
Datasheet: M2S090T-1FG676I Datasheet (PDF)
Package/Case: BGA-676
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2,542 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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M2S090T-1FG676I General Description
In the realm of FPGA devices, the M2S090T-1FG676I from Microchip is a standout choice for its comprehensive feature set and proven reliability. Whether used for tasks like input/output expansion, bridging functions, or secure connectivity, this device offers a versatile solution for a variety of applications. With support for PCIe Gen2 and a low power consumption of 70mW per 5G SERDES, the FPGA device delivers high performance while minimizing energy usage. Moreover, the device's security features protect against unauthorized access and ensure the integrity of the system, making it a trusted choice for critical applications in industries like Defense and Aviation
Features
- Safety and Reliability
- Fail-safe design for high-reliability applications
- Redundancy and fault detection mechanisms
- Error correction codes and data integrity checking
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer: | Microchip | Product Category: | SoC FPGA |
| RoHS: | N | Mounting Style: | SMD/SMT |
| Package / Case: | BGA-676 | Core: | ARM Cortex M3 |
| Number of Cores: | 1 Core | Maximum Clock Frequency: | 166 MHz |
| L1 Cache Instruction Memory: | - | L1 Cache Data Memory: | - |
| Program Memory Size: | 512 kB | Data RAM Size: | 64 kB |
| Number of Logic Elements: | 86316 LE | Brand: | Microchip Technology |
| Moisture Sensitive: | Yes | Number of Logic Array Blocks - LABs: | 7193 LAB |
| Packaging: | Tray | Product Type: | SoC FPGA |
| Series: | SmartFusion2 | Factory Pack Quantity: | 40 |
| Subcategory: | SOC - Systems on a Chip | feature-maximum-internal-frequency-mhz | |
| feature-process-technology | 65nm | feature-minimum-operating-supply-voltage-v | 1.14 |
| feature-device-system-gates | feature-maximum-operating-supply-voltage-v | 1.26 | |
| feature-programmability | Yes | feature-maximum-propagation-delay-time-ns | |
| feature-packaging | Tray | feature-maximum-operating-frequency-mhz | |
| feature-rad-hard | feature-pin-count | 676 | |
| feature-supplier-package | FBGA | feature-standard-package-name1 | BGA |
| feature-cecc-qualified | No | feature-esd-protection | |
| feature-escc-qualified | feature-military | No | |
| feature-aec-qualified | No | feature-aec-qualified-number | |
| feature-auto-motive | No | feature-p-pap | No |
| feature-eccn-code | 3A991.d. | feature-svhc | |
| feature-svhc-exceeds-threshold | No | Series | SmartFusion®2 |
| Package | Tray | Product Status | Active |
| Architecture | MCU, FPGA | Core Processor | ARM® Cortex®-M3 |
| Flash Size | 512KB | RAM Size | 64KB |
| Peripherals | DDR, PCIe, SERDES | Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Speed | 166MHz | Primary Attributes | FPGA - 90K Logic Modules |
| Operating Temperature | -40°C ~ 100°C (TJ) | Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) | Number of I/O | 425 |
| Base Product Number | M2S090 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The M2S090T-1FG676I chip is a high-performance FPGA (Field-Programmable Gate Array) manufactured by Microchip Technology. It features 90,000 logic cells, 268 user I/O pins, and a compact 676-pin package. This chip offers programmable logic, memory, and high-speed interfaces, making it suitable for a wide range of embedded applications.
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Equivalent
The equivalent products of M2S090T-1FG676I chip are Xilinx Spartan-3 FPGA family, specifically XC3S1000-4FG676C and XC3S2000-4FG676C. These chips offer similar capabilities and performance for FPGA applications. -
Features
The M2S090T-1FG676I is a Field Programmable Gate Array (FPGA) with 90,000 logic elements, 3,520 kbits of embedded memory, and 58 embedded multiplier blocks. It also features 150 user I/Os, multiple high-speed transceivers, and advanced system-level power management capabilities. -
Pinout
The M2S090T-1FG676I has a pin count of 676. This FPGA (Field-Programmable Gate Array) is designed for high-performance applications and includes features such as logic blocks, memory blocks, and digital signal processing blocks, making it suitable for a wide range of functions including data processing, communication, and industrial automation. -
Manufacturer
The manufacturer of the M2S090T-1FG676I is Microsemi Corporation. It is a provider of semiconductor and system solutions for aerospace & defense, communications, data center, and industrial markets. The company specializes in developing high-performance, reliable, and cutting-edge technology solutions for a wide range of applications. -
Application Field
The M2S090T-1FG676I is commonly used in various industrial applications such as robotics, automation, telecommunication, and consumer electronics due to its high performance and low power consumption. It is also used in automotive systems, medical devices, and military equipment for reliable and efficient operation. -
Package
The M2S090T-1FG676I chip comes in a Ball Grid Array (BGA) package, has a form factor of 676 pins, and a size of 17mm x 17mm.
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Minimum order quantity starts from 1pcs.
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