Orders Over
$5000MCF5307FT90B
Innovative microcontroller IC for industrial and consumer electronics
Brands: NXP USA Inc.
Mfr.Part #: MCF5307FT90B
Datasheet: MCF5307FT90B Datasheet (PDF)
Package/Case: 208-BFQFP
Product Type: Microcontrollers
RoHS Status:
Stock Condition: 6,020 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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MCF5307FT90B General Description
Moreover, the MCF5307FT90B doesn't fall short on security and efficiency, thanks to its memory management unit (MMU) for virtual memory support. Operating between -40 to 105 degrees Celsius, this processor thrives in industrial and automotive settings. Packed neatly in a 256-pin BGA package, this powerhouse is engineered for compact designs without compromising on performance
Features
- Version 3 ColdFire® core with EMAC
- Up to 211 Dhrystone 2.1 MIPS @ 240 MHz
- 16 KBytes unified instruction/data cache
- 128 KBytes internal SRAM with standby power supply support
- Crossbar switch technology (XBS) for concurrent access to peripherals or RAM from multiple bus masters
- Enhanced Secure Digital Host Controller (eSDHC)
- – Supports CE-ATA, SD Memory, miniSD Memory, SDIO, miniSDIO, SD Combo, MMC, MMC plus, MMC 4x, and MMC RS cards
- Two ISO7816 smart card interfaces
- IC identification module
- Voice-band audio codec with integrated speaker, microphone, headphone, and handset amplifiers
- 16- or 32-bit SDR, 16-bit DDR/mobile-DDR SDRAM controller
- USB 2.0 On-the-Go controller
- USB host controller
- 2 10/100 Ethernet MACs
- Coprocessor for acceleration of the DES, 3DES, AES, MD5, and SHA-1 algorithms
- Random number generator
- 16-channel DMA controller
- Synchronous serial interface
- 4 periodic interrupt timers
- 4 32-bit timers with DMA support
- Real-time clock (RTC) module with standby support
- DMA-supported serial peripheral interface (DSPI)
- 3 UARTs
- I2C bus interface
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Series | MCF530x | Package | Tray |
Product Status | Obsolete | Programmabe | Not Verified |
Core Processor | Coldfire V3 | Core Size | 32-Bit Single-Core |
Speed | 90MHz | Connectivity | EBI/EMI, I2C, UART/USART |
Peripherals | DMA, POR, WDT | Number of I/O | 16 |
Program Memory Type | ROMless | RAM Size | 4K x 8 |
Voltage - Supply (Vcc/Vdd) | 3V ~ 3.6V | Oscillator Type | External |
Operating Temperature | 0°C ~ 70°C (TA) | Mounting Type | Surface Mount |
Supplier Device Package | 208-FQFP (28x28) | Package / Case | 208-BFQFP |
Base Product Number | MCF5307 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The MCF5307FT90B is a microcontroller chip from Freescale Semiconductor, designed for embedded applications. It features a PowerPC core operating at 90MHz, integrated peripherals, and low-power consumption. This chip is commonly used in industrial control systems, automotive electronics, and consumer electronics.
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Equivalent
The equivalent products of the MCF5307FT90B chip are the MCF5307CA90B, MCF5307CV90B, and MCF5307EV90B chips. These chips are part of the MCF5307 series of microprocessors produced by Freescale Semiconductor, offering similar features and performance capabilities. -
Features
MCF5307FT90B is a highly integrated microprocessor from Freescale with a PowerPC core running at 90 MHz. It features a 32-bit data bus, 16-bit address bus, integrated peripherals, and memory management unit. It is suitable for applications where low power consumption, high performance, and real-time processing are crucial. -
Pinout
The MCF5307FT90B is a 180-pin BGA (Ball Grid Array) package microprocessor from Freescale Semiconductor. It is based on the ColdFire V3 core and operates at a frequency of 90 MHz. It is designed for embedded applications requiring high performance and low power consumption. -
Manufacturer
The MCF5307FT90B is manufactured by NXP Semiconductors. NXP is a semiconductor company that designs and manufactures a wide range of products used in various industries, including automotive, consumer electronics, and networking. They are known for their expertise in developing secure and connected solutions for the Internet of Things (IoT) and automotive technologies. -
Application Field
The MCF5307FT90B is commonly used in industrial automation, automotive systems, handheld devices, and consumer electronics. It is also suitable for applications that require high performance, low power consumption, and integrated peripherals such as USB, Ethernet, and CAN interfaces. -
Package
The MCF5307FT90B chip comes in a ball grid array (BGA) package type with a form factor of 668-BBGA. The dimensions of the package are 35mm x 35mm, and the size of the chip itself is 23mm x 23mm.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products