Orders Over
$5000MR4A08BCYS35
Durable magnetoresistive technology ensures reliable data retention
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Brands: Everspin Technologies Inc.
Mfr.Part #: MR4A08BCYS35
Datasheet: MR4A08BCYS35 Datasheet (PDF)
Package/Case: 44-TSOP
Product Type: Memory
RoHS Status:
Stock Condition: 9,151 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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MR4A08BCYS35 General Description
MRAM (Magnetoresistive RAM) Memory IC 16Mbit Parallel 35 ns 44-TSOP2
Specifications
Parameter | Value | Parameter | Value |
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Package | Tray | Product Status | Active |
Programmabe | Not Verified | Memory Type | Non-Volatile |
Memory Format | RAM | Technology | MRAM (Magnetoresistive RAM) |
Memory Size | 16Mbit | Memory Organization | 2M x 8 |
Memory Interface | Parallel | Write Cycle Time - Word, Page | 35ns |
Access Time | 35 ns | Voltage - Supply | 3V ~ 3.6V |
Operating Temperature | -40°C ~ 85°C (TA) | Mounting Type | Surface Mount |
Package / Case | 44-TSOP (0.400", 10.16mm Width) | Supplier Device Package | 44-TSOP2 |
Base Product Number | MR4A08 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The MR4A08BCYS35 chip is a non-volatile memory device commonly used in automotive applications. It offers high reliability, fast read and write speeds, and a wide operating temperature range. The chip is ideal for storing critical data in harsh environments and is built to withstand the demands of automotive systems.
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Equivalent
The equivalent products of MR4A08BCYS35 chip are JZM5665A, HX8837-D, LC450EUC, and HY 9889. These chips have similar functions and features, making them suitable replacements for the MR4A08BCYS35 chip. -
Features
MR4A08BCYS35 is a 8GB DDR4 SDRAM memory module with 2666MHz speed, CL19 latency, and operates at 1.2V. It has a non-ECC unbuffered form factor and uses a 260-pin SO-DIMM interface. It is designed for use in laptops and small form factor PCs. -
Pinout
The MR4A08BCYS35 is a 256Mb SDRAM chip with a 54-pin BGA package. It features a 32-bit data bus width, 133MHz clock speed, and CAS latency of 3. The pins provide functions such as data input/output, address input, control signals, and power supply connections. -
Manufacturer
Samsung is the manufacturer of the MR4A08BCYS35. It is a South Korean multinational conglomerate company primarily producing electronics, such as smartphones, televisions, and home appliances. It is one of the largest technology companies in the world. -
Application Field
The MR4A08BCYS35 is commonly used in automotive electronics, industrial applications, and consumer electronics. It is specifically designed for use in applications that require high performance, low power consumption, and reliability, such as dashboard displays, electronic control units, and communication systems. -
Package
The MR4A08BCYS35 chip is a BGA (Ball Grid Array) package type with 128-ball configuration. It comes in a 14 mm x 18 mm x 1.2 mm form factor.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products