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MS81V32322-66TBZ03A

Reliable memory solution for advanced applications

ISO14001 ISO9001 DUNS

Brands: Oki

Mfr.Part #: MS81V32322-66TBZ03A

Datasheet: MS81V32322-66TBZ03A Datasheet (PDF)

Package/Case: QFP-128

Product Type: Memory Misc

RoHS Status:

Stock Condition: 6,554 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for MS81V32322-66TBZ03A or email to us: Email: [email protected], we will contact you within 12 hours.

Ovaga has a large stock of MS81V32322-66TBZ03A Memory Misc from Oki and we guarantee that they are original,brand new parts sourced directly from Oki We can provide quality testing reports for MS81V32322-66TBZ03A upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.

Specifications

Parameter Value Parameter Value
RoHS Version 2002/95/EC

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • MS81V32322-66TBZ03A is a microcontroller chip from Toshiba, known for its high-performance 32-bit RISC architecture. It features a clock speed of 66 MHz and is designed for embedded control applications in various industries, such as automotive and industrial automation. This chip offers advanced capabilities and integrated peripherals for efficient and reliable operation.
  • Equivalent

    Some equivalent products of MS81V32322-66TBZ03A chip include CY7C1296L, MT58L128L32, and AS4C64M32MD3-12BCN. These chips offer similar specifications and features, making them suitable alternatives for the MS81V32322-66TBZ03A in certain applications.
  • Features

    - Size: 32Mb x 32 - Speed: 66MHz - Low power consumption - Operating voltage: 3.3V - Industrial temperature range - Burst length of 1, 2, 4, 8 or full page - Synchronous SRAM with pipelined architecture
  • Pinout

    The MS81V32322-66TBZ03A is a 324-pin BGA package with a 32-bit RISC microprocessor. It features a clock speed of 66 MHz and is commonly used in networking and communications applications.
  • Manufacturer

    The manufacturer of MS81V32322-66TBZ03A is Toshiba Corporation. Toshiba Corporation is a multinational conglomerate company based in Japan, specializing in a wide range of products and services including information technology, electronics, and semiconductors.
  • Application Field

    MS81V32322-66TBZ03A is commonly used in data storage systems, networking equipment, industrial automation, and telecommunications applications. It is ideal for use in high-performance computing, cloud computing, and big data processing due to its high speed, large capacity, and low power consumption characteristics.
  • Package

    The MS81V32322-66TBZ03A is a BGA (Ball Grid Array) package chip with a form factor of 1.25mm x 1.25mm. The size of the chip is 5.62mm x 5.62mm.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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