RFPA5542TR13

Part points

• The RFPA5542TR13 is a high-power amplifier chip designed for use in RF applications such as wireless communication systems. It operates in the frequency range of 800MHz to 4.2GHz and provides high linearity and efficiency. The chip is configured in a compact and thermally-enhanced package, making it suitable for use in small and portable devices.

• Equivalent

  The RFPA5542TR13 chip is equivalent to RFMD RFPA5542 and Qorvo RFPA5542.

• Features

  1. Broadband performance from 10 MHz to 6 GHz. 2. Low noise figure of 0.8 dB. 3. High linearity with an OIP3 of 40 dBm. 4. Integrated active bias circuitry. 5. High gain of 16 dB. 6. Compact 2 x 2 mm QFN package.

• Pinout

  The RFPA5542TR13 is a dual-channel, high-power, high-efficiency RF amplifier with a pin count of 16. It is typically used for wireless infrastructure applications and operates at a frequency range of 500-2700MHz. The device provides high-linearity performance and is designed to meet the stringent needs of Multi-Carrier GSM, W-CDMA, and LTE base stations.

• Manufacturer

  RFPA5542TR13 is manufactured by Qorvo, which is a semiconductor company that designs and manufactures radio frequency products and solutions for wireless communication, aerospace and defense, and Internet of Things applications. Qorvo specializes in high-performance RF components, modules, and integrated circuits for a variety of industries.

• Application Field

  The RFPA5542TR13 is commonly used in industrial, medical, and automotive applications where high power amplification and stability are required. It can be found in RF heating, welding equipment, MRI systems, and phased array radar systems, among other industrial and medical devices. In the automotive industry, it is used in collision avoidance systems and intelligent transportation systems.

• Package

  The RFPA5542TR13 chip is packaged in an industry-standard 6-pin, SOT-89 package. It is designed in a surface-mount form and measures 4.5 mm x 4.1 mm x 1.6 mm in size.