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Intel TE28F128J3C150

High-Speed 3V NOR Flash Memory

ISO14001 ISO9001 DUNS

Brands: Intel

Mfr.Part #: TE28F128J3C150

Datasheet: TE28F128J3C150 Datasheet (PDF)

Package/Case: TSOP

Product Type: Memory

RoHS Status:

Stock Condition: 3,526 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for TE28F128J3C150 or email to us: Email: [email protected], we will contact you within 12 hours.

TE28F128J3C150 General Description

In addition to its impressive technical specifications, the TE28F128J3C-150 supports industry-standard interfaces like parallel and serial interfaces, allowing for seamless integration into a variety of system designs. This versatility makes it a popular choice among developers and engineers looking for a robust and efficient flash memory solution for their projects

te28f128j3c150

Features

  • Fully programmable memory mapping
  • Built-in error correction capabilities
  • DMA and interrupt-driven operation
te28f128j3c150

Application

  • Advanced technology applications
  • High-performance solutions
  • Next-gen product uses
  • Innovative system integration
  • Cutting-edge device utilization
  • Efficient technology implementation
Intel Inventory

Specifications

Parameter Value Parameter Value
ECCN (US) 3A991b.1.a. Part Status Obsolete
HTS 8542.32.00.71 Automotive No
PPAP No Cell Type NOR
Chip Density (bit) 128M Architecture Sectored
Boot Block No Block Organization Symmetrical
Address Bus Width (bit) 24/23 Sector Size 128Kbyte x 128
Page Size 4Words/8Words Number of Bits/Word (bit) 8/16
Number of Words 16M/8M Programmability Yes
Timing Type Asynchronous Max. Access Time (ns) 150
Maximum Erase Time (s) 5/Block Maximum Page Access Time (ns) 25
Maximum Programming Time (ms) 0.63/Byte OE Access Time (ns) 25
Process Technology CMOS Interface Type Parallel
Minimum Operating Supply Voltage (V) 2.7 Typical Operating Supply Voltage (V) 3|3.3
Maximum Operating Supply Voltage (V) 3.6 Programming Voltage (V) 2.7 to 3.6
Page Read Current (mA) 54 Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85 Supplier Temperature Grade Extended
Command Compatible No ECC Support No
Support of Page Mode Yes Packaging Tray
Mounting Surface Mount Package Height 1
Package Width 18.4 Package Length 14
PCB changed 56 Standard Package Name SO
Supplier Package TSOP Pin Count 56
Lead Shape Gull-wing

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the TE28F128J3C150 component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   AM29LV128ML

Brands :   AMD

Package :  

Description :  

Part Number :   AT49BV12890TU

Brands :  

Package :  

Description :   (Atmel)

Part Number :   S29GL128N90TFIR2

Brands :  

Package :  

Description :   (Cypress Semiconductor)

Part Number :   M58LW128D110N6

Brands :   STMicroelectronics

Package :  

Description :  

Part points

  • TE28F128J3C150 is a 128Mb flash memory chip with 150ns access time. It is commonly used in embedded systems, networking devices, and industrial applications for storing firmware and data. The chip offers reliable and fast read/write operations, making it ideal for applications that require high performance and durability.
  • Equivalent

    Some equivalent products to the TE28F128J3C150 chip include the Intel 28F128J3A, Micron MT28F128J3, and Spansion S29GL-P. These chips have similar specifications and functions, making them suitable alternatives for the TE28F128J3C150.
  • Features

    The TE28F128J3C150 is a NAND flash memory IC with a capacity of 128Mb. It features a 150ns access time, a x16 bus width, and operates on a voltage range of 2.7V to 3.6V. It also has a high endurance and reliability with a 10-year minimum data retention.
  • Pinout

    The TE28F128J3C150 is a 56-pin Flash memory chip with a capacity of 128MB. It is used for storing data in electronic devices. The pin functions include data input/output, address lines, control signals, and power supply pins.
  • Manufacturer

    The TE28F128J3C150 is manufactured by Intel Corporation, which is an American multinational corporation that produces computer and networking hardware and software. Intel is one of the world's largest and highest-valued semiconductor chip makers, known for its processors found in many personal computers.
  • Application Field

    The TE28F128J3C150 is a flash memory device commonly used in telecommunications, industrial control systems, automotive applications, and consumer electronics. It is also suitable for use in networking, medical devices, and other embedded systems that require reliable, non-volatile storage.
  • Package

    The TE28F128J3C150 chip is a BGA package type with a surface mount form factor. It has a size of 14mm x 14mm.

Datasheet PDF

Preliminary Specification TE28F128J3C150 PDF Download

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