XC17S200APD8C

Part points

• The XC17S200APD8C chip is a field-programmable gate array (FPGA) developed by Xilinx. It features 200,000 system gates with 8 ns pin-to-pin delays and high-performance general-purpose I/O capabilities. The chip offers advanced programmability, making it suitable for a wide range of applications such as networking, telecommunications, and consumer electronics.

• Features

  XC17S200APD8C is a high-performance field-programmable gate array (FPGA) with 200,000 system gates. It offers 200 programmable inputs/outputs, a 9ns pin-to-pin delay, and consumes low power. This FPGA also has flash memory technology, making it possible to reprogram the device an infinite number of times.

• Pinout

  The XC17S200APD8C has a pin count of 208. It is a high-performance, high-speed Field Programmable Gate Array (FPGA) with a capacity of 2 million system gates. It is designed for telecommunications, networking, and high-performance computing applications.

• Manufacturer

  The manufacturer of the XC17S200APD8C is Xilinx Inc. It is an American technology company specializing in the development and production of programmable logic devices (PLDs), including field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs).

• Application Field

  The XC17S200APD8C is an application-specific programmable integrated circuit (ASIC) that can be used in a variety of applications, including telecommunications, networking, and data storage. It is commonly used in devices where high performance and high-density programmable logic are required.

• Package

  The XC17S200APD8C chip has a package type of PLCC (Plastic Leaded Chip Carrier), a form of DIP (Dual In-line Package), and a size of 8.51mm x 13.55mm.