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XC17S30APD8C

Field programmable gate array configuration memory

ISO14001 ISO9001 DUNS

Brands: Amd

Mfr.Part #: XC17S30APD8C

Datasheet: XC17S30APD8C Datasheet (PDF)

Package/Case: DIP-8

Product Type: Configuration PROMs for FPGAs

RoHS Status:

Stock Condition: 8,587 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XC17S30APD8C or email to us: Email: [email protected], we will contact you within 12 hours.

Features

  • Xilinx XC17S30APD8C offers advanced programmable read-only memory (PROM) capabilities
  • With excellent performance, low power consumption, and high density
  • This feature-rich device is suitable for various applications and easy to integrate with other Xilinx components

Application

  • Industrial automation
  • High performance
  • Harsh environments

Specifications

Parameter Value Parameter Value
Package Tube Product Status Obsolete
Programmabe Verified Programmable Type OTP
Memory Size 300kb Voltage - Supply 3V ~ 3.6V
Operating Temperature 0°C ~ 70°C Mounting Type Through Hole
Package / Case 8-DIP (0.300", 7.62mm) Supplier Device Package 8-PDIP
Base Product Number XC17S30

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC17S30APD8C is a field-programmable gate array (FPGA) chip designed and manufactured by Xilinx. It features 30,000 system gates, 512 logic cells, and 64 I/O pads. With its advanced programmable logic technology, the chip is ideal for applications requiring high-speed data processing and complex logic functions.
  • Equivalent

    Some equivalent products of the XC17S30APD8C chip include the XCR3256XL-10FTG256C, XC17S20APD8I, XC17S20APDG8C, XCR3256XL-10CSG144C, XC17V04VQ44I, and the XCR3256XL-10PQ208I. These chips are all similar in functionality and can be used as alternatives to the XC17S30APD8C in certain applications.
  • Features

    The XC17S30APD8C is a field programmable gate array (FPGA) with 30,000 system gates, 512 macrocells, and 8 dedicated global low-skew clock networks. It features 3.3V or 5V operation, on-chip fast inhibit control, and highly routable and versatile building block architecture for easy design implementations.
  • Pinout

    The XC17S30APD8C is a 44-pin, 5V in-system programmable configuration PROM. It is used as a configuration device for Xilinx FPGA devices. The pin count and function are as follows: Pin Count: 44 Function: In-system programmable configuration PROM for Xilinx FPGA devices.
  • Manufacturer

    The XC17S30APD8C is manufactured by Xilinx, Inc., which is a semiconductor company specializing in programmable logic devices, including FPGAs, SoCs, and ACAPs. Xilinx is a global leader in the field of adaptive and intelligent computing and provides solutions for a wide range of industries including automotive, aerospace, data center, and telecommunications.
  • Application Field

    The XC17S30APD8C is a field-programmable gate array (FPGA) used in a wide range of applications including telecommunications, automotive, industrial control, and consumer electronics. It is commonly used for device prototyping, system validation, and low to medium volume production due to its flexibility and reprogrammability.
  • Package

    The XC17S30APD8C chip comes in a 44-pin Plastic Dual In-Line Package (PDIP), and its form is surface mount. The size of the chip is 0.300 inch wide and 1.460 inch long.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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