This website uses cookies. By using this site, you consent to the use of cookies. For more information, please take a look at our Privacy Policy.

Orders Over

$5000
Get a $50 Discount !

XC17S50APDG8C

Non-volatile Memory Solutions

ISO14001 ISO9001 DUNS

Brands: AMD

Mfr.Part #: XC17S50APDG8C

Datasheet: XC17S50APDG8C Datasheet (PDF)

Package/Case: 8-DIP

Product Type: Configuration PROMs for FPGAs

RoHS Status:

Stock Condition: 6,853 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XC17S50APDG8C or email to us: Email: [email protected], we will contact you within 12 hours.

Features

  • Product description here
  • Fresh updates available
  • User interface enhanced
  • More information coming soon

Application

  • Flexible signal processing
  • High-performance encryption

Specifications

Parameter Value Parameter Value
Package Tube Product Status Obsolete
Programmabe Not Verified Programmable Type OTP
Memory Size 500kb Voltage - Supply 3V ~ 3.6V
Operating Temperature 0°C ~ 70°C Mounting Type Through Hole
Package / Case 8-DIP (0.300", 7.62mm) Supplier Device Package 8-PDIP
Base Product Number XC17S50A

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC17S50APDG8C chip is a high-performance CPLD designed by Xilinx. It features 50,000 system gates, eight ns pin-to-pin logic delays, and is ideal for implementing low-power, high-speed logic functions in various applications. With advanced design features and excellent performance capabilities, this chip is a popular choice for a wide range of electronic designs.
  • Equivalent

    The equivalent products of XC17S50APDG8C chip are Xilinx XC17S50APG223C, XC17S50AVO8C, XC17S50AVO8C, and XC95144-10PQG100C.
  • Features

    XC17S50APDG8C is a high-performance, reprogrammable, PROM-based FPGA that offers 50,000 system gates, 298 programmable I/Os, and a 4.8 ns pin-to-pin delay. It features a 3.3V power supply, has a Pb-free package, and operates at a maximum frequency of 270 MHz.
  • Pinout

    The XC17S50APDG8C has a pin count of 44 and functions as a low-power, high-performance 3.3V, in-system programmable CMOS Flash PROM. It features a 128Kbit (64K X 16) configuration with a serial/parallel access.
  • Manufacturer

    The manufacturer of the XC17S50APDG8C is Xilinx, Inc. It is an American technology company that specializes in the design and development of programmable logic devices and associated software. Xilinx is a leading provider of FPGA and SoC solutions for a wide range of industries, including aerospace, automotive, telecommunications, and consumer electronics.
  • Application Field

    The XC17S50APDG8C is a high-performance, low-power FPGA typically used in communication systems, industrial control, automotive systems, consumer electronics, and aerospace applications. It is commonly utilized in design projects requiring high-speed operations, efficiency, and reliability.
  • Package

    The XC17S50APDG8C chip is in a TQG48 package, has a surface mount form, and measures 7mm x 7mm in size.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

Ratings and Reviews

Ratings
Please rate the product !
Please enter a comment

Please submit comments after logging into your account.

Submit

Recommend