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Xilinx XC6SLX25-3FT256I 48HRS

Scalable, versatile processor-based SoC development platfor

ISO14001 ISO9001 DUNS

Brands: Amd

Mfr.Part #: XC6SLX25-3FT256I

Datasheet: XC6SLX25-3FT256I Datasheet (PDF)

Package/Case: FBGA-256

RoHS Status:

Stock Condition: 2,499 pcs, New Original

Product Type: FPGAs (Field Programmable Gate Array)

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $272.343 $272.343
180 $108.668 $19560.240
540 $105.037 $56719.980
990 $103.242 $102209.580

In Stock: 2,499 PCS

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Quick Quote

Please submit RFQ for XC6SLX25-3FT256I or email to us: Email: [email protected], we will contact you within 12 hours.

XC6SLX25-3FT256I General Description

Featuring a 256-pin fine-pitch ball grid array (FBGA) package, the XC6SLX25-3FT256I is well-suited for compact designs with limited board space. Operating at a supply voltage of 1.2V, its power consumption varies based on configuration and resource utilization, offering flexibility in powering diverse applications. Leveraging Xilinx's Vivado design suite, programming and integrating this FPGA is a seamless process. The suite provides a comprehensive set of tools for designing, implementing, and debugging FPGA designs. Additionally, the XC6SLX25-3FT256I supports a range of industry-standard interfaces, including PCIe, Gigabit Ethernet, and DDR3 memory, ensuring effortless integration into existing systems

xc6slx253ft256i

Features

  • 25,440 logic cells
  • 576 Kb block RAM
  • 20 DSP slices
  • 4 clock management tiles
  • 3,840 slices
  • 144 I/O pins
  • Maximum clock frequency of 400 MHz

Application

  • EP2C20F256C8N by Intel (formerly Altera)
  • LFE3-35EA-6FN484C by Lattice Semiconductor
  • A3P1000-1FG256I by Microsemi Corporation
Amd Inventory

Specifications

Parameter Value Parameter Value
Case/Package BGA Mount Surface Mount
Number of Pins 256 Max Operating Temperature 100 °C
Min Operating Temperature -40 °C Number of I/Os 186
Number of Logic Blocks (LABs) 1879 Number of Logic Elements/Cells 24051
Number of Registers 30064 Operating Supply Voltage 1.2 V
RAM Size 117 kB

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC6SLX25-3FT256I is a Field-Programmable Gate Array (FPGA) chip from Xilinx, featuring 24,576 logic cells, 560 Kb of Block RAM, and 96 DSP slices. It is ideal for applications requiring high parallel processing capabilities, such as signal processing, image and video processing, and networking.
  • Equivalent

    Some equivalent products of XC6SLX25-3FT256I chip are XC6SLX25-3FTG256I, XC6SLX25-3FTG256C, and XC6SLX25-3CSG324I. These chips are part of the Xilinx Spartan-6 family and offer similar features and functionality.
  • Features

    - 25,000 logic cells - 1,400 Kbits of RAM - 16 DSP slices - 3.75 Gbps transceivers - Internal configuration memory - Power-efficient design - Flexible and customizable - High-performance processing - Ideal for communications, industrial, and consumer applications.
  • Pinout

    The XC6SLX25-3FT256I is a 256-pin FPGA from Xilinx with 25,000 logic cells. It functions as a programmable logic device for high-performance applications, featuring 6 input buffers and 6 output buffers.
  • Manufacturer

    The manufacturer of the XC6SLX25-3FT256I is Xilinx. Xilinx is an American technology company that specializes in the development and manufacturing of field-programmable gate array (FPGA) products. They are known for their high-performance, programmable logic devices that are used in a wide range of applications such as 5G wireless, data centers, and automotive electronics.
  • Application Field

    The XC6SLX25-3FT256I is commonly used in various applications such as industrial control systems, communication devices, medical equipment, automotive systems, and aerospace applications. It is well-suited for tasks that require high-performance processing, low-power consumption, and high reliability in harsh environments.
  • Package

    The XC6SLX25-3FT256I chip comes in a 256-ball fine pitch ball grid array (FBGA) package. It is in a form factor of 12x12 mm and has a size of 256 pins.

Datasheet PDF

Preliminary Specification XC6SLX25-3FT256I PDF Download

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