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$5000XPC823ZT66B2
The XPC823ZT66B2 boasts a 66MHz clock speed and 32-bit architecture in a PBGA256 package, making it a powerful RISC microprocessor
Brands: MOTOROLA INC
Mfr.Part #: XPC823ZT66B2
Datasheet: XPC823ZT66B2 Datasheet (PDF)
Package/Case: BGA-256
Product Type: Microprocessors
RoHS Status:
Stock Condition: 6,554 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Features
- The following list summarizes the key MPC860
- features:
- Embedded single-issue, 32-bit MPC8xx core (implementing the PowerPC architecture) with thirty-two 32-bit general-purpose registers (GPRs)
- — The core performs branch prediction with conditional prefetch, without conditional execution
- — 4- or 8-Kbyte data cache and 4- or 16-Kbyte instruction cache (see Table 1)
- – 16-Kbyte instruction caches are four-way, set-associative with 256 sets;
- 4-Kbyte instruction caches are two-way, set-associative with 128 sets.
- – 8-Kbyte data caches are two-way, set-associative with 256 sets; 4-Kbyte data caches are two-way, set-associative with 128 sets.
- – Cache coherency for both instruction and data caches is maintained on 128-bit (4-word) cache blocks.
- – Caches are physically addressed, implement a least recently used (LRU) replacement algorithm, and are lockable on a cache block basis.
- — Instruction and data caches are two-way, set-associative, physically addressed, LRU replacement, and lockable on-line granularity.
- — MMUs with 32-entry TLB, fully associative instruction, and data TLBs
- — MMUs support multiple page sizes of 4, 16, and 512 Kbytes, and 8 Mbytes; 16 virtual address spaces and 16 protection groups
- — Advanced on-chip-emulation debug mode
- Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits)
- 32 address lines
- Operates at up to 80 MHz
- Memory controller (eight banks)
- — Contains complete dynamic RAM (DRAM) controller
- — Each bank can be a chip select or RASto support a DRAM bank
- — Up to 15 wait states programmable per memory bank
- — Glueless interface to DRAM, SIMMS, SRAM, EPROM, Flash EPROM, and other memory devices.
- — DRAM controller programmable to support most size and speed memory interfaces
- — Four CASlines, four WElines, one OEline
- — Boot chip-select available at reset (options for 8-, 16-, or 32-bit memory)
- — Variable block sizes (32 Kbyte to 256 Mbyte)
- — Selectable write protection
- — On-chip bus arbitration logic
- General-purpose timers
- — Four 16-bit timers or two 32-bit timers
- — Gate mode can enable/disable counting
- — Interrupt can be masked on reference match and event capture
- System integration unit (SIU)
- — Bus monitor
- — Software watchdog
- — Periodic interrupt timer (PIT)
- — Low-power stop mode
- — Clock synthesizer
- — Three parallel I/O registers with open-drain capability
- Four baud-rate generators (BRGs)
- — Independent (can be connected to any SCC or SMC)
- — Allow changes during operation
- — Autobaud support option
- Four serial communications controllers (SCCs)
- — Ethernet/IEEE 802.3 optional on SCC1–4, supporting full 10-Mbps operation (available only on specially programmed devices).
- — HDLC/SDLC(all channels supported at 2 Mbps)
- — HDLC bus (implements an HDLC-based local area network (LAN))
- — Asynchronous HDLC to support PPP (point-to-point protocol)
- — AppleTalk
- — Universal asynchronous receiver transmitter (UART)
- — Synchronous UART
- — Serial infrared (IrDA)
- — Binary synchronous communication (BISYNC)
- — Totally transparent (bit streams)
- — Totally transparent (frame based with optional cyclic redundancy check (CRC))
- Two SMCs (serial management channels)
- — UART
- — Transparent
- — General circuit interface (GCI) controller
- — Can be connected to the time-division multiplexed (TDM) channels
- One SPI (serial peripheral interface)
- — Supports master and slave modes
- — Supports multimaster operation on the same bus
- One I2C (inter-integrated circuit) port
- — Supports master and slave modes
- — Multiple-master environment support
- Time-slot assigner (TSA)
- — Allows SCCs and SMCs to run in multiplexed and/or non-multiplexed operation
- — Supports T1, CEPT, PCM highway, ISDN basic rate, ISDN primary rate, user defined
- — 1- or 8-bit resolution
- — Allows independent transmit and receive routing, frame synchronization, clocking
- — Allows dynamic changes
- — Can be internally connected to six serial channels (four SCCs and two SMCs)
- Parallel interface port (PIP)
- — Centronics interface support
- — Supports fast connection between compatible ports on the MPC860 or the MC68360
- PCMCIA interface
- — Master (socket) interface, release 2.1 compliant
- — Supports two independent PCMCIA sockets
- — Eight memory or I/O windows supported
- Low power support
- — Full on—all units fully powered
- — Doze—core functional units disabled, except time base decrementer, PLL, memory controller, RTC, and CPM in low-power standby
- — Sleep—all units disabled, except RTC and PIT, PLL active for fast wake up
- — Deep sleep—all units disabled including PLL, except RTC and PIT
- — Power down mode— all units powered down, except PLL, RTC, PIT, time base, and decrementer
- Debug interface
- — Eight comparators: four operate on instruction address, two operate on data address, and two operate on data
- — Supports conditions: =≠<>
- — Each watchpoint can generate a break-point internally
- 3.3 V operation with 5-V TTL compatibility except EXTAL and EXTCLK
- 357-pin ball grid array (BGA) package
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Part Life Cycle Code | Transferred | Ihs Manufacturer | MOTOROLA INC |
Package Description | BGA, BGA256,16X16,50 | Reach Compliance Code | |
HTS Code | 8542.31.00.01 | Bit Size | 32 |
JESD-30 Code | S-PBGA-B256 | Number of Terminals | 256 |
Operating Temperature-Max | 70 °C | Operating Temperature-Min | |
Package Body Material | PLASTIC/EPOXY | Package Code | BGA |
Package Equivalence Code | BGA256,16X16,50 | Package Shape | SQUARE |
Package Style | GRID ARRAY | Power Supplies | 3.3 V |
Qualification Status | Not Qualified | Speed | 66 MHz |
Supply Voltage-Nom | 3.3 V | Surface Mount | YES |
Temperature Grade | COMMERCIAL | Terminal Form | BALL |
Terminal Pitch | 1.27 mm | Terminal Position | BOTTOM |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XPC823ZT66B2 chip is a powerful processor designed for networking applications. It features a dual-core PowerPC architecture with a clock speed of 66 MHz, making it ideal for high-performance networking tasks. The chip also includes a range of built-in communication interfaces, making it a versatile solution for a variety of networking applications.
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Equivalent
The equivalent products of the XPC823ZT66B2 chip are the XPC823TZ100B2 and the XPC823ZT100B2. These chips have similar features, performance, and functionality to the XPC823ZT66B2 chip, providing options for customers with varying requirements. -
Features
The XPC823ZT66B2 is a highly-integrated microprocessor with a 66 MHz PowerPC core, integrated peripherals, memory controller, and a flexible bus interface. It features low power consumption, high performance, and is suitable for a wide range of embedded applications. -
Pinout
The XPC823ZT66B2 is a 208-pin BGA package with functions including a PowerPC microprocessor, PowerQUICC technology, integrated communications processor, 32-bit RISC core, and support for various communication interfaces such as Ethernet, UART, SPI, and I2C. -
Manufacturer
The manufacturer of the XPC823ZT66B2 is Freescale Semiconductor, now known as NXP Semiconductors. NXP Semiconductors is a global semiconductor manufacturer that specializes in creating secure connection solutions for a variety of industries including automotive, industrial, and Internet of Things (IoT) applications. -
Application Field
The XPC823ZT66B2 is a rugged and reliable single board computer commonly used in industrial automation, transportation, and military applications. It is ideal for embedded systems that require high performance, low power consumption, and a compact form factor. Its advanced features make it suitable for a wide range of demanding environments. -
Package
The XPC823ZT66B2 chip comes in a 256-pin plastic ball grid array (PBGA) package. It is a 32-bit microprocessor with 66 MHz speed and measures 19mm x 19mm in size.
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