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Orders Over
$5000EP4CE30F23I7N
Field Programmable Gate Arrays
Brands: Intel / Altera
Mfr.Part #: EP4CE30F23I7N
Datasheet: EP4CE30F23I7N Datasheet (PDF)
Package/Case: FBGA-484
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 5,602 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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EP4CE30F23I7N General Description
The EP4CE30F23I7N FPGA stands out as a cutting-edge solution for designers seeking a reliable and powerful platform for implementing complex algorithms and processing tasks. With a comprehensive set of features including 30,000 logic elements, 228 user I/O pins, and 504 Kb embedded memory, this FPGA offers unmatched versatility and performance. The device's operating temperature range from -40°C to 100°C ensures reliable operation in extreme conditions, making it suitable for a wide range of industrial applications
Features
- Low-cost, low-power FPGA fabric: 6K to 150K logic elements Up to 6.3 Mb of embedded memory Up to 360 18 × 18 multipliers for DSP processing intensive applications Protocol bridging applications for under 1.5 W total power Cyclone IV GX devices offer up to eight high-speed transceivers that provide: Data rates up to 3.125 Gbps 8B/10B encoder/decoder 8-bit or 10-bit physical media attachment (PMA) to physical coding sublayer (PCS) interface Byte serializer/deserializer (SERDES) Word aligner Rate matching FIFO TX bit slipper for Common Public Radio Interface (CPRI) Electrical idle Dynamic channel reconfiguration allowing you to change data rates andprotocols on-the-flyStatic equalization and pre-emphasis for superior signal integrity 150 mW per channel power consumption Flexible clocking structure to support multiple protocols in a single transceiver block Cyclone IV GX devices offer dedicated hard IP for PCI Express (PIPE) (PCIe) Gen 1: ×1, ×2, and ×4 lane configurations End-point and root-port configurations Up to 256-byte payload One virtual channel 2 KB retry buffer 4 KB receiver (Rx) buffer Cyclone IV GX devices offer a wide range of protocol support: PCIe (PIPE) Gen 1 ×1, ×2, and ×4 (2.5 Gbps) Gigabit Ethernet (1.25 Gbps) CPRI (up to 3.072 Gbps) XAUI (3.125 Gbps) Triple rate serial digital interface (SDI) (up to 2.97 Gbps) Serial RapidIO (3.125 Gbps) Basic mode (up to 3.125 Gbps) V-by-One (up to 3.0 Gbps) DisplayPort (2.7 Gbps) Serial Advanced Technology Attachment (SATA) (up to 3.0 Gbps) OBSAI (up to 3.072 Gbps) Up to 532 user I/Os LVDS interfaces up to 840 Mbps transmitter (Tx), 875 Mbps Rx Support for DDR2 SDRAM interfaces up to 200 MHz Support for QDRII SRAM and DDR SDRAM up to 167 MHz Up to eight phase-locked loops (PLLs) per device Offered in commercial and industrial temperature grades
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Status | Active | Programmabe | Not Verified |
| Number of LABs/CLBs | 1803 | Number of Logic Elements/Cells | 28848 |
| Total RAM Bits | 608256 | Number of I/O | 328 |
| Number of Gates | - | Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 484-BGA |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The EP4CE30F23I7N is a field-programmable gate array (FPGA) chip manufactured by Altera. It belongs to the Cyclone IV family of FPGAs and offers 30,000 logic elements, 595 kbit embedded memory, and 266 multipliers. The chip operates at a speed of up to 300 megahertz and provides various features like high-speed I/Os, dedicated memory interfaces, and DSP blocks. It is commonly used in applications requiring flexible and customizable digital logic functionality.
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Equivalent
Some equivalent products to the EP4CE30F23I7N chip may include the Xilinx XC4VFX12-10FF668I, Altera EP4CE30F29C7N, or Lattice LFXP2-5E-5TN144C. -
Features
EP4CE30F23I7N is an Altera Cyclone IV FPGA. It has 30,080 LEs, 6272 equivalent logic functions, 33,216 RAM bits, 266 user I/O pins, and supports up to 356 multipliers. It operates at a maximum frequency of 257MHz, has 1.2V core voltage, and offers various features like PLLs, JTAG programming, and support for various interfaces including PCIe, USB, and Ethernet. -
Pinout
The EP4CE30F23I7N is an FPGA device with a pin count of 484. It is part of the Cyclone IV E series from Intel. The function of this device includes programmable logic functionality, digital signal processing, and embedded memory blocks, among other features. -
Manufacturer
The manufacturer of the EP4CE30F23I7N is Intel. Intel is a multinational corporation specializing in designing and manufacturing semiconductor chips, networking products, and other related technologies. -
Application Field
The EP4CE30F23I7N FPGA can be used in a variety of applications such as communications, industrial automation, automotive, and consumer electronics. It is suitable for implementing digital signal processing algorithms, high-speed data transfer, and complex control systems. -
Package
The EP4CE30F23I7N chip is available in FineLine BGA (FBGA) package type with 484 solder balls. Its form factor is a 23x23 mm chip, making it a smaller-sized component for integration into electronic devices.
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