This website uses cookies. By using this site, you consent to the use of cookies. For more information, please take a look at our Privacy Policy.

Orders Over

$5000
Get a $50 Discount !

LFXP3C-3TN144C

1.8V 320MHz 0.63ns Performance

ISO14001 ISO9001 DUNS

Brands: Lattice Semiconductor Corporation

Mfr.Part #: LFXP3C-3TN144C

Datasheet: LFXP3C-3TN144C Datasheet (PDF)

Package/Case: 144-LQFP

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 6,506 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for LFXP3C-3TN144C or email to us: Email: [email protected], we will contact you within 12 hours.

LFXP3C-3TN144C General Description

Lattice Semiconductor's LFXP3C-3TN144C stands as a formidable field-programmable gate array (FPGA) within the LatticeXP2 family. With 3,000 Look-Up Tables (LUTs) and a 144-pin TQFP package, this FPGA delivers high performance and low power consumption, making it a prime choice for applications spanning industrial control, automotive, and communications. Its support for various I/O standards such as LVCMOS, LVTTL, and PCI adds to its versatility, catering to diverse project needs. Furthermore, the non-volatile FLASH-based technology allows for in-system reprogramming and configuration, amplifying its flexibility. Additionally, the built-in security features ensure the safeguarding of sensitive data and intellectual property, elevating the device's reliability and trustworthiness

LFXP3C-3TN144C

Features

  • Fully supports PowerPC™ 60x bus protocol, include PowerPC 603, 604, 740, 750 and 8260.
  • Supports up to eight PowerPC bus masters with unlimited slave device support.
  • Supports two outstanding bus accesses.
  • Supports address only transfer and address bus retry.
  • Independent address bus and data bus tenure with separate bus grant and data bus grant.
  • Option for fixed priority assignment or rotating priority scheme.
  • Designed for ASIC or programmable logic device implementations in various system environments.
  • Fully static design with edge triggered flip-flops.
  • Optimized for ispXPGA product family.

Specifications

Parameter Value Parameter Value
Series XP Package Tray
Product Status Obsolete Programmabe Not Verified
Number of Logic Elements/Cells 3000 Total RAM Bits 55296
Number of I/O 100 Voltage - Supply 1.71V ~ 3.465V
Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20)
Base Product Number LFXP3

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The LFXP3C-3TN144C chip is a programmable logic device from Intel (formerly Lattice Semiconductor). It belongs to the Lattice XP2 FPGA family and is available in a small form factor with 144-pin TQFP package. The chip offers low power consumption and features a high density of programmable logic blocks, I/Os, and on-chip memory. It is widely used in various electronic applications for its flexibility and performance.
  • Equivalent

    Some equivalent products of the LFXP3C-3TN144C chip include LFE3-35EA-7FN484C, LFE3-70EA-7FN484C, LFXP2-17E-7F484C, and LFXP2-8E-5FTN144C.
  • Features

    The LFXP3C-3TN144C is a small form factor programmable logic device with 3,000 Look-Up Tables (LUTs), 77 KB of embedded block RAM, and 136 user I/Os. It operates at a low power consumption level and offers high-performance in a compact package, making it ideal for various applications in industrial, automotive, and consumer electronics.
  • Pinout

    The LFXP3C-3TN144C is a field-programmable gate array (FPGA) with a pin count of 144. It is used to implement digital logic functions and can be programmed and reprogrammed to perform various tasks.
  • Manufacturer

    The manufacturer of the LFXP3C-3TN144C is Lattice Semiconductor Corporation. It is a leading provider of customizable smart connectivity solutions, offering a wide range of programmable logic devices, software, and IP cores. Lattice Semiconductor specializes in low-power, small form factor, and high-performance FPGA (field-programmable gate array) solutions for various industries such as automotive, communications, consumer, industrial, and more.
  • Application Field

    The LFXP3C-3TN144C FPGA (Field-Programmable Gate Array) is commonly used in various applications, including industrial control systems, automotive electronics, consumer electronics, and telecommunications equipment. Its high performance, low power consumption, and flexible programmability make it suitable for a wide range of applications.
  • Package

    The LFXP3C-3TN144C chip comes in a 144-pin TQFP (Thin Quad Flat Package) form with a package size of 10mm x 10mm.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

Ratings and Reviews

Ratings
Please rate the product !
Please enter a comment

Please submit comments after logging into your account.

Submit

Recommend

  • DSPIC30F2010-30I/SP

    DSPIC30F2010-30I/SP

    Microchip

    dsPIC30F Series 512 B RAM 12 kB Flash 16-Bit Digit...

  • SI52112-B6-GTR

    SI52112-B6-GTR

    SILICONLA

    8-pin TSSOP package

  • TCM1-83X+

    TCM1-83X+

    Mini-Circuits

    Radio frequency balun device modu

  • NJM4558D

    NJM4558D

    Nisshinbo Micro Devices

    This OP Amp from NJR Corporation features two inde...

  • NJM2115V-TE1

    NJM2115V-TE1

    Nisshinbo Micro Devices

    Op Amp Dual General Purpose with ±7V/14V Power Su...

  • BA10358

    BA10358

    Rohm Semiconductor

    Versatile IC ideal for audio, industrial control, ...