MUN5214DW1T1G

Part points

• The MUN5214DW1T1G is a Power MOSFET transistor chip designed to handle high power applications in electronic devices. It features a low on-resistance and high current capacity, making it ideal for use in power management circuits, motor control systems, and other high-power applications. The chip's compact size and efficient performance make it a popular choice for engineers looking to design energy-efficient and reliable electronic systems.

• Equivalent

  Some equivalent products to the MUN5214DW1T1G chip are the NXP BAV99LT1G, Fairchild Semiconductor FDN337N, and ON Semiconductor BAV99LT1G. These chips all serve similar functions and can be used as replacements for the MUN5214DW1T1G in various electronic applications.

• Features

  MUN5214DW1T1G is a high-speed, low VCE(sat) NPN transistor with low collector-emitter saturation voltage, designed for digital and analog switching applications. It has a maximum current rating of 500mA and a voltage rating of 160V. This transistor is RoHS compliant and designed for high-reliability applications.

• Pinout

  The MUN5214DW1T1G is a dual NPN/PNP small signal transistor array. Pin count: 6 pins Functions: 1. Collector of NPN Transistor 1 2. Base of NPN Transistor 1 3. Emitter of NPN Transistor 1 4. Collector of PNP Transistor 2 5. Base of PNP Transistor 2 6. Emitter of PNP Transistor 2

• Manufacturer

  MUN5214DW1T1G is manufactured by ON Semiconductor, a leading supplier of semiconductor-based solutions worldwide. ON Semiconductor produces a wide range of products for various applications including power management, connectivity, sensors, and custom solutions. The company is known for its high-quality products and innovative technologies that help accelerate the development of electronic devices in multiple industries.

• Application Field

  MUN5214DW1T1G is a dual N-channel MOSFET designed for general-purpose switching applications in mobile devices, power management systems, and battery charging circuits. It is commonly used in devices requiring high-speed switching capabilities, low power consumption, and efficient thermal dissipation.

• Package

  The MUN5214DW1T1G chip comes in a DPAK (TO-252) package type, with a surface mount form. The size of the chip is 6.6mm x 9.55mm x 3.1mm, making it suitable for use in a variety of electronic applications.