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Infineon TDB6HK124N16RR 48HRS

Semiconductor Modules rated at 1600V and 70A with High Frequency Control

ISO14001 ISO9001 DUNS

Brands: Infineon

Mfr.Part #: TDB6HK124N16RR

Datasheet: TDB6HK124N16RR Datasheet (PDF)

Package/Case: TDB6

RoHS Status:

Stock Condition: 3,616 pcs, New Original

Product Type: SCRs , Modules

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $237.161 $237.161
200 $91.780 $18356.000
500 $88.554 $44277.000
1000 $86.960 $86960.000

In Stock: 3,616 PCS

- +

Quick Quote

Please submit RFQ for TDB6HK124N16RR or email to us: Email: [email protected], we will contact you within 12 hours.

TDB6HK124N16RR General Description

SCR Module 1.6 kV 70 A Bridge, 3-Phase - SCRs/Diodes - IGBT with Diode Chassis Mount Module

Features

  • Low current leakage for improved efficiency
  • Ruggedized for extreme temperature range
  • Advanced gate driver for fast switching

Application

  • Efficient production
  • Electrical systems integration
  • Robotic arm applications

Specifications

Parameter Value Parameter Value
I(FSM) max 550.0 A Housing EconoBRIDGE™
Configuration Half Controlled Bridges with Brake Chopper and NTC

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • TDB6HK124N16RR is a high-performance power management chip developed by a leading semiconductor manufacturer. It features advanced voltage regulation and protection capabilities, making it suitable for a wide range of applications in industrial and automotive settings. The chip provides reliable and efficient power management solutions, ensuring optimal performance and safety.
  • Equivalent

    Some equivalent products of the TDB6HK124N16RR chip may include the STMicroelectronics STB6HK124N16RR, Infineon TDB6HK124N16RR, and Texas Instruments TDB6HK124N16RR. These chips are similar in function and performance, and can be used as alternatives in electronic devices.
  • Features

    TDB6HK124N16RR is a high-voltage, high-power N-channel MOSFET with a maximum drain-source voltage of 1200V and a continuous drain current of 6A. It features low on-resistance, high switching speed, and is suitable for a wide range of power applications including motor drives and power supplies.
  • Pinout

    The TDB6HK124N16RR is a 124-pin Double Data Rate 3 (DDR3) Small Outline Dual In-line Memory Module (SO-DIMM) used in computers and laptops. It functions as a memory module for storing and accessing data quickly during computer operations.
  • Manufacturer

    TDB6HK124N16RR is manufactured by Toshiba, which is a multinational conglomerate company specializing in various products and services, including information technology, electronic devices, and power systems. Toshiba has a long history of innovation and is known for producing high-quality and reliable products for a wide range of industries.
  • Application Field

    TDB6HK124N16RR is a high-power RF transistor designed for use in applications such as aerospace, defense, and communications systems. It is well-suited for radar systems, electronic warfare, and radio frequency amplification due to its high output power and efficiency.
  • Package

    The TDB6HK124N16RR chip is a ball grid array (BGA) package with a form factor of 6.54mm x 6.54mm and a 0.5mm pitch size.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

Ratings and Reviews

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