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$5000Xilinx XC2S300E-6FTG256C
Reconfigurable computing chip
Brands: AMD Xilinx, Inc
Mfr.Part #: XC2S300E-6FTG256C
Datasheet: XC2S300E-6FTG256C Datasheet (PDF)
Package/Case: BGA-256
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 2,179 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC2S300E-6FTG256C General Description
The XC2S300E-6FTG256C, manufactured by Xilinx, is a versatile FPGA from the Spartan-II family. With 300,000 system gates and a speed grade of -6, it offers high-speed performance and programmable logic cells, making it suitable for a wide range of applications. The FTG256C package, with 256 pins, ensures reliable connectivity and integration. Moreover, the embedded RAM and configurable I/Os enhance its flexibility for system integration. Designed using advanced semiconductor manufacturing processes, this FPGA promises high performance and reliability, making it an ideal choice for industrial control, automotive electronics, telecommunications, and consumer electronics applications. Available through Xilinx and authorized distributors, it provides designers with a flexible platform for implementing complex digital systems
Features
- 300,000 system gates
- 384 macrocells
- 18,432 logic cells
- 1.2V core voltage
- 6-layer metal process technology
- 256-ball Fine-Pitch Ball Grid Array (FBGA) package
- Maximum user I/Os: 182
- Maximum differential I/O pairs: 91
Application
- Communications systems
- Video and image processing
- Industrial control systems
- Medical equipment
- Aerospace and defense systems
- Automotive systems
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
| Product: | Spartan-IIE | Number of Logic Elements: | 6912 |
| Number of I/Os: | 182 I/O | Operating Supply Voltage: | 1.8 V |
| Minimum Operating Temperature: | 0 C | Maximum Operating Temperature: | + 85 C |
| Mounting Style: | SMD/SMT | Package / Case: | FBGA-256 |
| Series: | XC2S300E | Brand: | Xilinx |
| Distributed RAM: | 98304 | Embedded Block RAM - EBR: | 64 kbit |
| Maximum Operating Frequency: | 275 MHz | Product Type: | FPGA - Field Programmable Gate Array |
| Subcategory: | Programmable Logic ICs | Tradename: | Spartan |
| Tags | XC2S300E-6FT, XC2S300E-6F, XC2S300E-6, XC2S300E, XC2S300, XC2S30, XC2S3, XC2S, XC2 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC2S300E-6FTG256C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : EP2S300F1020C3N
Brands : Altera
Package :
Description :
Part Number : XC3S500E-4FGG320C
Brands :
Package : BGA320
Description : FPGA Spartan-3E Family 500K Gates 10476 Cells 572MHz 90nm Technology 1.2V 320Pin FBGA
Part Number : LFXP10C-4F256C
Brands : Lattice Semiconductor
Package :
Description :
Part Number : EPM3064ATC100-10N
Brands :
Package : QFP-100
Description : MAX 3000A CPLD 64 MC 100-TQFP
Part points
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The XC2S300E-6FTG256C chip is a member of the Xilinx Spartan-2E field-programmable gate array (FPGA) family. It offers 300,000 system gates, 168 pieces of 18-kilobit block RAM, and 256 pins for connections. The chip operates at a maximum frequency of 191.5 MHz and provides a range of features to support various applications.
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Equivalent
There are no direct equivalent products for the XC2S300E-6FTG256C chip. However, the Xilinx XC2S50E-6FTG256C and XC2S100E-6FTG256C chips are similar options with lower capacity. -
Features
The XC2S300E-6FTG256C is a high-performance field-programmable gate array (FPGA). It offers 300,000 logic cells, advanced I/O capabilities, 6-speed technology, and a FTG256C package. It is designed for complex digital circuit development, prototyping, and system implementation, providing flexibility and scalability to meet various application requirements. -
Pinout
The XC2S300E-6FTG256C is an FPGA (Field-Programmable Gate Array) with 256 pins. It is from the XC2S (Spartan-II) family and has a capacity of 300,000 system gates. The specific function and pin assignments for this FPGA can be found in its datasheet. -
Manufacturer
Xilinx, Inc. is the manufacturer of the XC2S300E-6FTG256C. It is a technology company specializing in the development of programmable logic devices such as field-programmable gate arrays (FPGAs) and associated software tools. They provide solutions for a wide range of applications including data centers, automotive, aerospace, and consumer electronics. -
Application Field
The XC2S300E-6FTG256C is a field-programmable gate array (FPGA) commonly used in various application areas such as telecommunications, automotive, industrial control systems, and consumer electronics. It is known for its high-density and low-power capabilities, making it suitable for a wide range of applications that require complex digital logic implementation. -
Package
The XC2S300E-6FTG256C chip has a FG256 package type, a 256-pin Fine-Pitch Ball Grid Array (FBGA) form, and its size is approximately 17mm x 17mm.
Datasheet PDF
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