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Xilinx XC2V2000-5BG575I

2688 CLBs, 2000000 Gates

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC2V2000-5BG575I

Datasheet: XC2V2000-5BG575I Datasheet (PDF)

Package/Case: BGA-575

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 3,782 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Please submit RFQ for XC2V2000-5BG575I or email to us: Email: [email protected], we will contact you within 12 hours.

XC2V2000-5BG575I General Description

The XC2V2000-5BG575I FPGA, part of Xilinx's Virtex-II family, offers significant computational power and flexibility for various applications. With 2 million system gates, it provides ample resources for complex digital designs, making it suitable for demanding computing tasks. The speed grade "5" ensures reliable performance within a specific operating frequency range, crucial for real-time applications. The BGA package type "BG" provides robustness and compactness in integration, while the 575 pins enable seamless connections to external components. Moreover, the industrial temperature range "I" ensures the FPGA's reliability in harsh operating environments, making it suitable for industrial and outdoor applications where temperature extremes are a concern

AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Manufacturer XILINX Product Category Embedded - FPGAs (Field Programmable Gate Array)
Series VirtexR-II Package-Case 575-BBGA
Operating-Temperature -40°C ~ 100°C (TJ) Mounting-Type Surface Mount
Voltage-Supply 1.425 V ~ 1.575 V Supplier-Device-Package 575-BGA (31x31)
Number-of-Gates 2000000 Number-of-I-O 408
Number-of-LABs-CLBs 2688 Number-of-Logic-Elements-Cells -
Total-RAM-Bits 1032192 Tags XC2V2000-5BG, XC2V2000-5B, XC2V2000-5, XC2V20, XC2V2, XC2V, XC2
Pbfree Code No Rohs Code No
Part Life Cycle Code Obsolete Ihs Manufacturer XILINX INC
Part Package Code BGA Package Description 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575
Pin Count 575 Reach Compliance Code not_compliant
ECCN Code 3A991.D HTS Code 8542.39.00.01
Clock Frequency-Max 750 MHz Combinatorial Delay of a CLB-Max 0.39 ns
JESD-30 Code S-PBGA-B575 JESD-609 Code e0
Length 31 mm Moisture Sensitivity Level 3
Number of CLBs 2688 Number of Equivalent Gates 2000000
Number of Inputs 408 Number of Logic Cells 24192
Number of Outputs 408 Number of Terminals 575
Organization 2688 CLBS, 2000000 GATES Package Body Material PLASTIC/EPOXY
Package Code BGA Package Equivalence Code BGA575,24X24,50
Package Shape SQUARE Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 225 Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Seated Height-Max 2.6 mm
Supply Voltage-Max 1.575 V Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V Surface Mount YES
Technology CMOS Terminal Finish TIN LEAD
Terminal Form BALL Terminal Pitch 1.27 mm
Terminal Position BOTTOM

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • XC2V2000-5BG575I is a chip model manufactured by Xilinx. It is a field-programmable gate array (FPGA) chip that offers a range of features for various applications. With a capacity of 2 million system gates, 2.1 million logic cells, and 600 available user input/output pins, it provides ample resources for designers. The chip offers reconfigurability, allowing users to modify the chip's functionality even after deployment. Its high-performance capabilities make it suitable for demanding applications in industries like aerospace, defense, and telecommunications.
  • Equivalent

    The equivalent products of the XC2V2000-5BG575I chip are the XC2V2000-5BF957I, XC2V2000-5BG575C, and XC2V2000-5BF957C.
  • Features

    The XC2V2000-5BG575I is a programmable logic device manufactured by Xilinx. It has a programmable logic capacity of 2 million system gates and 24,640 logic cells. It operates at a speed of 525 MHz and provides 36,648 flip-flop and 1,365 Kbits of RAM. It offers a variety of high-performance features and is used in various applications, including telecommunications and networking.
  • Pinout

    The XC2V2000-5BG575I is an FPGA (Field-Programmable Gate Array) with 575 balls (pin count). It provides programmable logic and processing capabilities for various applications, such as telecommunications, automotive, and industrial sectors.
  • Manufacturer

    The XC2V2000-5BG575I is manufactured by Xilinx Inc., an American technology company. It specializes in the design and production of programmable logic devices and software tools used for developing digital and mixed-signal systems.
  • Application Field

    The XC2V2000-5BG575I is a field-programmable gate array (FPGA) used in various application areas, including telecommunications, automotive, consumer electronics, and industrial automation. It offers high-performance processing, flexible reconfiguration, and efficient power consumption, making it suitable for a wide range of complex designs and systems.
  • Package

    The XC2V2000-5BG575I chip is packaged in a BGA (Ball Grid Array) package. It has a form factor of 23mm x 23mm and a size of 2,001,792 logic cells.

Datasheet PDF

Preliminary Specification XC2V2000-5BG575I PDF Download

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