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Xilinx XC2VP20-5FF896C

1 X 31 MM, FCBGA-896)

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC2VP20-5FF896C

Datasheet: XC2VP20-5FF896C Datasheet (PDF)

Package/Case: FBGA896

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 3,934 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XC2VP20-5FF896C or email to us: Email: [email protected], we will contact you within 12 hours.

XC2VP20-5FF896C General Description

Another standout feature of the XC2VP20-5FF896C FPGA is its RoHS compliance, guaranteeing that it is free from harmful substances like lead and mercury. This makes it not only a powerful and versatile choice for complex design tasks but also a sustainable one, aligning with modern environmental standards

xc2vp20-5ff896c

Features

  • 20,160 logic cells
  • 1,080 Kb block RAM
  • 76 DSP slices
  • 172 I/O pins
  • 500 MHz clock frequency
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Pbfree Code No Rohs Code No
Part Life Cycle Code Obsolete Ihs Manufacturer XILINX INC
Part Package Code BGA Package Description 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FCBGA-896
Pin Count 896 Reach Compliance Code not_compliant
ECCN Code 3A991.D HTS Code 8542.39.00.01
Samacsys Manufacturer XILINX Clock Frequency-Max 1050 MHz
Combinatorial Delay of a CLB-Max 0.36 ns JESD-30 Code S-PBGA-B896
JESD-609 Code e0 Length 31 mm
Moisture Sensitivity Level 4 Number of CLBs 2320
Number of Inputs 556 Number of Logic Cells 20880
Number of Outputs 556 Number of Terminals 896
Operating Temperature-Max 85 °C Operating Temperature-Min
Organization 2320 CLBS Package Body Material PLASTIC/EPOXY
Package Code BGA Package Equivalence Code BGA896,30X30,40
Package Shape SQUARE Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 225 Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Seated Height-Max 3.4 mm
Supply Voltage-Max 1.575 V Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V Surface Mount YES
Technology CMOS Temperature Grade OTHER
Terminal Finish TIN LEAD Terminal Form BALL
Terminal Pitch 1 mm Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 Width 31 mm
Mfr AMD Series Virtex®-II Pro
Package Tray Product Status Obsolete
Programmabe Not Verified Number of LABs/CLBs 2320
Number of Logic Elements/Cells 20880 Total RAM Bits 1622016
Number of I/O 556 Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 896-BBGA, FCBGA Supplier Device Package 896-FCBGA (31x31)
Base Product Number XC2VP20

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC2VP20-5FF896C is a Field-Programmable Gate Array (FPGA) chip manufactured by Xilinx. It belongs to the Virtex-2 Pro series and has 20,000 logic cells, 5ns data processing speed, and a 896-pin grid array package. It is capable of reconfiguring its circuitry, making it versatile for various applications.
  • Equivalent

    There are no direct equivalent products to the XC2VP20-5FF896C chip as it is a specific model of the Xilinx Virtex-II Pro FPGA family. However, other FPGA models within the same family, such as XC2VP30 and XC2VP50, might have similar capabilities and features.
  • Features

    XC2VP20-5FF896C is a member of the Virtex-II Pro family by Xilinx. It offers a maximum of 20 million system gates, 29,280 logic cells, a 500MHz differential output, 20-bit width, and 896 ball grid array. It is primarily used for high-performance FPGA applications, providing ample resources for complex designs.
  • Pinout

    The XC2VP20-5FF896C is a Field Programmable Gate Array (FPGA) with a pin count of 896 and a function of implementing digital logic circuits.
  • Manufacturer

    The manufacturer of the XC2VP20-5FF896C is Xilinx Inc. Xilinx Inc. is an American technology company that specializes in the design and production of programmable logic devices, including field-programmable gate arrays (FPGAs).
  • Application Field

    The XC2VP20-5FF896C is an FPGA (Field-Programmable Gate Array) with customizable hardware logic, making it suitable for a wide range of applications. Some application areas include telecommunications, wireless communication, embedded systems, aerospace, automotive, industrial automation, and medical devices.
  • Package

    The XC2VP20-5FF896C chip has a package type of fBGA, a form factor of 17 x 17 mm, and a size of 289 mm².

Datasheet PDF

Preliminary Specification XC2VP20-5FF896C PDF Download

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