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Xilinx XC3S1000-4FG676C 48HRS

AMD Xilinx XC3S1000-4FG676C

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S1000-4FG676C

Datasheet: XC3S1000-4FG676C Datasheet (PDF)

Package/Case: BGA676

RoHS Status:

Stock Condition: 2,027 pcs, New Original

Product Type: FPGAs (Field Programmable Gate Array)

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $237.413 $237.413
200 $91.875 $18375.000
500 $88.648 $44324.000
1000 $87.052 $87052.000

In Stock: 2,027 PCS

- +

Quick Quote

Please submit RFQ for XC3S1000-4FG676C or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S1000-4FG676C General Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 391 442368 17280 676-BGA

xc3s1000-4fg676c

Features

  • It has 1,016 user I/O pins
  • 1 Mb of fast block RAM
  • 36 Kb of distributed RAM
  • 1,008 Kb of total RAM
  • 356 slices, each containing four 6-input LUTs and eight flip-flops
  • 2 Digital Clock Managers (DCMs)
  • 8 Digital Signal Processing (DSP) blocks
  • Maximum operating frequency of 250 MHz

Application

  • Aerospace and defense
  • Automotive
  • Broadcast
  • Consumer
  • High-performance computing
  • Industrial
  • Medical
  • Scientific
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Case/Package BGA Mount Surface Mount
Number of Pins 676 Max Operating Temperature 85 °C
Min Operating Temperature 0 °C Number of Gates 1e+06
Number of I/Os 391 Number of Logic Blocks (LABs) 1920
Number of Logic Elements/Cells 17280 Operating Supply Voltage 1.2 V
RAM Size 54 kB

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S1000-4FG676C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC3S1000-4FG320C

Brands :  

Package :   BGA320

Description :   Spartan-3 FPGA Family : Complete Data Sheet

Part Number :   XC3S1000-4FG320I

Brands :  

Package :   BGA-320

Description :   Spartan-3 Family 1M Gates 17280 Cells 630MHz 90nm Technology 1.2V

Part Number :   XC3S1000-4FG320M

Brands :  

Package :  

Description :  

Part Number :   XC3S1000-4FG320I

Brands :  

Package :   BGA-320

Description :   Spartan-3 Family 1M Gates 17280 Cells 630MHz 90nm Technology 1.2V

Part Number :   XC3S1000-4FG676I

Brands :  

Package :   BGA-676

Description :   Spartan-3 FPGA Family : Complete Data Sheet

Part Number :   XC3S1000-4FG900C

Brands :  

Package :   BGA

Description :  

Part Number :   XC3S1000-4FG900I

Brands :  

Package :   BGA

Description :  

Part Number :   XC3S1000-4FG900M

Brands :  

Package :  

Description :  

Part points

  • The XC3S1000-4FG676C is an FPGA (Field Programmable Gate Array) chip manufactured by Xilinx. It belongs to the Spartan-3 family. This chip provides 1,064 logic elements, dedicated block RAM, and abundant I/O options, making it suitable for a wide range of applications. It can be programmed to perform any digital function and offers flexibility, scalability, and high-performance capabilities.
  • Equivalent

    Some equivalent products of the XC3S1000-4FG676C chip are the XCF02SVO20C, XC3S1000-4FT256C, and XC3S1000-5FG320C. These chips are all part of the Xilinx Spartan-3 family and provide similar functionality with their own unique specifications and packaging.
  • Features

    XC3S1000-4FG676C is an FPGA (Field Programmable Gate Array) by Xilinx. It has 1000K system gates, 960K equivalent logic cells, 70 DSP slices, 4 low power modes, and 506 available IOs. Additionally, it offers advanced clock management, abundant memory resources, and a configurable logic block.
  • Pinout

    The XC3S1000-4FG676C is an FPGA device with a pin count of 676. It is part of the Spartan-3 series and offers 1000 logic cells. The pin count represents the number of physical pins available on the chip, and each pin has a specific function for connecting the FPGA to external components.
  • Manufacturer

    The manufacturer of the XC3S1000-4FG676C is Xilinx, Inc. Xilinx is an American technology company that specializes in designing and manufacturing programmable logic devices, like field-programmable gate arrays (FPGAs) and system on a chip (SoC) solutions. They are known for their contributions to the semiconductor industry and their innovations in programmable logic technology.
  • Application Field

    The XC3S1000-4FG676C is a Field-Programmable Gate Array (FPGA) that can be used in various applications such as telecommunications, automotive, industrial control systems, and consumer electronics. It offers high-performance digital signal processing capabilities, making it suitable for applications that require high-speed data processing, image processing, or complex algorithms.
  • Package

    The XC3S1000-4FG676C chip has a BGA (Ball Grid Array) package type, 676 pins, and a size of 27x27 mm.

Datasheet PDF

Preliminary Specification XC3S1000-4FG676C PDF Download

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