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Xilinx XC3S1200E-4FGG400C

High-performance FPGA for complex logic application

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S1200E-4FGG400C

Datasheet: XC3S1200E-4FGG400C Datasheet (PDF)

Package/Case: FBGA-400

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 3,330 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XC3S1200E-4FGG400C or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S1200E-4FGG400C General Description

The XC3S1200E-4FGG400C is a cutting-edge PLD logic device with FPGA logic type and a CMOS logic family. Its 3S1200 base number provides powerful capabilities, complemented by 304 I/O pins and a maximum frequency of 311MHz. With an I/O output drive of 12mA and a supply voltage range of 1.14V to 1.26V, this device offers robust performance and efficiency. Moreover, its RoHS compliance highlights its adherence to strict environmental standards and regulations

xc3s1200e-4fgg400c

Features

  • 1200K System Gates
  • 1000 Mbps DDR2 & DDR3 memory support
  • 780 MHz maximum clock frequency
  • 400-pin Fine-pitch Ball Grid Array (FBGA) package
  • 1.2V core voltage

Application

  • Wired and wireless communications
  • Industrial control and automation
  • Video and image processing
  • Automotive systems
  • Aerospace and defense
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Pin Count 400 Package Category BGA
Released Date May 13, 2022

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S1200E-4FGG400C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC3S1200E-4FGG400I

Brands :  

Package :   BGA-400

Description :   1.2M Gates 19512 Cells 572MHz 90nm (CMOS) Technology 1.2V

Part Number :   XC3S1200E-4FGG400M

Brands :  

Package :  

Description :  

Part Number :   XC3S1200E-4FGG400I0767

Brands :  

Package :  

Description :  

Part Number :   XC3S1200E-4FGG400M0767

Brands :  

Package :  

Description :  

Part Number :   XC3S1200E-4FGG400I1224

Brands :  

Package :  

Description :  

Part Number :   XC3S1200E-4FGG400M1224

Brands :  

Package :  

Description :  

Part points

  • The XC3S1200E-4FGG400C chip is a field-programmable gate array (FPGA) device manufactured by Xilinx. It belongs to the Spartan-3E family and has 1200 logic cells. The chip offers a wide range of functions, including digital signal processing and logic implementation. It is commonly used in various applications, such as telecommunications, automotive, and embedded systems, where high performance and reconfigurability are required.
  • Equivalent

    The equivalent products of the XC3S1200E-4FGG400C chip are as follows: - Xilinx XC3S1200E-4FG320C - Xilinx XC3S1200E-4FGG320I - Xilinx XC3S1200E-4FGG320C - Xilinx XC3S1200E-4FGG320CES - Xilinx XC3S1200E-4FG320CES
  • Features

    The XC3S1200E-4FGG400C is a Spartan-3E FPGA from Xilinx. It has 1.2 million system gates, 400MHz operating frequency, 256 I/O pins, and supports up to 165 user I/O at high performance. It offers powerful programmable logic capabilities and is suitable for a wide range of applications.
  • Pinout

    The XC3S1200E-4FGG400C is an FPGA (Field-Programmable Gate Array) with a pin count of 400. It is designed for general-purpose logic applications and features high-performance signal processing capabilities.
  • Manufacturer

    The XC3S1200E-4FGG400C is manufactured by Xilinx. Xilinx is a technology company that specializes in the development and production of programmable logic devices, such as field-programmable gate arrays (FPGAs) and system on chips (SoCs). They are known for providing solutions in a wide range of applications, including aerospace, automotive, telecommunications, and data center industries.
  • Application Field

    The XC3S1200E-4FGG400C is a field-programmable gate array (FPGA) and can be used in various applications including telecommunications, industrial automation, medical devices, and aerospace. It offers high performance and flexibility, making it suitable for tasks such as digital signal processing, data encryption, image processing, and control systems.
  • Package

    The XC3S1200E-4FGG400C chip has a Flip Chip Ball Grid Array (FCBGA) package type, a 400-pin grid array form, and a size of 19 x 19 mm.

Datasheet PDF

Preliminary Specification XC3S1200E-4FGG400C PDF Download

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