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Xilinx XC3S1400AN-4FG676C 48HRS

Connect EBOM with this FPGA to create a versatile electronic component solution

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S1400AN-4FG676C

Datasheet: XC3S1400AN-4FG676C Datasheet (PDF)

Package/Case: PBGA-676

RoHS Status:

Stock Condition: 2,973 pcs, New Original

Product Type: FPGAs (Field Programmable Gate Array)

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $775.621 $775.621
200 $309.479 $61895.800
480 $299.138 $143586.240
1000 $294.028 $294028.000

In Stock: 2,973 PCS

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Quick Quote

Please submit RFQ for XC3S1400AN-4FG676C or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S1400AN-4FG676C General Description

Spartan®-3AN Field Programmable Gate Array (FPGA) IC 502 589824 25344 676-BGA

xc3s1400an-4fg676c

Features

  • 1400K system gates
  • 1.2V core voltage
  • 4-input lookup tables (LUTs)
  • 8-bit digital-to-analog converters (DACs)
  • Phase-locked loops (PLLs)
  • High-speed serial transceivers
  • Built-in self-test (BIST) capability
xc3s1400an-4fg676c

Application

  • Aerospace and defense systems
  • Industrial automation
  • Communications equipment
  • Medical imaging
  • Video processing and display
  • Test and measurement equipment
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Manufacturer: Xilinx Product Category: FPGA - Field Programmable Gate Array
Series: XC3S1400AN Number of Logic Elements: 25344 LE
Adaptive Logic Modules - ALMs: 11264 ALM Embedded Memory: 576 kbit
Number of I/Os: 502 I/O Supply Voltage - Min: 1.14 V
Supply Voltage - Max: 1.26 V Minimum Operating Temperature: 0 C
Maximum Operating Temperature: + 85 C Data Rate: -
Number of Transceivers: - Mounting Style: SMD/SMT
Package / Case: FBGA-676 Brand: Xilinx
Distributed RAM: 176 kbit Embedded Block RAM - EBR: 576 kbit
Maximum Operating Frequency: 250 MHz Moisture Sensitive: Yes
Number of Gates: 1400000 Operating Supply Voltage: 1 V
Product Type: FPGA - Field Programmable Gate Array Factory Pack Quantity: 1
Subcategory: Programmable Logic ICs Tradename: Spartan
Unit Weight: 0.014110 oz

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S1400AN-4FG676C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC3S1400A-4FGG676C

Brands :  

Package :   BGA-676

Description :   1.4M Gates 25344 Cells 667MHz 90nm Technology 1.2V

Part Number :   XC3S1400AN-4FGG676I

Brands :  

Package :   BGA-676

Description :   FPGA Spartan®-3AN Family 1.4M Gates 25344 Cells 667MHz 90nm Technology 1.2V

Part Number :   XC3S1400AN-4FGG676I

Brands :  

Package :   BGA-676

Description :   FPGA Spartan®-3AN Family 1.4M Gates 25344 Cells 667MHz 90nm Technology 1.2V

Part Number :   XC3S1400AN-4FGG676I

Brands :  

Package :   BGA-676

Description :   FPGA Spartan®-3AN Family 1.4M Gates 25344 Cells 667MHz 90nm Technology 1.2V

Part Number :   XC3S1400AN-4FGG676I

Brands :  

Package :   BGA-676

Description :   FPGA Spartan®-3AN Family 1.4M Gates 25344 Cells 667MHz 90nm Technology 1.2V

Part Number :   XC3S1400AN-4FGG676I

Brands :  

Package :   BGA-676

Description :   FPGA Spartan®-3AN Family 1.4M Gates 25344 Cells 667MHz 90nm Technology 1.2V

Part Number :   XC3S1400AN-4FGG676I

Brands :  

Package :   BGA-676

Description :   FPGA Spartan®-3AN Family 1.4M Gates 25344 Cells 667MHz 90nm Technology 1.2V

Part points

  • The XC3S1400AN-4FG676C chip is a product from Xilinx, a leading manufacturer of field-programmable gate array (FPGA) devices. It is a programmable logic device that allows designers to quickly and efficiently implement digital circuits, enabling customization and flexibility in various applications. It has 1,400,000 system gates, comes in a 676-pin FG676C package, and operates at a speed grade of -4.
  • Equivalent

    There are no direct equivalent products to the XC3S1400AN-4FG676C chip. However, similar options include the XC3S1600E-4FGG400C, XC3S1400A-4FGG676C, and XC3S1400A-4FTG256C chips, all from the Spartan-3A FPGA family.
  • Features

    XC3S1400AN-4FG676C is a Xilinx Spartan-3AN FPGA with 1400K gates and a 676-pin BGA package. It features 98 user I/O pins and multiple standard interfaces like SPI and I2C. It operates at a maximum frequency of 310MHz and offers a built-in digital clock manager, memory controllers, and DSP blocks for implementing complex designs.
  • Pinout

    The XC3S1400AN-4FG676C is an FPGA (Field-Programmable Gate Array) with a pin count of 676 and a -4 speed grade. The specific functions and pin assignments may vary depending on the user's configuration. Please refer to the device datasheet or documentation for detailed pin descriptions and functionality.
  • Manufacturer

    The manufacturer of the XC3S1400AN-4FG676C is Xilinx. Xilinx is a semiconductor company specializing in the development and production of field-programmable gate array (FPGA) and programmable logic devices (PLDs). They offer a range of products and solutions for various industries including telecommunications, automotive, aerospace, and more.
  • Application Field

    The XC3S1400AN-4FG676C is a field-programmable gate array (FPGA) chip. Its application areas include telecommunications, automotive systems, industrial automation, medical equipment, and aerospace. It can be used for a wide range of functions, such as data processing, signal processing, control systems, and image processing, among others.
  • Package

    The XC3S1400AN-4FG676C chip has a package type of Flip Chip and a size of 27mm x 27mm.

Datasheet PDF

Preliminary Specification XC3S1400AN-4FG676C PDF Download

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