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$5000Xilinx XC3S200-4FTG256C
Field Programmable Gate Array with 1.2 volt operation
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S200-4FTG256C
Datasheet: XC3S200-4FTG256C Datasheet (PDF)
Package/Case: BGA-256
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 2,203 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC3S200-4FTG256C General Description
The XC3S200-4FTG256C FPGA from Xilinx represents a powerful solution for a wide range of applications, thanks to its impressive logic capacity of 200,000 system gates. Designed as part of the Spartan-3 family, this FPGA offers versatility and high performance in fields such as telecommunications, automotive, and industrial automation. With 288 user I/Os, it enables seamless interfacing with external devices, while its -4 speed grade ensures it meets diverse performance requirements
Features
- 200,000 system gates
- 392 user I/Os
- Up to 216 user-defined differential I/O pairs
- 4ns minimum clock period
- Maximum frequency of 250 MHz
- Two power supplies: 1.2V core and 2.5V to 3.3V I/O
Application
- Digital signal processing
- Video and image processing
- Communications
- Industrial control
- Medical equipment
- Aerospace and defense
- Test and measurement equipment
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Mount | Surface Mount | Number of Pins | 256 |
| Max Operating Temperature | 85 °C | Max Supply Voltage | 1.26 V |
| Min Operating Temperature | 0 °C | Min Supply Voltage | 1.14 V |
| Number of Gates | 200000 | Number of I/Os | 173 |
| Number of Logic Blocks (LABs) | 480 | Number of Logic Elements/Cells | 4320 |
| Operating Supply Voltage | 1.2 V | Packaging | Bulk |
| RAM Size | 27 kB | Speed Grade | 4 |
| Height | 1 mm | Length | 17 mm |
| Width | 17 mm |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC3S200-4FTG256C chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It belongs to the Spartan-3 generation and offers 200,000 logic cells, 356 flip-flops, and 6,080 slices. It operates at a maximum frequency of 150 MHz and has 36 dedicated digital signal processing blocks. This chip is commonly used in various electronic applications for its programmable features and versatility.
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Equivalent
Some equivalent products of the XC3S200-4FTG256C chip include XC3S200-4FTG256, XC3S200T-4FTG256C, and XC3S200T-4FTG256. These chips are part of the XC3S200 series and have similar specifications and features. -
Features
The XC3S200-4FTG256C is a field-programmable gate array (FPGA) with 200K logic cells, a 4-speed grade, and a 256-pin fine-pitch thin-grid ball grid array (FTG256C) package. It offers programmable logic, on-chip memory, and high-speed serial connectivity for various applications such as telecommunications, automotive, and industrial automation. -
Pinout
The XC3S200-4FTG256C is an FPGA with 256 pins. The pin count refers to the number of electrical connection points on the device. The function of this particular FPGA may vary depending on the specific design and configuration of the device. -
Manufacturer
XC3S200-4FTG256C is manufactured by Xilinx. Xilinx is a technology company that specializes in designing and manufacturing field programmable gate arrays (FPGAs) and related software tools. They are known for their programmability and flexibility, allowing customers to customize and optimize hardware for a wide range of applications in industries like aerospace, automotive, telecommunications, and more. -
Application Field
The XC3S200-4FTG256C is a field-programmable gate array (FPGA) that can be used in a variety of applications, including communications, industrial automation, medical devices, automotive systems, and consumer electronics. It offers low power consumption, high performance, and flexibility for customizing digital logic circuits. -
Package
The package type of the XC3S200-4FTG256C chip is FG256, the form is BGA (Ball Grid Array), and the size is 17mm x 17mm.
Datasheet PDF
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