Xilinx XC3S200-4TQG144C

Part points

• The XC3S200-4TQG144C chip is a Xilinx Spartan-3 FPGA (Field Programmable Gate Array) device. It contains 200,000 system gates and is available in a 144-pin Thin Quad Flat Pack (TQFP) package. This chip offers a programmable logic solution for various applications such as digital signal processing, data processing, and system integration.

• Equivalent

  Some equivalent products of the XC3S200-4TQG144C chip are XC3S200-4VQG100C, XC3S200-4FTG256C, and XC3S200-4FGG256C.

• Features

  XC3S200-4TQG144C is an FPGA (Field-Programmable Gate Array) with a capacity of 200,000 system gates. It has 4,320 logic cells and 12,288 flip-flops. It also features an integrated 18-bit multiplier, built-in SelectIO technology for high-performance I/O interfaces, and a 0.15um CMOS technology.

• Pinout

  The XC3S200-4TQG144C is an FPGA with 144-pin TQFP package. It has 200 pins with various functions such as input/output, power, ground, configuration, and programming functions.

• Manufacturer

  The manufacturer of the XC3S200-4TQG144C is Xilinx. Xilinx is a semiconductor company that specializes in the development and production of programmable logic devices and integrated circuits. The XC3S200-4TQG144C is one of the products in their Spartan-3 FPGA (Field-Programmable Gate Array) series.

• Application Field

  The XC3S200-4TQG144C is a Field-Programmable Gate Array (FPGA) device commonly used in embedded systems, telecommunications, digital signal processing, and high-performance computing applications. It can be found in various industries such as aerospace, automotive, medical, and consumer electronics, providing flexible and customizable solutions for complex digital designs.

• Package

  The XC3S200-4TQG144C is a FPGA (Field-Programmable Gate Array) chip with a package type of TQG144. It has a quad flat no-lead package with 144 pins. The chip has a size of approximately 14mm x 14mm.