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Xilinx XC3S2000-4FGG456I

XC3S2000-4FGG456I Field Programmable Gate Array

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S2000-4FGG456I

Datasheet: XC3S2000-4FGG456I Datasheet (PDF)

Package/Case: FBGA-456

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 2,568 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC3S2000-4FGG456I General Description

Xilinx's XC3S2000-4FGG456I FPGA is a member of the Spartan-3 family, boasting 2 million system gates and offering a multitude of features that cater to the needs of various industries. Equipped with 183,600 logic cells and 288 user I/Os, this FPGA provides extensive resources for interfacing with external devices and processing complex tasks. Its 2.1 Mb of distributed RAM and 288 Kb of block RAM offer substantial memory resources for storage and data manipulation. Operating at a core voltage of 1.2V, this device supports multiple configuration options, including serial and SelectMAP configuration modes, providing flexibility and ease of use. Additionally, it incorporates advanced features such as integrated PowerPC cores for embedded processing and multiple high-speed serial transceivers for rapid data transfer. The "4FGG456" designation signifies the FPGA's speed grade and package type, with -4 indicating the fastest speed grade and FGG456 referring to a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. With its robust capabilities and comprehensive features, the XC3S2000-4FGG456I FPGA is the ideal choice for demanding applications in telecommunications, automotive, and industrial control

Features

IC FPGA 333 I/O 456FBGAIC FPGA 333 I/O 456FBGA
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Manufacturer: Xilinx Product Category: FPGA - Field Programmable Gate Array
RoHS: Details Series: XC3S2000
Number of Logic Elements: 46080 LE Adaptive Logic Modules - ALMs: 20480 ALM
Embedded Memory: 720 kbit Number of I/Os: 333 I/O
Supply Voltage - Min: 1.14 V Supply Voltage - Max: 1.26 V
Minimum Operating Temperature: - 40 C Maximum Operating Temperature: + 100 C
Data Rate: - Number of Transceivers: -
Mounting Style: SMD/SMT Package / Case: FBGA-456
Brand: Xilinx Distributed RAM: 320 kbit
Embedded Block RAM - EBR: 720 kbit Maximum Operating Frequency: 280 MHz
Moisture Sensitive: Yes Number of Gates: 2000000
Operating Supply Voltage: 1.2 V Product Type: FPGA - Field Programmable Gate Array
Factory Pack Quantity: 1 Subcategory: Programmable Logic ICs
Tradename: Spartan

Shipping

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TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

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Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

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    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC3S2000-4FGG456I chip is a programmable logic device (PLD) designed by Xilinx. It belongs to the Spartan-3 FPGA family and offers 2 million system gates, 202,752 logic cells, and 64-bit wide memory interfaces. It operates on a 1.2V core voltage and supports various I/O standards. The chip is used for implementing complex digital logic designs in various applications such as telecommunications, automotive, aerospace, and more.
  • Features

    XC3S2000-4FGG456I is a field-programmable gate array (FPGA) device by Xilinx. It has 2 million system gates, 396 input/output pins, and is fabricated on a 90nm process. It operates at a maximum frequency of 360 MHz, supports various I/O standards, and has on-chip block RAM and digital clock managers.
  • Pinout

    The XC3S2000-4FGG456I is an FPGA (field-programmable gate array) with a pin count of 456. It is used for digital logic processing and can be programmed for a variety of functions based on user requirements.
  • Manufacturer

    The manufacturer of the XC3S2000-4FGG456I is Xilinx. It is a semiconductor and technology company that specializes in the development and manufacturing of programmable logic devices, such as field-programmable gate arrays (FPGAs).
  • Application Field

    The XC3S2000-4FGG456I is commonly used in high-performance applications such as aerospace, defense, medical equipment, telecommunications, and data centers. It is suitable for applications that require high-level processing and complex algorithms, as well as those demanding low-power consumption and high-speed operation.
  • Package

    The XC3S2000-4FGG456I chip has a BGA (Ball Grid Array) package type, 456 pins, and a size of 23mm x 23mm.

Datasheet PDF

Preliminary Specification XC3S2000-4FGG456I PDF Download

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