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$5000Xilinx XC3S250E-4CPG132I
XC3S250E-4CPG132I: A programmable logic device boasting a CSPBGA-132 package, offering versatility in hardware design
Brands: Xilinx
Mfr.Part #: XC3S250E-4CPG132I
Datasheet: XC3S250E-4CPG132I Datasheet (PDF)
Package/Case: CSBGA-132
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 3,865 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC3S250E-4CPG132I General Description
Spartan®-3E Field Programmable Gate Array (FPGA) IC 92 221184 5508 132-TFBGA, CSPBGA
Features
- 250,000 system gates
- 4,608 logic cells
- 288 Kbits of block RAM
- 20 Digital Clock Managers (DCMs)
- 254 user I/Os
- Single power supply voltage: 1.2V
- Operating frequency: up to 350MHz
Application
- Automotive: infotainment, driver assistance systems, advanced driver assistance systems (ADAS)
- Aerospace and Defense: avionics, radar systems, navigation systems, communication systems
- Industrial: factory automation, robotics, test and measurement equipment
- Wired and Wireless Communications: routers, switches, base stations, wireless access points
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
| Series | XC3S250E | Number of Logic Elements | 5508 LE |
| Adaptive Logic Modules - ALMs | 2448 ALM | Embedded Memory | 216 kbit |
| Number of I/Os | 92 I/O | Supply Voltage - Min | 1.14 V |
| Supply Voltage - Max | 1.26 V | Minimum Operating Temperature | - 40 C |
| Maximum Operating Temperature | + 100 C | Mounting Style | SMD/SMT |
| Package / Case | CSBGA-132 | Brand | Xilinx |
| Distributed RAM | 38 kbit | Embedded Block RAM - EBR | 216 kbit |
| Maximum Operating Frequency | 300 MHz | Moisture Sensitive | Yes |
| Number of Gates | 250000 | Operating Supply Voltage | 1.2 V |
| Product Type | FPGA - Field Programmable Gate Array | Factory Pack Quantity | 1 |
| Subcategory | Programmable Logic ICs |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S250E-4CPG132I component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3S250E-4FTG256C
Brands :
Package : bga256
Description : FPGA XC4000E Family 25K Gates 2432 Cells 0.35um Technology 5V
Part Number : XC3S250E-4FTG256I
Brands :
Package : BGA-256
Description : FPGA Spartan-3E Family 250K Gates 5508 Cells 572MHz 90nm (CMOS) Technology 1.2V
Part Number : XC3S250E-4FTG324C
Brands :
Package :
Description :
Part Number : XC3S250E-4FTG324I
Brands :
Package :
Description :
Part Number : XC3S250E-4TQG144C
Brands :
Package : TQFP-144
Description : 250K Gates 5508 Cells 572MHz 90nm (CMOS) Technology 1.2V
Part Number : XC3S250E-4TQG144I
Brands :
Package : TQFP-144
Description : 250K Gates 5508 Cells 572MHz 90nm (CMOS) Technology 1.2V
Part Number : XC3S250E-4TQG208C
Brands :
Package :
Description :
Part Number : XC3S250E-4TQG208I
Brands :
Package :
Description :
Part points
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The XC3S250E-4CPG132I is a Field-Programmable Gate Array (FPGA) chip manufactured by Xilinx. It belongs to the Spartan-3E family and has a capacity of 250,000 system gates. It comes in a 132-pin package and operates at a maximum speed of 400MHz. The chip can be reprogrammed to perform various digital logic functions, making it flexible and adaptable for different applications.
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Equivalent
The equivalent products of the XC3S250E-4CPG132I chip are XC3S250E-4TQG144I, XC3S250E-4CPG223I, XC3S250E-4CPG132C, and XC3S250E-4VQG100I. -
Features
The XC3S250E-4CPG132I is a Spartan-3E family FPGA with 250K system gates, JTAG interface, 392 user I/Os, 8 DSP48E1 slices, and 133.3 MHz maximum frequency. It operates on a 1.2V power supply and supports internal boot from PROM as well as dual-platform Flash. -
Pinout
The XC3S250E-4CPG132I has 132 pins and is a field-programmable gate array (FPGA) with 250,000 logical cells. It is part of the Xilinx Spartan-3E family and operates at a speed grade of -4, meaning it can run at a maximum frequency of 400 MHz. -
Manufacturer
The manufacturer of the XC3S250E-4CPG132I is Xilinx Inc. It is a company that specializes in the development and manufacturing of programmable logic devices and related technologies. -
Application Field
The XC3S250E-4CPG132I is a field programmable gate array (FPGA) commonly used in various applications such as aerospace and defense systems, automotive electronics, industrial control systems, telecommunications infrastructure, data centers, and consumer electronics. Its versatility and high-performance capabilities make it suitable for a wide range of applications. -
Package
The XC3S250E-4CPG132I chip has a package type of Ceramic Grid Array (CPG), a form factor of 132 Ball Grid Array (BGA), and a size of 13 x 13 mm.
Datasheet PDF
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