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Xilinx XC3S400A-4FGG400C
Spartan®-3A Field Programmable Gate Array (FPGA) IC 311 368640 8064 400-BGA
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Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S400A-4FGG400C
Datasheet: XC3S400A-4FGG400C Datasheet (PDF)
Package/Case: FBGA-400
RoHS Status:
Stock Condition: 2,644 pcs, New Original
Product Type: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $35.521 | $35.521 |
3 | $35.210 | $105.630 |
30 | $33.657 | $1009.710 |
In Stock: 2,644 PCS
XC3S400A-4FGG400C General Description
The FPGA XC3S400A-4FGG400C is a powerful device from the Spartan-3A family, with a total of 896 logic blocks and 400,000 gates to handle complex processing tasks. With 8064 macrocells and 368,640 RAM bits, this FPGA offers ample resources for demanding applications. It features 311 I/Os for versatile connectivity and a core supply voltage range of 1.14V to 1.26V, along with a 3.3V I/O supply voltage
Features
- Number of Logic Cells: 400,000
- Number of I/Os: 238
- FPGA Family: Spartan-3A
- Package Type: FBGA
- Package Size: 21mm x 21mm
- Operating Temperature Range: -40°C to +100°C
Application
- High-speed data processing and manipulation
- Digital signal processing (DSP) and filtering
- Protocol bridging and conversion
- Encryption and decryption
- System control and management
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Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Case/Package | BGA | Mount | Surface Mount |
Number of Pins | 400 | Max Operating Temperature | 85 °C |
Max Supply Voltage | 1.26 V | Min Operating Temperature | 0 °C |
Min Supply Voltage | 1.14 V | Number of Gates | 400000 |
Number of I/Os | 311 | Number of Logic Blocks (LABs) | 896 |
Number of Logic Elements/Cells | 8064 | Number of Macrocells | 8064 |
Operating Supply Voltage | 1.2 V | RAM Size | 45 kB |
Speed Grade | 4 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S400A-4FGG400C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3S400A-4FGG676C
Brands :
Package :
Description :
Part Number : XC3S400A-4FGG484C
Brands :
Package :
Description :
Part Number : XC3S400A-4FGG320C
Brands :
Package : BGA-320
Description : Extended Spartan-3A FPGAs, Package: 4FGG320C
Part Number : XC3S400A-4FGG900C
Brands :
Package :
Description :
Part Number : XC3S400A-4FGG256C
Brands :
Package :
Description :
Part points
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The XC3S400A-4FGG400C chip is a Field Programmable Gate Array (FPGA) integrated circuit. It belongs to the Spartan-3A FPGA family and has 400,000 system gates. This chip features 400 I/O pins and offers high-performance logic capabilities. With its flexible configuration and programmability, it can be used in various applications such as industrial control, telecommunications, and consumer electronics.
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Equivalent
The equivalent products of the XC3S400A-4FGG400C chip are XC3S400-4FGG400C, XC3S400A-4FG676C, and XC3S400A-4FGG400I. -
Features
The XC3S400A-4FGG400C is a field-programmable gate array (FPGA) with 400K logic cells and a maximum of 436 I/O pins. It operates at a speed grade of -4, has 4000 slices, and supports various communication protocols. It offers a low-power design and is suitable for various applications including telecommunications, automotive, and consumer electronics. -
Pinout
The XC3S400A-4FGG400C is a Field-Programmable Gate Array (FPGA) with a pin count of 400. It is used for digital circuitry applications, providing flexible and reconfigurable processing capabilities. The specific functions of each pin depend on the input/output configuration programmed onto the FPGA. -
Manufacturer
The manufacturer of the XC3S400A-4FGG400C is Xilinx Inc. It is a semiconductor company that specializes in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs). Xilinx offers a wide range of FPGA products and solutions for various industries such as aerospace, automotive, telecommunications, and more. -
Application Field
The XC3S400A-4FGG400C is an FPGA (Field-Programmable Gate Array) device used for digital logic implementations. Its application areas include prototyping and development of digital systems, signal processing, communication systems, industrial automation, and various embedded applications. -
Package
The XC3S400A-4FGG400C chip has a package type of Ball Grid Array (BGA), a form of surface mount technology. It has a size of 400 balls (20x20) on a 1 mm pitch in a 17x17 mm grid array, making it small and compact for integration into electronic devices.
Datasheet PDF
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