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Xilinx XC3S400A-4FGG400C 48HRS

Spartan®-3A Field Programmable Gate Array (FPGA) IC 311 368640 8064 400-BGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S400A-4FGG400C

Datasheet: XC3S400A-4FGG400C Datasheet (PDF)

Package/Case: FBGA-400

RoHS Status:

Stock Condition: 2,644 pcs, New Original

Product Type: FPGAs (Field Programmable Gate Array)

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $35.521 $35.521
3 $35.210 $105.630
30 $33.657 $1009.710

In Stock: 2,644 PCS

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Quick Quote

Please submit RFQ for XC3S400A-4FGG400C or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S400A-4FGG400C General Description

The FPGA XC3S400A-4FGG400C is a powerful device from the Spartan-3A family, with a total of 896 logic blocks and 400,000 gates to handle complex processing tasks. With 8064 macrocells and 368,640 RAM bits, this FPGA offers ample resources for demanding applications. It features 311 I/Os for versatile connectivity and a core supply voltage range of 1.14V to 1.26V, along with a 3.3V I/O supply voltage

xc3s400a-4fgg400c

Features

  • Number of Logic Cells: 400,000
  • Number of I/Os: 238
  • FPGA Family: Spartan-3A
  • Package Type: FBGA
  • Package Size: 21mm x 21mm
  • Operating Temperature Range: -40°C to +100°C

Application

  • High-speed data processing and manipulation
  • Digital signal processing (DSP) and filtering
  • Protocol bridging and conversion
  • Encryption and decryption
  • System control and management
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Case/Package BGA Mount Surface Mount
Number of Pins 400 Max Operating Temperature 85 °C
Max Supply Voltage 1.26 V Min Operating Temperature 0 °C
Min Supply Voltage 1.14 V Number of Gates 400000
Number of I/Os 311 Number of Logic Blocks (LABs) 896
Number of Logic Elements/Cells 8064 Number of Macrocells 8064
Operating Supply Voltage 1.2 V RAM Size 45 kB
Speed Grade 4

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S400A-4FGG400C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC3S400A-4FGG676C

Brands :  

Package :  

Description :  

Part Number :   XC3S400A-4FGG484C

Brands :  

Package :  

Description :  

Part Number :   XC3S400A-4FGG320C

Brands :  

Package :   BGA-320

Description :   Extended Spartan-3A FPGAs, Package: 4FGG320C

Part Number :   XC3S400A-4FGG900C

Brands :  

Package :  

Description :  

Part Number :   XC3S400A-4FGG256C

Brands :  

Package :  

Description :  

Part points

  • The XC3S400A-4FGG400C chip is a Field Programmable Gate Array (FPGA) integrated circuit. It belongs to the Spartan-3A FPGA family and has 400,000 system gates. This chip features 400 I/O pins and offers high-performance logic capabilities. With its flexible configuration and programmability, it can be used in various applications such as industrial control, telecommunications, and consumer electronics.
  • Equivalent

    The equivalent products of the XC3S400A-4FGG400C chip are XC3S400-4FGG400C, XC3S400A-4FG676C, and XC3S400A-4FGG400I.
  • Features

    The XC3S400A-4FGG400C is a field-programmable gate array (FPGA) with 400K logic cells and a maximum of 436 I/O pins. It operates at a speed grade of -4, has 4000 slices, and supports various communication protocols. It offers a low-power design and is suitable for various applications including telecommunications, automotive, and consumer electronics.
  • Pinout

    The XC3S400A-4FGG400C is a Field-Programmable Gate Array (FPGA) with a pin count of 400. It is used for digital circuitry applications, providing flexible and reconfigurable processing capabilities. The specific functions of each pin depend on the input/output configuration programmed onto the FPGA.
  • Manufacturer

    The manufacturer of the XC3S400A-4FGG400C is Xilinx Inc. It is a semiconductor company that specializes in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs). Xilinx offers a wide range of FPGA products and solutions for various industries such as aerospace, automotive, telecommunications, and more.
  • Application Field

    The XC3S400A-4FGG400C is an FPGA (Field-Programmable Gate Array) device used for digital logic implementations. Its application areas include prototyping and development of digital systems, signal processing, communication systems, industrial automation, and various embedded applications.
  • Package

    The XC3S400A-4FGG400C chip has a package type of Ball Grid Array (BGA), a form of surface mount technology. It has a size of 400 balls (20x20) on a 1 mm pitch in a 17x17 mm grid array, making it small and compact for integration into electronic devices.

Datasheet PDF

Preliminary Specification XC3S400A-4FGG400C PDF Download

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