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Xilinx XC3S500E-4FT256C
2V, 256-Pin FTBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S500E-4FT256C
Datasheet: XC3S500E-4FT256C Datasheet (PDF)
Package/Case: BGA256
RoHS Status:
Stock Condition: 2,708 pcs, New Original
Product Type: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $350.310 | $350.310 |
| 180 | $139.775 | $25159.500 |
| 540 | $135.106 | $72957.240 |
| 990 | $132.798 | $131470.020 |
In Stock: 2,708 PCS
XC3S500E-4FT256C General Description
A cutting-edge offering from Xilinx, the XC3S500E-4FT256C FPGA is a standout choice for digital system implementation. With a robust 500,000 system gates and 14,856 logic cells, this FPGA delivers top-tier performance for complex applications. Operating at a maximum frequency of 350 MHz, it ensures swift execution of tasks in digital designs. Boasting 534 user I/Os, the device offers extensive connectivity options for versatile applications. Its 36,192 bits of block RAM, configurable as single-port or dual-port memory, provide efficient data storage capabilities. The FPGA also features 16 DSP slices, catering to high-speed signal processing requirements. Housed in a compact 256-pin FBGA package, the XC3S500E-4FT256C is a space-efficient solution for design projects with size constraints. Equipped with clock management resources, digital clock managers, and phase-locked loops, the FPGA enables seamless clock distribution and synchronization, ensuring optimal system performance
Features
- 500,000 system gates
- 28,800 logic cells
- 576 Kb block RAM
- 72 DSP slices
- 500 MHz maximum frequency
- 1.2V core voltage
- 2.5V or 3.3V I/O voltage
- 256-pin Fine-Pitch Ball Grid Array (FBGA) package
Application
- Digital signal processing (DSP)
- Image processing and video applications
- Industrial control and automation
- High-performance computing and networking
- Aerospace and defense applications
- Test and measurement equipment
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
| Series: | XC3S500E | Number of Logic Elements: | 10476 LE |
| Adaptive Logic Modules - ALMs: | 4656 ALM | Embedded Memory: | 360 kbit |
| Number of I/Os: | 190 I/O | Supply Voltage - Min: | 1.14 V |
| Supply Voltage - Max: | 1.26 V | Minimum Operating Temperature: | 0 C |
| Maximum Operating Temperature: | + 85 C | Data Rate: | - |
| Number of Transceivers: | - | Mounting Style: | SMD/SMT |
| Package / Case: | FBGA-256 | Brand: | Xilinx |
| Distributed RAM: | 73 kbit | Embedded Block RAM - EBR: | 360 kbit |
| Maximum Operating Frequency: | 300 MHz | Moisture Sensitive: | Yes |
| Number of Gates: | 500000 | Operating Supply Voltage: | 1.2 V |
| Product Type: | FPGA - Field Programmable Gate Array | Factory Pack Quantity: | 1 |
| Subcategory: | Programmable Logic ICs |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S500E-4FT256C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3S500E-4FG320C
Brands :
Package : BGA-320
Description : 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V
Part Number : XC3S500E-4VQG100C
Brands :
Package : QFP-100
Description : FPGA Spartan®-3E Family 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V
Part Number : XC3S500E-4FTG256I
Brands :
Package : BGA-256
Description : 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V
Part Number : XC3S500E-4PQG208C
Brands :
Package : QFP-208
Description : FPGA Spartan-3E Family 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V
Part Number : XC3S500E-4VQG100I
Brands :
Package : VQFP-100
Description : FPGA Spartan®-3E Family 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V
Part Number : XC3S500E-4FTG256C
Brands :
Package : BGA-256
Description : Spartan®-3E Family 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V
Part points
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The XC3S500E-4FT256C is a field-programmable gate array (FPGA) chip developed by Xilinx. It belongs to the Spartan-3E family and offers 500,000 system gates. The chip features various configurable logic blocks, versatile I/O capabilities, and on-chip resources such as RAM and DSP slices. It is suitable for numerous applications, including digital signal processing, telecommunications, and embedded systems.
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Features
The XC3S500E-4FT256C is a Field-Programmable Gate Array (FPGA) with 500,000 system gates. It operates with a 4-input lookup table architecture, providing flexible and programmable logic capabilities. It has a 256-pin fine-pitch Ball Grid Array (BGA) package, making it suitable for high-density designs. -
Pinout
The XC3S500E-4FT256C is a Field-Programmable Gate Array (FPGA) chip. It has 256 pins and can handle up to 500,000 logical gates. It is part of the Spartan-3E family, and the -4FT256C variant specifically indicates a speed grade of -4 for high performance and a 256-ball Fine-pitch Ball Grid Array (FBGA) package. -
Manufacturer
The manufacturer of the XC3S500E-4FT256C is Xilinx. Xilinx is a semiconductor manufacturing company that designs and develops field-programmable gate array (FPGA) and programmable logic device (PLD) technology. They provide solutions for a variety of industries including automotive, aerospace, telecommunications, and data centers. -
Application Field
The XC3S500E-4FT256C is a field-programmable gate array (FPGA) that can be used in a variety of applications. Some common application areas include digital signal processing, automotive electronics, industrial automation, telecommunications, and embedded systems. Its flexibility and programmability make it suitable for a wide range of applications where real-time processing, high-speed data transfer, and customization are required. -
Package
The XC3S500E-4FT256C chip has a 256-pin Fine-pitch Ball Grid Array (FBGA) package type, a size of 17 mm x 17 mm, and is in a long thin shape.
Datasheet PDF
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