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$5000Xilinx XC3S700A-4FG484I
Spartan®-3A Field Programmable Gate Array (FPGA) IC 372 368640 13248 484-BBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S700A-4FG484I
Datasheet: XC3S700A-4FG484I Datasheet (PDF)
Package/Case: BGA-484
RoHS Status:
Stock Condition: 3,002 pcs, New Original
Product Type: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $179.908 | $179.908 |
200 | $69.622 | $13924.400 |
500 | $67.176 | $33588.000 |
1000 | $65.967 | $65967.000 |
In Stock: 3,002 PCS
XC3S700A-4FG484I General Description
Spartan®-3A Field Programmable Gate Array (FPGA) IC 372 368640 13248 484-BBGA
Features
- 700K System Gates (logic cells)
- 48336 logic cells
- 8640 slices (each slice contains four 6-input LUTs and 8 flip-flops)
- 600MHz maximum frequency
- 4 input PLLs (Phase Locked Loops)
- 90nm CMOS process technology
- 1.2V core voltage, 2.5V or 3.3V I/O voltage
- 484-pin Fine-Pitch Ball Grid Array (FBGA) package
Application
- Digital signal processing (DSP)
- Communications systems
- High-performance computing
- Industrial automation
- Automotive systems
- Medical devices
- Aerospace and defense systems
- Consumer electronics
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
Series: | XC3S700A | Number of Logic Elements: | 13248 LE |
Adaptive Logic Modules - ALMs: | 5888 ALM | Embedded Memory: | 360 kbit |
Number of I/Os: | 372 I/O | Supply Voltage - Min: | 1.14 V |
Supply Voltage - Max: | 1.26 V | Minimum Operating Temperature: | - 40 C |
Maximum Operating Temperature: | + 100 C | Data Rate: | - |
Number of Transceivers: | - | Mounting Style: | SMD/SMT |
Package / Case: | FCBGA-484 | Brand: | Xilinx |
Distributed RAM: | 92 kbit | Embedded Block RAM - EBR: | 360 kbit |
Moisture Sensitive: | Yes | Number of Gates: | 700000 |
Operating Supply Voltage: | 1 V | Product Type: | FPGA - Field Programmable Gate Array |
Factory Pack Quantity: | 1 | Subcategory: | Programmable Logic ICs |
Tradename: | Spartan |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S700A-4FG484I component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3S700A-4FTG256C
Brands :
Package : 256-FTBGA
Description : Extended Spartan-3A FPGAs, Package: 4FTG256C
Part Number : XC3S700A-4FTG484C
Brands :
Package :
Description :
Part Number : XC3S700A-4FTG676C
Brands :
Package :
Description :
Part Number : XC3S700A-4FGG484C
Brands :
Package : FBGA484
Description : Extended Spartan-3A FPGAs, Package: 4FGG484C
Part Number : XC3S700A-4FGG676C
Brands :
Package :
Description :
Part Number : XC3S700A-4FGG900C
Brands :
Package :
Description :
Part Number : XC3S700A-4FGG1156C
Brands :
Package :
Description :
Part points
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The XC3S700A-4FG484I chip is an FPGA (Field-Programmable Gate Array) produced by Xilinx. It belongs to the Spartan-3A family and has 700,000 system gates. It features 484 pins in a fine-pitch ball grid array package (FG484). This chip offers programmable logic resources and can be configured to perform a variety of functions. The XC3S700A-4FG484I chip provides flexibility and high-performance capabilities for a wide range of applications.
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Features
The XC3S700A-4FG484I is a field-programmable gate array (FPGA) with 700,000 system gates, 678 logic cells, and 12,096 logic slices. It operates at a maximum speed of 267 MHz and offers various I/O options and functionality for flexible and high-performance designs. -
Pinout
The XC3S700A-4FG484I is a Field Programmable Gate Array (FPGA) with a pin count of 484. It is commonly used in industrial applications and has various I/O capabilities for data communication and control purposes. -
Manufacturer
Xilinx Inc. is the manufacturer of the XC3S700A-4FG484I. It is an American technology company specializing in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs). -
Application Field
The XC3S700A-4FG484I is a field-programmable gate array (FPGA) suitable for a wide range of applications including telecommunications, automotive, industrial control, and consumer electronics. It offers high integration, flexibility, and performance, making it suitable for various tasks such as digital signal processing, image and video processing, and hardware acceleration. -
Package
The XC3S700A-4FG484I chip has a Fine-Pitch Ball Grid Array (FG484) package type, 484-ball grid, and integrated circuit form. The package size for this chip is typically 23 mm x 23 mm.
Datasheet PDF
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