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Xilinx XC3S700AN-5FGG484C

Programmable Logic Device (CPLDs/FPGAs) ROHS FBGA-484 XC3S700AN-5FGG484C

ISO14001 ISO9001 DUNS

Brands: Xilinx

Mfr.Part #: XC3S700AN-5FGG484C

Datasheet: XC3S700AN-5FGG484C Datasheet (PDF)

Package/Case: FCBGA-484

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 2,250 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XC3S700AN-5FGG484C or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S700AN-5FGG484C General Description

Spartan®-3AN Field Programmable Gate Array (FPGA) IC 372 368640 13248 484-BBGA

xc3s700an-5fgg484c

Features

  • It has a capacity of 700,000 system gates.
  • It operates at a maximum frequency of 450 MHz.
  • It has 768 input/output pins.
  • It has 18.2 Mb of internal memory.
  • It supports various communication protocols such as Ethernet, PCI Express, USB, and others.
  • It has on-chip power management capabilities.

Application

  • Digital signal processing (DSP)
  • High-performance computing (HPC)
  • Aerospace and defense systems
  • Wired and wireless communications
  • Industrial automation and control
  • Video and image processing
  • Medical equipment
Xilinx Inventory

Specifications

Parameter Value Parameter Value
Product Category FPGA - Field Programmable Gate Array RoHS Details
Series XC3S700AN Number of Logic Elements 13248 LE
Adaptive Logic Modules - ALMs 5888 ALM Embedded Memory 360 kbit
Number of I/Os 372 I/O Supply Voltage - Min 1.14 V
Supply Voltage - Max 1.26 V Minimum Operating Temperature 0 C
Maximum Operating Temperature + 85 C Mounting Style SMD/SMT
Package / Case FCBGA-484 Brand Xilinx
Distributed RAM 176 kbit Embedded Block RAM - EBR 576 kbit
Maximum Operating Frequency 280 MHz Moisture Sensitive Yes
Number of Gates 1400000 Operating Supply Voltage 1 V
Product Type FPGA - Field Programmable Gate Array Factory Pack Quantity 1
Subcategory Programmable Logic ICs Tradename Spartan
Unit Weight 0.441145 oz

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC3S700AN-5FGG484C is an FPGA (Field-Programmable Gate Array) chip from Xilinx. It belongs to the Spartan-3AN family and has 700,000 system gates. The chip is designed for low-cost applications and offers various features such as extensive I/O support, memory resources, and high-performance DSP blocks. It can be programmed to perform a wide range of tasks and is suitable for applications in various industries including telecommunications, automotive, and industrial control.
  • Equivalent

    The equivalent products of the XC3S700AN-5FGG484C chip are XC3S700AN-4FGG484C, XC3S700AN-5FG484C, and XC3S700AN-4FG484C.
  • Features

    The XC3S700AN-5FGG484C is a Spartan-3AN FPGA from Xilinx. It consists of 700,000 system gates, 854 logic cells, and 1,536 memory blocks. It operates at a maximum frequency of 500 MHz and has 122 I/O pins. Additionally, it supports various communication protocols, such as UART, SPI, and I2C, making it suitable for a wide range of applications.
  • Pinout

    The XC3S700AN-5FGG484C is a field-programmable gate array (FPGA) with 484 pins. It is part of the Spartan-3AN family from Xilinx. This specific FPGA has 700,000 system gates and 472 user I/O pins. The function of the pins will depend on the design and configuration implemented by the user.
  • Manufacturer

    Xilinx is the manufacturer of the XC3S700AN-5FGG484C. It is a leading semiconductor company that specializes in the development and manufacturing of programmable logic devices and associated technologies.
  • Application Field

    The XC3S700AN-5FGG484C is an FPGA (Field-Programmable Gate Array) device that can be used in various application areas such as telecommunications, automotive, industrial automation, aerospace, and defense. Its flexibility and programmability make it suitable for a wide range of applications that require high-performance digital processing and customization capabilities.

Datasheet PDF

Preliminary Specification XC3S700AN-5FGG484C PDF Download

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