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$5000Xilinx XC7VX690T-2FFG1157C
CPLD/FPGA XC7VX690T-2FFG1157C
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Brands: AMD Xilinx, Inc
Mfr.Part #: XC7VX690T-2FFG1157C
Datasheet: XC7VX690T-2FFG1157C Datasheet (PDF)
Package/Case: FCBGA-1157
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 2,836 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC7VX690T-2FFG1157C General Description
The cutting-edge XC7VX690T-2FFG1157C FPGA is a game-changer in the field of field-programmable gate arrays, offering unparalleled performance and scalability. Built on a 28nm process technology, this FPGA is equipped with a total of 693,120 logic cells and 1760 DSP slices, making it a powerhouse for complex signal processing tasks. With 85 Mbits of internal memory and 32.4 Gbps transceivers, the XC7VX690T-2FFG1157C is designed to handle high-speed communication applications with ease. Whether you're working on telecommunications, aerospace, defense, or industrial automation projects, this FPGA is sure to meet your needs for performance and flexibility
Features
IC FPGA 600 I/O 1157FCBGAIC FPGA 600 I/O 1157FCBGA![AMD Xilinx, Inc Inventory AMD Xilinx, Inc Inventory](/files/uploads/inventory/xilinx/xilinx.jpg)
Specifications
Parameter | Value | Parameter | Value |
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Pbfree Code | Yes | Rohs Code | Yes |
Part Life Cycle Code | Transferred | Ihs Manufacturer | XILINX INC |
Part Package Code | BGA | Package Description | FBGA-1157 |
Pin Count | 1157 | Reach Compliance Code | not_compliant |
ECCN Code | 3A991.D | HTS Code | 8542.39.00.01 |
Samacsys Manufacturer | XILINX | Clock Frequency-Max | 1818 MHz |
Combinatorial Delay of a CLB-Max | 0.61 ns | JESD-30 Code | S-PBGA-B1157 |
JESD-609 Code | e1 | Length | 35 mm |
Number of CLBs | 54150 | Number of Inputs | 600 |
Number of Logic Cells | 693120 | Number of Outputs | 600 |
Number of Terminals | 1157 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | Organization | 54150 CLBS | |
Package Body Material | PLASTIC/EPOXY | Package Code | BGA |
Package Equivalence Code | BGA1156,34X34,40 | Package Shape | SQUARE |
Package Style | GRID ARRAY | Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Qualification Status | Not Qualified | Seated Height-Max | 3.35 mm |
Supply Voltage-Max | 1.03 V | Supply Voltage-Min | 0.97 V |
Supply Voltage-Nom | 1 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | OTHER |
Terminal Finish | TIN SILVER COPPER | Terminal Form | BALL |
Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
Width | 35 mm |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7VX690T-2FFG1157C is a high-performance field-programmable gate array (FPGA) chip from Xilinx. It features 690,000 logic cells, advanced DSP capabilities, and high-speed connectivity options. The chip is designed for applications requiring high processing power, such as telecommunications, networking, and aerospace systems.
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Equivalent
Some equivalent products of the XC7VX690T-2FFG1157C chip include: 1. Xilinx Virtex-7 XC7VX690T-2FFG1927C 2. Xilinx Virtex-7 XC7VX485T-2FFG1157C 3. Xilinx Virtex-7 XC7VX690T-2FFG1927I 4. Xilinx Virtex-7 XC7VX485T-2FFG1157I -
Features
XC7VX690T-2FFG1157C is a high-performance field-programmable gate array (FPGA) from Xilinx. It features high-speed connectivity with 2160 I/Os, 1.2 million logic cells, 141 mb of internal memory, and six integrated memory controllers. It also offers advanced features such as dynamic power management and enhanced security capabilities. -
Pinout
XC7VX690T-2FFG1157C is a FPGA from Xilinx with 1157 pins. It features a high-density design, up to 690K logic cells, and 1660 DSP slices. It offers advanced capabilities for applications requiring high performance, such as wireless communications, aerospace, and defense. -
Manufacturer
The manufacturer of XC7VX690T-2FFG1157C is Xilinx, Inc. Xilinx is an American technology company that specializes in designing and manufacturing programmable logic devices and related software development tools. They are known for their FPGA (Field-Programmable Gate Array) products used in a variety of industries such as automotive, telecommunications, aerospace, and defense. -
Application Field
The XC7VX690T-2FFG1157C is a high-performance FPGA commonly used in applications such as aerospace and defense, automotive, telecommunications, and data center networking. Its advanced features and capabilities make it suitable for demanding applications requiring high processing power, flexibility, and reliability. -
Package
The XC7VX690T-2FFG1157C chip is packaged in a flip-chip ball grid array (BGA) format with a size of 1157-balls. The chip has a package form factor of FF (1157-pin FBGA) and a size of 45 x 45 mm.
Datasheet PDF
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