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$5000Xilinx XCKU11P-2FFVA1156I
Advanced customizable integrated circuit
Brands: AMD Xilinx, Inc
Mfr.Part #: XCKU11P-2FFVA1156I
Datasheet: XCKU11P-2FFVA1156I Datasheet (PDF)
Package/Case: FCBGA-1156
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 3,370 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XCKU11P-2FFVA1156I General Description
The XCKU11P-2FFVA1156I is an impressive FPGA from the Xilinx Kintex UltraScale family, boasting 11 million logic cells that cater to the complex needs of industries like aerospace, defense, automotive, and telecommunications. Operating at a maximum speed of 650 MHz, this FPGA delivers exceptional processing power, making it suitable for demanding applications. With 2.7 Mb of internal memory, efficient data storage and manipulation is achieved within the FPGA, while its 528 I/O pins ensure seamless integration with other components and systems. Housed in a 1156-pin flip-chip ball grid array (FCBG) package, installation on PCBs is a breeze, and reliable electrical connections are ensured. Moreover, the XCKU11P-2FFVA1156I offers various configurable options, including voltage levels and I/O standards, providing flexible customization to suit specific project requirements
Features
FPGA - Field Programmable Gate Array XCKU11P-2FFVA1156IFPGA - Field Programmable Gate Array XCKU11P-2FFVA1156I
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
| RoHS: | Details | Series: | XCKU11P |
| Number of Logic Elements: | 653100 LE | Adaptive Logic Modules - ALMs: | 37320 ALM |
| Embedded Memory: | 21.1 Mbit | Number of I/Os: | 492 I/O |
| Supply Voltage - Min: | 850 mV | Supply Voltage - Max: | 850 mV |
| Minimum Operating Temperature: | - 40 C | Maximum Operating Temperature: | + 100 C |
| Data Rate: | 32.75 Gb/s | Number of Transceivers: | 52 Transceiver |
| Mounting Style: | SMD/SMT | Package / Case: | FCBGA-1156 |
| Brand: | Xilinx | Distributed RAM: | 9.1 Mbit |
| Embedded Block RAM - EBR: | 21.1 Mbit | Moisture Sensitive: | Yes |
| Number of Logic Array Blocks - LABs: | 37320 LAB | Operating Supply Voltage: | 850 mV |
| Product Type: | FPGA - Field Programmable Gate Array | Factory Pack Quantity: | 1 |
| Subcategory: | Programmable Logic ICs | Tradename: | Kintex UltraScale+ |
| Series | Kintex® UltraScale+™ | Package | Tray |
| Product Status | Active | Programmabe | Not Verified |
| Number of LABs/CLBs | 37320 | Number of Logic Elements/Cells | 653100 |
| Total RAM Bits | 53964800 | Number of I/O | 464 |
| Voltage - Supply | 0.825V ~ 0.876V | Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XCKU11P-2FFVA1156I is a high-performance field-programmable gate array (FPGA) chip from Xilinx. It features a Xilinx UltraScale+ architecture, offering a wide range of digital signal processing (DSP) capabilities, as well as high-speed connectivity options. This chip is ideal for applications requiring high-performance processing, such as in telecommunication, automotive, or aerospace industries.
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Equivalent
The equivalent products of XCKU11P-2FFVA1156I chip are XCKU11P-1FFVA1156I, XCKU11P-2FFVB1156I, and XCKU11P-1FFVB1156I. These chips belong to the Xilinx Kintex UltraScale FPGA family and have similar features and capabilities to the XCKU11P-2FFVA1156I chip. -
Features
The XCKU11P-2FFVA1156I is a part of the Xilinx Kintex UltraScale+ FPGA family. It features 1156K logic cells, 197M flip-flops, and 53Mb of block RAM. It also supports to 161 I/O pins and has a maximum operating frequency of 862 MHz. This offers high performance and flexibility for various applications such as communications, industrial control, and aerospace systems. -
Pinout
The XCKU11P-2FFVA1156I is a Xilinx Kintex UltraScale FPGA with 1156 pins. It has a variety of functions including programmable logic, memory, digital signal processing, and implementation of custom functions. -
Manufacturer
XCKU11P-2FFVA1156I is manufactured by Xilinx Inc. Xilinx is a multinational technology company specializing in programmable logic devices and associated technologies. are known for their field-programmable gate arrays (FPGAs) and adaptive acceleration platforms (ACAPs). Xilinx serves various industries such as automotive, aerospace, telecommunications, and data centers. -
Application Field
The XCKU11P-2FFVA1156I is a Field Programmable Gate Array (FPGA) that be used in various application areas such as aerospace and defense, telecommunications, industrial automation, and imaging. It offers high-speed processing, low latency, and programmable logic flexibility to the specific requirements of these industries. -
Package
The XCKU11P-2FFVA1156I chip comes in a flip-chip package, with a ball grid array (BGA) form and a size of 1156 pins.
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