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Xilinx XCS10-3VQ100C

5V 100-Pin VTQFP Spartan FPGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XCS10-3VQ100C

Datasheet: XCS10-3VQ100C Datasheet (PDF)

Package/Case: QFP100

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 3,777 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XCS10-3VQ100C or email to us: Email: [email protected], we will contact you within 12 hours.

XCS10-3VQ100C General Description

When it comes to efficiency and reliability, the XCS10-3VQ100C stands out as a dependable and high-performing choice, capable of meeting the demands of modern electronic applications. Its 10,000 system gates, 192 macrocells, and 9,280 logic gates ensure that it can handle complex designs with ease, providing the necessary agility and processing power for your projects

xcs10-3vq100c

Features

  • Contains 10,000 logic cells for implementing complex digital circuits
  • Provides 4 input look-up tables (LUTs) per logic cell
  • Has 192 available I/O pins for interfacing with other digital components
  • Supports up to 250 MHz operating frequency
  • Offers a low power consumption and a small form factor

Application

  • Digital signal processing
  • Communication systems
  • Automotive systems
  • Industrial automation
  • Robotics
  • Video processing
  • Embedded systems
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Manufacturer Xilinx Inc. Product Category Embedded - FPGAs (Field Programmable Gate Array)
Series SpartanR Package-Case 100-TQFP
Operating-Temperature 0°C ~ 85°C (TJ) Mounting-Type Surface Mount
Voltage-Supply 4.75 V ~ 5.25 V Supplier-Device-Package 100-VQFP (14x14)
Number-of-Gates 10000 Number-of-I-O 77
Number-of-LABs-CLBs 196 Number-of-Logic-Elements-Cells 466
Total-RAM-Bits 6272 Tags XCS10-3VQ1, XCS10-3V, XCS10-3, XCS10, XCS1, XCS
Rohs Code No Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC Part Package Code QFP
Package Description PLASTIC, VQFP-100 Pin Count 100
Reach Compliance Code HTS Code 8542.39.00.01
Additional Feature MAXIMUM USABLE GATES 10000 Clock Frequency-Max 125 MHz
Combinatorial Delay of a CLB-Max 1.6 ns JESD-30 Code S-PQFP-G100
JESD-609 Code e0 Length 14 mm
Moisture Sensitivity Level 3 Number of CLBs 196
Number of Equivalent Gates 3000 Number of Inputs 112
Number of Logic Cells 196 Number of Outputs 112
Number of Terminals 100 Operating Temperature-Max 85 °C
Operating Temperature-Min Organization 196 CLBS, 3000 GATES
Package Body Material PLASTIC/EPOXY Package Code TFQFP
Package Equivalence Code TQFP100,.63SQ Package Shape SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH Peak Reflow Temperature (Cel) 240
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY Qualification Status Not Qualified
Seated Height-Max 1.2 mm Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V Supply Voltage-Nom 5 V
Surface Mount YES Technology CMOS
Temperature Grade OTHER Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING Terminal Pitch 0.5 mm
Terminal Position QUAD Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XCS10-3VQ100C chip is a programmable logic device that belongs to the Xilinx Spartan-3 family. It contains around 10,000 logic cells and can be used for various applications, including digital signal processing, telecommunications, and embedded systems. The chip offers high performance, low power consumption, and user-friendly development tools, making it a suitable choice for a wide range of projects.
  • Features

    The XCS10-3VQ100C features a compact size with 10,000 system gates, high-speed performance, and low power consumption. It also has 36 inputs and 18 outputs, making it suitable for various applications. Additionally, it offers on-chip configuration memory and various security features, making it ideal for use in safety critical systems.
  • Pinout

    The XCS10-3VQ100C has a pin count of 100. It is a microcontroller that is used for general-purpose applications and is part of the Spartan XCS family. It has various functions, including digital signal processing, data storage, and communication interfaces.
  • Manufacturer

    The XCS10-3VQ100C is manufactured by the company Xilinx. Xilinx is a leading provider of programmable logic devices and associated technologies, specializing in the development of field-programmable gate arrays (FPGAs) and related software tools.
  • Application Field

    The XCS10-3VQ100C is typically used in application areas such as industrial control, automotive systems, medical instruments, aerospace/defense, communication equipment, and consumer electronic devices. It offers high-performance FPGA capabilities with low power consumption and a small footprint, making it suitable for various embedded system designs.
  • Package

    The XCS10-3VQ100C chip is packaged in a QFP (Quad Flat Package) form with a size of 100 pins (100C).

Datasheet PDF

Preliminary Specification XCS10-3VQ100C PDF Download

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