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Xilinx XCS30-3VQ100C

144-pin TQFP integrated circuit FPGA with 113 I/O capabilities

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XCS30-3VQ100C

Datasheet: XCS30-3VQ100C Datasheet (PDF)

Package/Case: QFP100

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 3,679 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Please submit RFQ for XCS30-3VQ100C or email to us: Email: [email protected], we will contact you within 12 hours.

XCS30-3VQ100C General Description

Spartan® Field Programmable Gate Array (FPGA) IC 77 18432 1368 100-TQFP

Features

  • 30,000 logic cells: It has 30,000 configurable logic cells, which are the building blocks of the FPGA that can be programmed to implement various digital circuits or systems.
  • VQ100C package: It comes in a VQ100C package, which is a Quad Flat No-Lead (QFN) package with 100 pins.
  • 3V operation: It operates at a voltage of 3.3 volts (3V), which is a common voltage level for many digital systems.
  • High-performance: It has high-speed performance with a maximum operating frequency of up to several hundred megahertz (MHz) or even gigahertz (GHz), depending on the specific design and implementation.

Application

  • Embedded systems: It can be used in embedded systems, where programmable logic is required for custom functions or interfaces.
  • Communications: It can be used in communication systems for tasks such as protocol conversion, packet processing, and signal modulation/demodulation.
  • Industrial control: It can be used in industrial control systems for tasks such as motor control, sensor interfacing, and process control.
  • Video and image processing: It can be used in video and image processing applications for tasks such as video encoding/decoding, image recognition, and real-time image processing.
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Specifications

Parameter Value Parameter Value
Manufacturer XILINX Product Category Embedded - FPGAs (Field Programmable Gate Array)
Series SpartanR Package-Case 100-TQFP
Operating-Temperature 0°C ~ 85°C (TJ) Mounting-Type Surface Mount
Voltage-Supply 4.75 V ~ 5.25 V Supplier-Device-Package 100-VQFP (14x14)
Number-of-Gates 30000 Number-of-I-O 77
Number-of-LABs-CLBs 576 Number-of-Logic-Elements-Cells 1368
Total-RAM-Bits 18432

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XCS30-3VQ100C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XCS30-3VQ100T

Brands :  

Package :  

Description :   This is a similar model to XCS30-3VQ100C but with a different speed grade (T) indicating a slower operating frequency.

Part Number :   XCS30-3VQ100I

Brands :  

Package :   QFP100

Description :   Spartan and Spartan-XL Families Field Programmable Gate Arrays

Part Number :   XCS30-4VQ100C

Brands :  

Package :   100-TQFP

Description :   Spartan and Spartan-XL Families Field Programmable Gate Arrays

Part Number :   XCS30-4VQ100I

Brands :  

Package :   QFP100

Description :   Spartan and Spartan-XL Families Field Programmable Gate Arrays

Part points

  • The XCS30-3VQ100C chip is a field-programmable gate array (FPGA) developed by Xilinx. It is a versatile integrated circuit that can be configured to perform various digital functions. The chip offers 30,000 logic cells and operates at a voltage of 3.3V. It comes in a quad flat pack (QFP) package with 100 pins for easy integration into electronic systems.
  • Equivalent

    The equivalent products of the XCS30-3VQ100C chip are the XCS30-3TQ144C, XCS30-3VQ100I, XCS30-3VQ100M, XCS30-3VQ100T, XCS30-3VQ100TI, XCS30-3VQ100TM, and XCS30-3VQ100TOT.
  • Features

    The XCS30-3VQ100C is a field-programmable gate array (FPGA) with 30,000 logic cells, a 100-pin Quad Flat No-Lead (QFN) package, and operates on a 3.3V power supply. It offers programmable I/Os, multiple global and regional clocks, built-in memory, and high-speed internal and external connectivity options.
  • Pinout

    The XCS30-3VQ100C is a Field-Programmable Gate Array (FPGA) with a pin count of 100. It has various functions such as logic gates, flip-flops, and programmable I/O pins. The specific pin functions of this device can be found in the manufacturer's datasheet.
  • Manufacturer

    The XCS30-3VQ100C is manufactured by Xilinx, Inc. Xilinx is an American technology company specializing in the design, development, and production of programmable logic devices (PLDs) and related technologies. They are known for their field-programmable gate arrays (FPGAs) and are one of the leading companies in the semiconductor industry.
  • Application Field

    The XCS30-3VQ100C is an advanced programmable logic device (PLD) used in various applications including telecommunications, industrial automation, and automotive electronics. It offers high-speed performance, low power consumption, and a large number of input/output (I/O) pins, making it suitable for a wide range of digital system designs.
  • Package

    The XCS30-3VQ100C chip is packaged in a 100-pin PQFP (Plastic Quad Flat Pack) form, with a package size of 14mm x 14mm.

Datasheet PDF

Preliminary Specification XCS30-3VQ100C PDF Download

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